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Failure behavior upon shear test of 5Sn–95Pb solder bump after high temperature reliability test

Published online by Cambridge University Press:  03 March 2011

Yeh-Hsiu Liu ,
Chiang-Ming Chuang  and
Kwang-Lung Lin
Yeh-Hsiu Liu
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan 701, Republic of China
Chiang-Ming Chuang
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan 701, Republic of China
Kwang-Lung Lin*
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan 701, Republic of China
*
a)Address all correspondence to this author.e-mail: matkllin@mail.ncku.edu.tw
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Abstract

The shear strength, intermetallic compound formation, and failure mechanism of high-lead solder (5Sn–95Pb) bump on flip chip under bump metallurgy, Al/Ni(V)/Cu, were investigated after thermal cycling, multiple reflow, and high-temperature aging. Two kinds of intermetallic compound, Cu3Sn and AlxNiy, were found at the interface. The Cu3Sn was formed between the solder and Ni(V) layer while AlxNiy was formed between Ni(V) and Al layer. The formation of the Cu3Sn compound will not affect the shear strength, 27–30 g, of the solder bump even after a high temperature long time aging test. However, the shear strength after the 30th reflow drops to less than 25 g, ascribed to the formation of a brittle compound, AlxNiy. The failure modes of the solder bump upon shear test were also discussed.

Keywords

StrengthAgingIntermetallic alloys
Type
Articles
Information
Journal of Materials Research , Volume 19 , Issue 8 , August 2004 , pp. 2471 - 2477
Copyright
Copyright © Materials Research Society 2004

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References

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