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Effects of Electroless Nickel Plating on Resistivity-temperature Characteristics of (Ba1-xPbx)TiO3thermistor

Published online by Cambridge University Press:  31 January 2011

Chen Wanping
Affiliation:
Department of Materials Science and Engineering, Tsinghua University, Beijing, 100084, China
Li Longtu
Affiliation:
Department of Materials Science and Engineering, Tsinghua University, Beijing, 100084, China
Gui Zhilun
Affiliation:
Department of Materials Science and Engineering, Tsinghua University, Beijing, 100084, China
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Abstract

Effects of electroless nickel plating on resistivity-temperature (R-T) characteristics of (Ba1-xPbx)TiO3 thermistor were studied. Comparison experiments showed that not only the permeation of plating solution, but also the reaction of electroless nickel plating influences the positive temperature coefficient (PTC) effect, and that the two effects are different in nature. It is first proposed in this paper that hydrogen atoms generated in electroless nickel plating may reduce components of PTC ceramics.

Type
Articles
Copyright
Copyright © Materials Research Society 1997

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References

1.Queau, E., Stremsdoerfer, G., Martin, J. R., and Clechet, P., Plating and Surface Finishing 81 (1), 65 (1994).Google Scholar
2.Meerakker, van den, J. Appl. Electrochem. 11, 395 (1981).CrossRefGoogle Scholar
3.Brenner, A. and Riddell, G. E., J. Res. Natl. Bur. Standards 37, 1 (1946).CrossRefGoogle Scholar
4.Lowenheim, F. A., Electroplating (McGraw-Hill, Inc., New York, 1978), p. 59.Google Scholar
5.Raub, C. J., Plating and Surface Finishing 80 (9), 3038 (1993).Google Scholar
6.Chan, N. H. and Smyth, D. M., J. Am. Ceram. Soc. 67, 285 (1984).CrossRefGoogle Scholar