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Effects of nitrogen flow rates on reactively sputtered nanocrystal-(Ti,Al)xN1-x/amorphous-SiyN1-y nanolaminate films

Published online by Cambridge University Press:  03 March 2011

Bao-Shun Yau
Affiliation:
Department of Materials Science and Engineering, National Cheng-Kung University, Tainan 701, Taiwan, Republic of China
Jow-Lay Huang*
Affiliation:
Department of Materials Science and Engineering, National Cheng-Kung University, Tainan 701, Taiwan, Republic of China
Ding-Fwu Lii
Affiliation:
Department of Electrical Engineering, Cheng Shiu University, Kaohsiung 833, Taiwan, Republic of China
*
a)Address all correspondence to this author. e-mail: JLH888@mail.ncku.edu.tw
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Abstract

Nanocrystal-(Ti,Al)xN1-x/amorphous-SiyN1-y nanolaminate films were deposited periodically under different nitrogen flow rates. The composition, microstructure and mechanical properties of nanolaminate films were investigated by x-ray photoelectron spectroscope, x-ray diffractometer, scanning and transmission electron microscopy, atomic force microscope, and nanoindentation apparatus. Results indicated that the formation of the compound on the target surface was substantially influenced by the deposition rate, composition and crystallite size of the nanolaminate films. Nanolaminate structure with periodic compositional modulation and sharp interfaces were deposited at different nitrogen flow rate. Smaller nanocrystallite size, round-shaped grain features, smoother surface morphology, higher hardness, and reduced elastic modulus were obtained for nanolaminate films with increasing the nitrogen flow rate.

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Articles
Copyright
Copyright © Materials Research Society 2004

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References

REFERENCES

1.Koehler, J.S.: Attempt to design a strong solid. Phys. Rev. B 2, 547 (1970).CrossRefGoogle Scholar
2.Vepřek, S. and Reiprich, S.: A concept for the design of novel superhard coatings. Thin Solid Films 268, 64 (1995).CrossRefGoogle Scholar
3.Vepřek, S.: New development in superhard coatings: The superhard nanocrystalline–amorphous composites. Thin Solid Films 317, 449 (1998).CrossRefGoogle Scholar
4.Bull, S.J. and Jones, A.M.: Multilayer coatings for improved performance. Surf. Coat. Technol. 78, 173 (1996).CrossRefGoogle Scholar
5.Shih, K.K. and Dove, D.B.: Ti/TiN, HfN/Hf-N and W/WN x multilayer films with high mechanical hardness Appl. Phys. Lett. 61, 654 (1992).CrossRefGoogle Scholar
6.Xu, J-H., Gu, M-Y., Li, G-Y. and Jin, Y-P.: Microstructures and properties of Si3N4/Tin ceramic nano-multilayer films. Trans. Nonferrous Met. Soc. China 9, 764 (1999).Google Scholar
7.Soe, W-H. and Yamamoto, R.: Mechanical properties of ceramic multilayers: TiN/CrN, TiN/ZrN, and TiN/TaN. Mater. Chem. Phys. 50, 176 (1997).CrossRefGoogle Scholar
8.Helmersson, U., Todorova, S., Barnett, S.A. and Sundgen, J-E.: Growth of single-crystal Ti N/VN strained-layer superlattices with extremely high mechanical hardness. J. Appl. Phys. 62, 481 (1987).CrossRefGoogle Scholar
9.Wu, T.B.: Effect of screening singularities on the elastic constants of composition-modulated alloys. J. Appl. Phys. 53, 5265 (1982).CrossRefGoogle Scholar
10.Qian, F., Temmel, G., Schnupp, R. and Ryssel, H.: Thin stoichiometric silicon nitride prepared by r.f. reactive sputtering. Microelectronics Reliability 39, 317 (1999).CrossRefGoogle Scholar
11.Ohring, M.The Materials Science of Thin Films (Academic Press, San Diego, CA, 1992), pp. 111, 113.Google Scholar
12.Habib, S.K., Rizk, A. and Mousa, I.A.: Physical parameters affecting deposition rates of binary alloys in a magnetron sputtering system. Vacuum 49, 153 (1998).CrossRefGoogle Scholar
13.Sundgren, J-E., Johansson, B-O. and Karlsson, S-E.: Mechanism of reactive sputtering of titanium nitride and titanium carbide III: Influence of substrate bias on composition and structure. Thin Solid Films 105, 353 (1983).CrossRefGoogle Scholar
14.Lausmaa, J.: Surface spectroscopic characterization of titanium implant materials. Elecon. Spectrosc. Relat. Phenom. 81, 343 (1996).CrossRefGoogle Scholar
15.Baker, M.A., Greaves, S.J., Wendler, E. and Fox, V.: A comparsion of in situ polishing and ion beam sputtering as surface preparation methods for XPS analysis of PVD coatings. Thin Solid Films 377, 473 (2000).CrossRefGoogle Scholar
16.Lu, F-H. and Chen, H-Y.: XPS analysis of TiN films on Cu substrate after annealing in the controlled atmosphere. Thin Solid Films 355, 374 (1999).CrossRefGoogle Scholar
17.Rodríguez, R.J., García, J.A., Medrano, A., Rico, M., Sánchez, R., Martínez, R., Labrugère, C., Lahaye, M. and Guette, A.: Tribological behaviour of hard coatings deposited by arc-evaporation PVD. Vacuum 67, 559 (2002).CrossRefGoogle Scholar
18.Ingo, G.M. and Zacchetti, N.: X-ray photoelectron spectroscopy investigation on the chemical structure of amorphous silicon nitride (a-SiN x ). J. Vac. Sci. Technol. A 7, 3048 (1989).CrossRefGoogle Scholar
19.Shew, B.Y. and Huang, J.L.: The effects of nitrogen flow on the reactively Ti-Al-N films. Surf. Coat. Technol. 71, 30 (1995).CrossRefGoogle Scholar
20.Hakasson, G. and Sundgren, J.E.: Microstructure and physical properties of polycrystalline metastable Ti0.5Al0.5N alloys grown by d.c. magnetron sputter deposition. Thin Solid Films 153, 55 (1987).Google Scholar
21.Liu, Z-J. and Shen, Y.G.: Effects of amorphous matrix on the grain growth kinetics in two-phase nanostructured films: A Monte Carlo study. Acta Mater. 52, 729 (2004).CrossRefGoogle Scholar
22.Klug, H.P. and Alexander, L.E.X-ray Diffraction Procedures (Wiley, New York, 1974).Google Scholar
23.Coburn, J.W., Taglauer, E. and Kay, E.: Study of the neutral species rf sputtered from oxide targets. Jpn. J. Appl. Phys. Suppl. 2, 501 (1974).CrossRefGoogle Scholar
24.Mirkarimi, P.B., Hultman, L. and Barnett, A.: Enhanced hardness in lattice-matched single-crystal TiN/(V0.6Nb0.4)N superlattices. Appl. Phys. Lett. 57, 2654 (1990).CrossRefGoogle Scholar
25.Chu, X., Barnett, S.A., Wong, M.S. and Sproul, W.D.: Reactive unbalanced magnetron sputter deposition of polycrystalline TiN/NbN superlattice coatings. Surf. Coat. Technol. 57, 13 (1993).CrossRefGoogle Scholar
26.Kayushina, R., Lvov, Yu., Stepina, N., Belyaev, V. and Khurgin, Yu.: Construction and x-ray reflectivity study of self-assembled Lysozyme/Polyion multilayers. Thin Solid Films 284, 246 (1996).Google Scholar
27.Tay, B.K., Shi, X., Yang, H.S., Tan, H.S., Chua, D. and Teo, S.Y.: The effect of deposition conditions on the properties of TiN thin films prepared by filtered cathodic vacuum-arc technique. Surf. Coat. Technol. 111, 229 (1999).CrossRefGoogle Scholar
28.Kim, J.J., Jung, D.H., Kim, M.S., Kim, S.H. and Yoon, D.Y.: Surface roughness reducing effect of iodine sources (CH3I, C2H5I) on Ru and RuO2 composite films grown by MOCVD. Thin Solid Films 409, 28 (2002).CrossRefGoogle Scholar
29.Chakrabarti, K., Jeong, J.J., Hwang, S.K., Yoo, Y.C. and Lee, C.M.: Effects of nitrogen flow rates on the growth morphology of TiAlN films prepared by an rf-reactive sputtering technique. Thin Solid Films 406, 159 (2002).CrossRefGoogle Scholar
30.Mirkarimi, P.B., Medlin, D.L., McCarty, K.F., Dibble, D.C. and Clift, W.M.: The synthesis, characterization, and mechanical properties of thick, ultrahard cubic boron nitride films deposited by ion-assisted sputtering. J. Appl. Phys. 82, 1617 (1997).CrossRefGoogle Scholar
31.Bull, S.J., Page, T.F. and Yoffe, E.H.: An explanation of the indentation size effect in ceramics. Philos. Mag. Lett. 59, 281 (1989).CrossRefGoogle Scholar
32.Oliver, W.C. and Pharr, G.M.: An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation. J. Mater. Res. 7, 1564 (1992).CrossRefGoogle Scholar