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Enhanced thermoelectric performance of compacted Bi0.5Sb1.5Te3 nanoplatelets with low thermal conductivity

Published online by Cambridge University Press:  12 July 2011

Chia-Jyi Liu*
Affiliation:
Department of Physics, National Changhua University of Education, Changhua 500, Taiwan, Republic of China
Gao-Jhih Liu
Affiliation:
Department of Physics, National Changhua University of Education, Changhua 500, Taiwan, Republic of China
Yen-Liang Liu
Affiliation:
Department of Physics, National Changhua University of Education, Changhua 500, Taiwan, Republic of China
Liang-Ru Chen
Affiliation:
Department of Physics, National Changhua University of Education, Changhua 500, Taiwan, Republic of China
Alan B. Kaiser
Affiliation:
MacDiarmid Institute for Advanced Materials and Nanotechnology, Victoria University of Wellington, Wellington, New Zealand
*
a)Address all correspondence to this author. e-mail: liucj@cc.ncue.edu.tw
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Abstract

We report fabrication of compacted Bi0.5Sb1.5Te3 nanoplatelets using hydrothermal methods followed by cold pressing and sintering in an evacuated ampoule at various temperature of 300–380 °C. The compacted Bi0.5Sb1.5Te3 sintered at 340 °C has the highest power factor of 11.6 μW/cm·K2 and its thermal conductivity is 0.37 W/m·K at 295 K, which is very low as compared to the typical value of 1 W/m·K. The resulting dimensionless figure of merit ZT is 0.93 at 295 K.

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Reviews
Copyright
Copyright © Materials Research Society 2011

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References

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