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Effect of strain rate in severe plastic deformation on microstructure refinement and stored energies

Published online by Cambridge University Press:  11 January 2011

Shashank Shekhar ,
Jiazhao Cai ,
Saurabh Basu ,
Sepideh Abolghasem  and
M. Ravi Shankar
Shashank Shekhar
Affiliation:
School of Engineering, University of Pittsburgh, Pittsburgh, Pennsylvania 15261
Jiazhao Cai
Affiliation:
School of Engineering, University of Pittsburgh, Pittsburgh, Pennsylvania 15261
Saurabh Basu
Affiliation:
School of Engineering, University of Pittsburgh, Pittsburgh, Pennsylvania 15261
Sepideh Abolghasem
Affiliation:
School of Engineering, University of Pittsburgh, Pittsburgh, Pennsylvania 15261
M. Ravi Shankar*
Affiliation:
School of Engineering, University of Pittsburgh, Pittsburgh, Pennsylvania 15261
*
a)Address all correspondence to this author. e-mail: ravishm@pitt.edu
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Abstract

The interplay of large strain and large strain rate during high-rate severe plastic deformation (HR-SPD) lead to dynamic temperature rise in situ that engenders a recovered microstructure whose characteristics are not just a function of the strain, but also of the strain rate and the coupled temperature rise during the deformation. In this work, we identify three classes of microstructures characterized by multistage recovery phenomena that take place during the high strain rate SPD of Cu. It is found that the first stage of this recovery is similar to the first stage of static recovery, which is characterized mainly by annihilation of dislocations. The second stage starts around 360 K and was characterized by dislocations getting arranged in tight cell boundaries and eventually into subgrain. Recovery stages were found to be followed by a stage of grain growth and recrystallization when the temperature in the deformation zone approaches 480 K.

Type
Articles
Information
Journal of Materials Research , Volume 26 , Issue 3 , 14 February 2011 , pp. 395 - 406
Copyright
Copyright © Materials Research Society 2011

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References

REFERENCES

1.Tellkamp, V.L., Melmed, A., and Lavernia, E.J.: Mechanical behavior and microstructure of a thermally stable bulk nanostructured Al alloy. Metall. Mater. Trans. A 32, 2335 (2001).CrossRefGoogle Scholar
2.Valiev, R.Z., Alexandrov, I.V., Zhu, Y.T., and Lowe, T.C.: Paradox of strength and ductility in metals processed by severe plastic deformation. J. Mater. Res. 17, 5 (2002).CrossRefGoogle Scholar
3.Tao, K., Choo, H., Li, H., Clausen, B., Jin, J., and Lee, Y.: Transformation-induced plasticity in an ultrafine-grained steel: An in situ neutron diffraction study. Appl. Phys. Lett. 90, 101911 (2007).CrossRefGoogle Scholar
4.Youngdahl, C.J., Weertman, J.R., Hugo, R.C., and Kung, H.H.: Deformation behavior in nanocrystalline copper. Scr. Mater. 44, 1475 (2001).Google Scholar
5.Humphreys, F.J. and Hatherly, M.: Recrystallization and Related Annealing Phenomena, 2nd ed. (Elsevier, Oxford, UK, 2004).Google Scholar
6.Humphreys, F.J.: A unified theory of recovery, recrystallization and grain growth, based on the stability and growth of cellular microstructures—I. The basic model. Acta Mater. 45, 4231 (1997).CrossRefGoogle Scholar
7.Carpenter, H.C.H. and Elam, C.F.: Crystal growth and recrystallization in metals. J. Inst. Met. 24, 83 (1920).Google Scholar
8.Alterthum, H.: The theory of recrystallization. Z. Metallkd. 14, 417 (1922).Google Scholar
9.Bever, M.B., Holt, D.L., and Titchener, A.L.: The stored energy of cold work. Prog. Mater. Sci. 17, 5 (1973).Google Scholar
10.Li, Y.S., Zhang, Y., Tao, N.R., and Lu, K.: Effect of the Zener–Hollomon parameter on the microstructures and mechanical properties of Cu subjected to plastic deformation. Acta Mater. 57, 761 (2009).CrossRefGoogle Scholar
11.Cai, J., Shekhar, S., Wang, J., and Shankar, M.R.: Nanotwinned microstructures from low stacking fault energy brass by high-rate severe plastic deformation. Scr. Mater. 60, 599 (2009).CrossRefGoogle Scholar
12.Shekhar, S., Cai, J., Wang, J., and Shankar, M.R.: Multimodal ultrafine grain size distributions from severe plastic deformation at high strain rates. Mater. Sci. Eng., A 527, 187 (2009).CrossRefGoogle Scholar
13.Gottstein, G. and Kocks, U.F.: Dynamic recrystallization and dynamic recovery in 〈111〉 single crystals of nickel and copper. Acta Metall. 31, 175 (1983).CrossRefGoogle Scholar
14.Hasegawa, T. and Kocks, U.F.: Thermal recovery processes in deformed aluminum. Acta Metall. 27, 1705 (1979).Google Scholar
15.Petkovic, R.A., Luton, M.J., and Jonas, J.J.: Recovery and recrystallization of polycrystalline copper after hot working. Acta Metall. 27, 1633 (1979).CrossRefGoogle Scholar
16.Sample, V.M., Fitzsimons, G.L., and DeArdo, A.J.: Dynamic softening of copper during deformation at high temperatures and strain rates. Acta Metall. 35, 367 (1987).CrossRefGoogle Scholar
17.Luton, M.J., Petkovic, R.A., and Jonas, J.J.: Kinetics of recovery and recrystallization in polycrystalline copper. Acta Metall. 28, 729 (1980).CrossRefGoogle Scholar
18.Gottstein, G., Zabardjadi, D., and Mecking, H.: Dynamic recrystallization of tension-deformed copper single crystals. Met. Sci. 18, 222 (1979).Google Scholar
19.Swaminathan, S., Ravi Shankar, M., Lee, S., Hwang, J., Rao, B.C., King, A.H., Chandrasekar, S., Compton, W.D., and Trumble, K.P.: Large strain deformation and ultra-fine grained materials by machining. Mater. Sci. Eng., A 410–411, 358 (2005).CrossRefGoogle Scholar
20.Uluca, Y., Ravi Shankar, M., Mann, J.B., Rao, B.C., Chandrasekar, S. and Dale Compton, W.: Nanocrystalline materials from aerospace machining chips. SAE Trans. 2005-01-3306, 994 (2005).Google Scholar
21.Sevier, M., Lee, S., Ravi Shankar, M., Yang, H.T.Y., Chandrasekar, S., and Compton, W.D.: Deformation mechanics associated with formation of ultra-fine grained chips in machining. Mater. Sci. Forum 503–504, 379 (2006).CrossRefGoogle Scholar
22.Lee, S., Hwang, J., Ravi Shankar, M., Chandrasekar, S., and Compton, W.D.: Large-strain deformation field in plane-strain machining. Metall. Mater. Trans. A 37, 1633 (2006).CrossRefGoogle Scholar
23.Murthy, T.G., Huang, C., Shankar, M.R., Chandrasekar, S., Trumble, K.P., and Sullivan, J.P.: Temperature field in severe plastic deformation at small strain rates. Mater. Sci. Forum 584–586, 231 (2008).CrossRefGoogle Scholar
24.Ravi Shankar, M., Rao, B.C., Lee, S., Chandrasekar, S., King, A.H., and Compton, W.D.: Severe plastic deformation (SPD) of titanium at near-ambient temperature. Acta Mater. 54(14), 3691 (2006).Google Scholar
25.Swaminathan, S., Ravi Shankar, M., Rao, B.C., King, A.H., Chandrasekar, S., Compton, W.D., and Trumble, K.P.: Large strain deformation and nanostructured materials by machining. J. Mater. Sci. 42, 1529 (2007).CrossRefGoogle Scholar
26.Childs, T., Maekawa, K., Obikawa, T., and Yamane, Y.: Metal Machining: Theory and Applications, 1st ed. (Arnold, London, UK, 2000; copublished by John Wiley &Sons, New York–Toronto).Google Scholar
27.Lee, S.: Direct measurements of severe plastic deformation in machining and equal channel angular pressing, Ph.D. Thesis, Purdue University, West Lafayette, IN, 2006.Google Scholar
28.Nang, G., Starink, M.J., and Langdon, T.G.: Using differential scanning calorimery as an analytical tool for ultrafine-grained metals processed by severe plastic deformation. Mater. Sci. Technol. 25, 687 (2009).Google Scholar
29.Johnson, G.R. and Cook, W.H.: A constitutive model and data for metals subjected to large strain rates and high temperatures, in Proceedings of the Seventh International Symposium on Ballistics (The Hague, The Netherlands, 1983), pp. 541–547.Google Scholar
30.Weiner, J.H.: Shear-plane temperature distribution in orthogonal cutting. Trans. ASME 77, 1331 (1955).Google Scholar
31.Jiang, H., Zhu, Y.T., Butt, D.P., Alexandrov, I.V., and Lowe, T.C.: Microstructural evolution, microhardness and thermal stability of HPT-processed Cu. Mater. Sci. Eng., A 290, 128 (2000).CrossRefGoogle Scholar
32.Han, K., Walsh, R.P., Ishmaku, A., Toplosky, V., Brandao, L., and Embury, J.D.: High strength and high electrical conductivity bulk Cu. Philos. Mag. 84, 3705 (2004).CrossRefGoogle Scholar
33.Li, Y.S., Zhang, Y., Tao, N.R., and Lu, K.: Effect of thermal annealing on mechanical properties of a nanostructured copper prepared by means of dynamic plastic deformation. Scr. Mater. 59, 475 (2008).CrossRefGoogle Scholar
34.Ma, E., Wang, Y.M., Lu, Q.H., Sui, M.L., Lu, L., and Lu, K.: Strain hardening and large tensile elongation in ultrahigh-strength nano-twinned copper. Appl. Phys. Lett. 85, 4932 (2004).CrossRefGoogle Scholar
35.Lu, L., Schwaiger, R., Shan, Z.W., Dao, M., Lu, K., and Suresh, S.: Nano-sized twins induce high rate sensitivity of flow stress in pure copper. Acta Mater. 53, 2169 (2005).CrossRefGoogle Scholar
36.Li, Y.S., Tao, N.R., and Lu, K.: Microstructural evolution and nanostructure formation in copper during dynamic plastic deformation at cryogenic temperatures. Acta Mater. 56, 230 (2008).CrossRefGoogle Scholar
37.Zhao, W.S., Tao, N.R., Guo, J.Y., Lu, Q.H., and Lu, K.: High density nano-scale twins in Cu induced by dynamic plastic deformation. Scr. Mater. 53, 745 (2005).CrossRefGoogle Scholar
38.Christian, J.W. and Mahajan, S.: Deformation twinning. Prog. Mater. Sci. 39, 1 (1995).CrossRefGoogle Scholar
39.Youngdahl, C.J., Weertman, J.R., Hugo, R.C., and Kung, H.H.: Deformation behavior in nanocrystalline copper. Scr. Mater. 44, 1475 (2001).CrossRefGoogle Scholar
40.Lu, L., Shen, Y.F., Chen, X.H., Qian, L.H., and Lu, K.: Ultrahigh strength and high electrical conductivity in copper. Science 304, 422 (2004).CrossRefGoogle ScholarPubMed
41.Meyers, M.A., Voehringer, O., and Chen, Y.J.: A constitutive description of the slip-twinning transition in metals, in Advances in Twinning, edited by Ankem, S. and Pande, C.S. (Minerals, Metals & Materials Society, Warrendale, PA, 1999), pp. 43–65.Google Scholar