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Evaluation of the modified edge lift-off test for adhesion characterization in microelectronic multifilm applications

Published online by Cambridge University Press:  31 January 2011

Jack C. Hay ,
Eric G. Liniger  and
Xiao Hu Liu
Jack C. Hay*
Affiliation:
Fast Forward Devices, 11020 Solway School Road, Suite 113, Knoxville, Tennessee 37931
Eric G. Liniger
Affiliation:
I.B.M. Research, P.O. Box 218, Yorktown Heights, New York 10598–0218
Xiao Hu Liu
Affiliation:
I.B.M. Research, P.O. Box 218, Yorktown Heights, New York 10598–0218
*
a)Address all correspondence to this author. e-mail: jchay@ffdevices.com
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Abstract

The modified edge lift-off test (MELT) has gained enough acceptance in the community for evaluating interfacial adhesion that there is now commercial equipment for automating the test. However, there are several experimental and mechanics assumptions of the test that may provide unexpected outcomes. Experimental data suggested that for crack lengths greater than 5% of the film thickness the energy release rate was independent of crack length, contradicting the rule of thumb suggesting that the crack length should be greater than 10–20 times the film thickness to obtain a steady-state energy release rate in the edge crack problem. Finite element simulations not only corroborated the experimental observation but seemed to indicate that the crack length required for steady-state conditions was a function of the relative Young's moduli for the film and substrate. It was also shown via an analytical model that plate bending (commonly neglected) can significantly affect the energy release rate in the MELT and lead to incorrect conclusions regarding the reliability of an interface.

Type
Articles
Information
Journal of Materials Research , Volume 16 , Issue 2 , February 2001 , pp. 385 - 393
Copyright
Copyright © Materials Research Society 2001

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