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Electromigration failure in flip chip solder joints due to rapid dissolution of copper

Published online by Cambridge University Press:  31 January 2011

Y.C. Hu ,
Y.H. Lin ,
C.R. Kao  and
K.N. Tu
Y.C. Hu
Affiliation:
Department of Chemical and Materials Engineering, National Central University, Chungli City, Taiwan, Republic of China
Y.H. Lin
Affiliation:
Department of Chemical and Materials Engineering, National Central University, Chungli City, Taiwan, Republic of China
C.R. Kao*
Affiliation:
Department of Chemical and Materials Engineering, National Central University, Chungli City, Taiwan, Republic of China
K.N. Tu
Affiliation:
Department of Materials Science and Engineering, University of California—Los Angeles, Los Angeles, California 90095-1595
*
a)Address all correspondence to this author. e-mail: crkao@ncu.edu.tw This author was an editor of this journal during the review and decision stage. For the JMR policy on review and publication of manuscripts authored by editors, please refer to http://www.mrs.org/publications/jmr/policy.html
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Abstract

An electromigration failure mechanism in flip chip solder joints is reported in this communication. The solder joints failed by a very rapid, asymmetrical, and localized dissolution of the Cu metallization on the cathode side. The average dissolution rate was about 1 μm/min. The dissolved Cu included not only the Cu under bump metallurgy but also the on-chip Cu conducting trace. From the location and geometry of the dissolved Cu, it can be concluded that current crowding plays a critical role in the rapid dissolution. The dissolved Cu atoms were driven to the anode side by electromigration, and a large amount of Cu6Sn5 was formed there.

Type
Rapid Communications
Information
Journal of Materials Research , Volume 18 , Issue 11 , November 2003 , pp. 2544 - 2548
Copyright
Copyright © Materials Research Society 2003

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References

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