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Electromigration failure in flip chip solder joints due to rapid dissolution of copper

Published online by Cambridge University Press:  31 January 2011

Y.C. Hu ,
Y.H. Lin ,
C.R. Kao  and
K.N. Tu
Y.C. Hu
Affiliation:
Department of Chemical and Materials Engineering, National Central University, Chungli City, Taiwan, Republic of China
Y.H. Lin
Affiliation:
Department of Chemical and Materials Engineering, National Central University, Chungli City, Taiwan, Republic of China
C.R. Kao*
Affiliation:
Department of Chemical and Materials Engineering, National Central University, Chungli City, Taiwan, Republic of China
K.N. Tu
Affiliation:
Department of Materials Science and Engineering, University of California—Los Angeles, Los Angeles, California 90095-1595
*
a)Address all correspondence to this author. e-mail: crkao@ncu.edu.tw This author was an editor of this journal during the review and decision stage. For the JMR policy on review and publication of manuscripts authored by editors, please refer to http://www.mrs.org/publications/jmr/policy.html
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Abstract

An electromigration failure mechanism in flip chip solder joints is reported in this communication. The solder joints failed by a very rapid, asymmetrical, and localized dissolution of the Cu metallization on the cathode side. The average dissolution rate was about 1 μm/min. The dissolved Cu included not only the Cu under bump metallurgy but also the on-chip Cu conducting trace. From the location and geometry of the dissolved Cu, it can be concluded that current crowding plays a critical role in the rapid dissolution. The dissolved Cu atoms were driven to the anode side by electromigration, and a large amount of Cu6Sn5 was formed there.

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Type
Rapid Communications
Information
Journal of Materials Research , Volume 18 , Issue 11 , November 2003 , pp. 2544 - 2548
Copyright
Copyright © Materials Research Society 2003

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References

REFERENCES

1.Brandenberg, S. and Yeh, S., in Proceedings of the 1998 Surface Mount International Conference and Exhibition (SMTA, Edina, MN, 1998), p. 337.Google Scholar
2.Zeng, K. and Tu, K.N., Mater. Sci. & Eng. R 38, 55 (2002).CrossRefGoogle Scholar
3.Wu, J.D., Zheng, P.J., Lee, K., Chiu, C.T., and Lee, J.J., in Proceedings of the 2002 Electronic Components and Technology Conference (IEEE, New York, 2002), p. 452.Google Scholar
4.Liu, C.Y., Chen, C., Liao, C.N., and Tu, K.N., Appl. Phys. Lett. 75, 58 (1999).CrossRefGoogle Scholar
5.Liu, C.Y., Chen, C., and Tu, K.N., J. Appl. Phys. 88, 5703 (2000).CrossRefGoogle Scholar
6.Huynh, Q.T., Liu, C.Y., Chen, C., and Tu, K.N., J. Appl. Phys. 89, 4332 (2001).CrossRefGoogle Scholar
7.Gjostein, N.A., in Diffusion, edited by Aaronson, H.I. (American Society for Metals, Metals Park, OH, 1973), Chapter 9, p. 241; see Fig. 15.Google Scholar
8.Wynblatt, P. and Gjostein, N.A., Surf. Sci., 12, 109 (1968).CrossRefGoogle Scholar
9.Yeh, E.C.C., Choi, W.J., Tu, K.N., Elenius, P., and Balkan, H., Appl. Phys. Lett. 80, 580 (2002).CrossRefGoogle Scholar
10.Dyson, B.F., Anthony, T.R., and Turnbull, D., J. Appl. Phys. 37, 2370 (1966).CrossRefGoogle Scholar
11.Warburton, W.K. and Turnbull, D., in Diffusion in Solids: Recent Developments, edited by Nowick, A.S. and Burton, J.J. (Academic Press, New York, 1975) p. 171.CrossRefGoogle Scholar
12.Hu, C.K. and Huntington, H., Phys. Rev. B 26, 2782 (1982).CrossRefGoogle Scholar
13.Hu, C.K. and Huntington, H., Phys. Rev. B 28, 579 (1983).CrossRefGoogle Scholar
14.Ye, H., Basaran, C., and Hopkins, D., Appl. Phys. Lett. 82, 1045 (2003).CrossRefGoogle Scholar
15.Beder, W.G., Welding Research Supplement, 551-s (1969).Google Scholar
16.Rahn, A., The Basics of Soldering (John Wiley & Sons, New York, 1993), p. 28.Google Scholar
17.Gupta, D., Vieregge, K., and Gust, W., Acta Mater. 47, 5 (1999).CrossRefGoogle Scholar