Hostname: page-component-cd9895bd7-7cvxr Total loading time: 0 Render date: 2024-12-30T19:54:17.943Z Has data issue: false hasContentIssue false
  • English
  • Français

Effects of thermal cycling in a reducing atmosphere on metal/polyimide interfaces

Published online by Cambridge University Press:  03 March 2011

Peddada S. Rao ,
I.M. Robertson  and
H.K. Birnbaum
Peddada S. Rao
Affiliation:
Department of Materials Science and Engineering and Materials Research Laboratory, University of Illinois, Urbana, Illinois 61801
I.M. Robertson
Affiliation:
Department of Materials Science and Engineering and Materials Research Laboratory, University of Illinois, Urbana, Illinois 61801
H.K. Birnbaum
Affiliation:
Department of Materials Science and Engineering and Materials Research Laboratory, University of Illinois, Urbana, Illinois 61801
Get access

Abstract

Effects of thermal cycling in a reducing (deuterium) atmosphere on the structure and chemistry of Cr/Cu/Cr/polyimide (PI)/Si and Au/Cu/Ti/polyimide (PI)/Si multilayer systems have been studied. In the Cr/PI system the interface between the Cr and PI was sharp and distinct in the as-deposited state, and after the anneal in the reducing atmosphere. Tensile cracks through the Cr/Cu/Cr layers were found after annealing and are the result of thermal stresses. No evidence for significant diffusion of Cr into the PI was found. In the Ti/PI system, the interface between the Ti and PI was sharp in the as-deposited state. After annealing in vacuum and in the reducing environment, regions of the interface between the Ti layer and the PI were converted to an oxide, Ti5O9. Annealing in the deuterium environment also caused delamination of the Ti film from the PI and blistering of the metal in the sample interior. No significant diffusion of the Ti into the PI was detected. In both systems, the metal in contact with the PI acted as a barrier to the diffusion of Cu into the PI.

Type
Articles
Information
Journal of Materials Research , Volume 9 , Issue 2 , February 1994 , pp. 504 - 514
Copyright
Copyright © Materials Research Society 1994

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1Ho, P. S., Haight, R., White, R. C., and Silverman, B. D., J. de Physique C 5, 49 (1988).Google Scholar
2Goldberg, M. J., Clabes, J. C., Viehbeck, A., and Kovac, C. A., in Electronic Packaging Materials Science, edited by Giess, E. A., Tu, K-N., and Uhlmann, D. R. (Mater. Res. Soc. Symp. Proc. 40, Pittsburgh, PA, 1985), p. 225.Google Scholar
3Hahn, P. O., Rubloff, G. W., Bartha, J. W., LeGoues, F., Tromp, R., and Ho, P. S., in Electronic Packaging Materials Science, edited by Giess, E. A., Tu, K-N., and Uhlmann, D. R. (Mater. Res. Soc. Symp. Proc. 40, Pittsburgh, PA, 1985), p. 251.Google Scholar
4Anderson, S. G., Mayer, H. M., and Weaver, J. H., J. Vac. Sci. Technol. A 6 (4), 2205 (1988).CrossRefGoogle Scholar
5Haight, R., White, R. C., Silverman, B. D., and Ho, P. S., J. Vac. Sci. Technol. A 6 (4), 2188 (1988).CrossRefGoogle Scholar
6Ohuchi, F. S. and Freilich, F. S., J. Vac. Sci. Technol. A 4 (3), 1036 (1986).CrossRefGoogle Scholar
7Bodo, P. and Sundgren, J-E., J. Vac. Sci. Technol. A 6 (4), 2396 (1988).CrossRefGoogle Scholar
8LeGoues, F. K., Silverman, B. D., and Ho, P. S., J. Vac. Sci. Technol. A 6 (4), 2200 (1988).CrossRefGoogle Scholar
9Rao Peddada, S., Ph.D. Thesis, University of Illinois (1991).Google Scholar
10Polyimide–Synthesis, Characterization and Applications, edited by Mittal, K.L. (Plenum Press, New York, 1984), Vol. 1.CrossRefGoogle Scholar
11Furnam, B. K., Purshottaman, S., Castellani, E., and Renick, S., Proc. Symp. Multilevel Metallization (Electro. Chem. Soc. Annual Meeting, San Diego, CA, 1986).Google Scholar
12Sengupta, K., Ph.D. Thesis, University of Illinois (1991).Google Scholar
13Gaskell, D. R., Introduction to Metallurgical Thermodynamics, 2nd ed. (McGraw-Hill, New York, 1981).Google Scholar
14Seshan, K., Lacombe, R. H., and Wagner, J. B. Jr., in Thin Films: Stresses and Mechanical Properties, edited by Bravman, J. C., Nix, W. D., Barnett, D. M., and Smith, D.A. (Mater. Res. Soc. Symp. Proc. 130, Pittsburgh, PA, 1989), p. 367.Google Scholar
15Jones, R. M., Mechanics of Composite Materials (McGraw-Hill, New York, 1975).Google Scholar
16Daniel, I. M., Wang, T. M., and Gotro, J. T., Winter Annual Meeting, Am. Soc. Mechanical Eng., San Francisco, CA (1989).Google Scholar