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Effects of an Al2O3 capping layer on La2O3 deposited by remote plasma atomic layer deposition

Published online by Cambridge University Press:  31 January 2011

Hyungchul Kim
Affiliation:
Division of Materials Science and Engineering, Hanyang University, Seoul 133-791, Korea
Jaesang Lee
Affiliation:
Division of Nano-scale Semiconductor Engineering, Hanyang University, Seoul 133-791, Korea
Hyeongtag Jeon*
Affiliation:
Division of Materials Science and Engineering, Hanyang University, Seoul 133-791, Korea
*
a)Address all correspondence to this author. e-mail:hjeon@hanyang.ac.kr
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Abstract

The physical and electrical properties of La2O3 with and without an Al2O3 capping layer deposited by remote plasma atomic layer deposition were investigated. The electrical properties of the La2O3 films degraded due to the formation of lanthanum hydroxide after being exposed to air. The results of x-ray photoemission spectroscopy showed that the quantity of OH groups absorbed increased after exposure to air. For La2O3 with an Al2O3 capping layer, however, the electrical properties of the film did not change substantially because the capping layer effectively suppressed the formation of lanthanum hydroxide. The capacitance of the La2O3 decreased more than 30% after exposure to air, while La2O3 with an Al2O3 capping layer decreased by only about 4%. The VFB value of the La2O3 with an Al2O3 capping layer was near zero, and the hysteresis was about 120 mV. The leakage current densities of the film were maintained below 5 × 10−7 A/cm2 up to −15 MV/cm and the effective breakdown field was about −23.5 MV/cm.

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Articles
Copyright
Copyright © Materials Research Society 2010

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References

REFERENCES

1.Wilk, G.D., Wallace, R.M., Anthony, J.M.High-κ gate dielectrics: Current status and materials properties considerations. J. Appl. Phys. 89, 5243 (2001)CrossRefGoogle Scholar
2.Wong, H., Iwai, H.On the scaling issues and high-κ replacement of ultrathin gate dielectrics for nanoscale MOS transistors. Microelectron. Eng. 83, 1867 (2006)CrossRefGoogle Scholar
3.Gusev, E.P., Cartier, E., Buchanan, D.A., Gribelyuk, M., Copel, M., Okorn-Schmidt, H., D'Emic, C.Ultrathin high-K metal oxides on silicon: Processing, characterization and integration issues. Microelectron. Eng. 59, 341 (2001)CrossRefGoogle Scholar
4.Robertson, J.Band offsets of wide-band-gap oxides and implications for future electronic devices. J. Vac. Sci. Technol., B 18, 1785 (2000)CrossRefGoogle Scholar
5.Triyoso, D.H., Hegde, R.I., Grant, J., Fejes, P., Liu, R., Roan, D., Ramon, M., Tobin, P.Film properties of ALD HfO2 and La2O3 gate dielectrics grown on Si with various pre-deposition treatments. J. Vac. Sci. Technol., B 22, 2121 (2004)CrossRefGoogle Scholar
6.Nohira, H., Hattori, T.Hard and soft x-ray excited photoelectron spectroscopy study on high-k gate insulators Mishima, Japan Jan 20–Feb 18 2006Google Scholar
7.No, S.Y., Eom, D., Hwang, C.S., Kim, H.J.Properties of lanthanum oxide thin films deposited by cyclic chemical vapor deposition using tris(isopropyl-cyclopentadienyl)lanthanum precursor. J. Appl. Phys. 100, 024111 (2006)CrossRefGoogle Scholar
8.Zhao, Y., Toyama, M., Kita, K., Kyuno, K., Toriumi, A.Moisture-absorption-induced permittivity deterioration and surface roughness enhancement of lanthanum oxide films on silicon. Appl. Phys. Lett. 88, 72904 (2006)CrossRefGoogle Scholar
9.Jun, J.H., Choi, D.J.Effects of the wet air on the properties of the lanthanum oxide and lanthanum aluminate thin films. Thin Solid Films 504, 205 (2006)CrossRefGoogle Scholar
10.Lucovsky, G., Kim, S.S., Tsu, D.V., Fountain, G.G., Markunas, R.J.J. Vac. Sci. Technol., B 7, 861 (1989)CrossRefGoogle Scholar
11.De Asha, A.M., Critchley, J.T.S., Nix, R.M.Molecular adsorption characteristics of lanthanum oxide surfaces: The interaction of water with oxide overlayers grown on Cu(111). Surf. Sci. 405, 201 (1998)CrossRefGoogle Scholar
12.Klein, T.M., Niu, D., Epling, W.S., Li, W., Maher, D.M., Hobbs, C.C., Hedge, R.I., Baumvol, I.J.R., Parsons, G.N.Evidence of aluminum silicate formation during chemical vapor deposition of amorphous Al2O3 thin films on Si(100). Appl. Phys. Lett. 75, 4001 (1999)CrossRefGoogle Scholar
13.Li, A-D., Shao, Q-Y., Ling, H-Q., Cheng, J-B., Wu, D.W., Liu, Z-G., Ming, N-B., Wang, C., Zhou, H-W., Nguyen, B-Y.Characteristics of LaAlO3 gate dielectrics on Si grown by metalorganic chemical vapor deposition. Appl. Phys. Lett. 83, 17 (2003)CrossRefGoogle Scholar
14.Eastman, D.E.Photoelectric work functions of transition, rare-earth, and noble metals. Phys. Rev. B 2, 1 (1970)CrossRefGoogle Scholar
15.Michaelson, H.B.CRC Handbook of Chemistry and Physics edited by D.R. Lide and H.P.R. Frederikes (CRC Press, Boca Raton, FL 1996)12122Google Scholar
16.Schaeffer, J.K., Fonseca, L.R.C., Samavedam, S.B., Liang, Y., Tobin, P.J., White, B.E.Contributions to the effective work function of platinum on hafnium dioxide. Appl. Phys. Lett. 85, 1826 (2004)CrossRefGoogle Scholar
17.Eom, D., No, S.Y., Hwang, C.S., Kim, H.J.Properties of aluminum nitride thin films deposited by an alternate injection of trimethylaluminum and ammonia under ultraviolet radiation. J. Electrochem. Soc. 153, (4)C229 (2006)CrossRefGoogle Scholar
18.Kang, S-W., Rhee, S-W.Deposition of La2O3 films by direct liquid injection metallorganic chemical vapor deposition. J. Electrochem. Soc. 149, C345 (2002)CrossRefGoogle Scholar
19.Guha, S., Cartier, E., Gribelyuk, M.A., Bojarczuk, N.A., Capel, M.C.Atomic beam deposition of lanthanum- and yttrium-based oxide thin films for gate dielectrics. Appl. Phys. Lett. 77, 2710 (2000)CrossRefGoogle Scholar
20.Schroder, D.Semiconductor Material and Device Characterization (Wiley, New York 1998)337419Google Scholar
21.Lim, S.B., Rahtu, A., de Rouffignac, P., Gordon, R.G.Atomic layer deposition of lanthanum aluminum oxide nano-laminates for electrical applications. Appl. Phys. Lett. 84, (20)17 (2004)CrossRefGoogle Scholar