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Formation of intermetallic compounds at eutectic Sn–Zn–Al solder/Cu interface

Published online by Cambridge University Press:  31 January 2011

Shan-Pu Yu ,
Moo-Chin Wang  and
Min-Hsiung Hon
Shan-Pu Yu
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan, 80782, Taiwan
Moo-Chin Wang
Affiliation:
Department of Mechanical Engineering, National Kaohsiung University of Applied Sciences, 415 Chien-Kung Road, Kaohsiung, 80782, Taiwan
Min-Hsiung Hon
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road,Tainan, 80782, Taiwan
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Abstract

The eutectic Sn–Zn–Al solder alloy was used [composition: 91Sn–9(5Al–Zn)] to investigate the intermetallic compounds (IMCs) formed between solder and a Cu substrate. Scanning electron microscope, transmission electron microscope, and electron diffraction analysis were used to study the IMCs between solder and a Cu substrate. The γ–Cu5Zn8 and γ–Cu9Al4 IMCs were found at the Sn–Zn–Al/Cu interface. Thermodynamic calculation can explain the formation of γ–Cu5Zn8 and γ–Cu9Al4 IMCs instead of Cu–Sn compounds. The formation and growth of γ–Cu9Al4 IMC at 423 K resulted in the decrease of adhesion strength at the interface of solder and a Cu substrate, where the Kirkendall voids were severely formed. As the heating time increased up to 1000 h at 423 K, the adhesion strength between the eutectic Sn–Zn–Al solder and a Cu substrate decreased from 7.6 ± 0.7 MPa to 4.4 ± 0.8 MPa.

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Type
Articles
Information
Journal of Materials Research , Volume 16 , Issue 1 , January 2001 , pp. 76 - 82
Copyright
Copyright © Materials Research Society 2001

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References

REFERENCES

1.Ghosh, G., Loomans, M., and Fine, M.E., J. Electron. Mater. 23, 619 (1994).CrossRefGoogle Scholar
2.McCormack, M., Jin, S., and Chen, H.S.. J. Electron. Mater. 23, 687 (1994).CrossRefGoogle Scholar
3.McCormack, M. and Jin, S., J. Electron. Mater. 23, 635 (1994).CrossRefGoogle Scholar
4.Environmental Protection Agency, Strategy for Reducing Lead Exposure, Feb. 21 (1991).Google Scholar
5.Walitsky, P.J. and Yost, F.G., The Relevancy of Current Environmental Issues to Solder Joints in Microelectronic Applications. Proc. NEPCON West, Cahner Exposition Group Anaheim, CA, February 23–27, 1671 (1992).Google Scholar
6.Reid, H., Moynihan, D., Leiberman, J., and Bradley, B., Toxic Lead Reduction Act of 1990, S–2637.Google Scholar
7. Environmental Protection Agency, Comprehensive Reviewsof Lead in the Environment under TSCA, 56FR 22096–98, May 13 (1991).Google Scholar
8.Vianco, P.T. and Frear, D.R., JOM July, 14 (1993).CrossRefGoogle Scholar
9.Sebaoun, A., Vincent, D., and Treheux, D., Mater. Sci. Technol. 3, 241 (1987).CrossRefGoogle Scholar
10.Lin, K.L., Chen, S.K., and Chang, S.Y., J. Mater. Sci., Mater. Electron, 8, 253 (1997).CrossRefGoogle Scholar
11.Wu, Y., Sees, J.A., Pouraghabagher, C., Foster, L.A., Marshall, J.L., Jacobs, E.G., and Pinizzotto, R.F., J. Electron. Mater. 22, 769 (1993).CrossRefGoogle Scholar
12.Davis, P.E., Warwick, M.E., and Kay, P.J., Plating and Surface Fishing 69 (9), 72 (1982).Google Scholar
13.Vianco, P.T., Hlava, P.F., and Kilgo, A.C., J. Electron. Mater. 23, 583 (1994).CrossRefGoogle Scholar
14.Sunwoo, A.T., Morris, J.W., and Lucey, G.K., Metall. Trans. A 23A, 1323 (1992).CrossRefGoogle Scholar
15.Mei, Z. and Morris, J.W. Jr., J. Electron. Mater. 21, 73 (1992).Google Scholar
16.Suganuma, K., Niihara, K., Shoutoku, T., and Nakamura, Y., J. Mater. Res. 13, 2859 (1998).CrossRefGoogle Scholar
17.Yu, S.P., Hon, M.H., and Wang, M.C., J. Electron. Mater. 29, 237 (2000).CrossRefGoogle Scholar
18.Hultgren, R., Desai, P.D., Hawkins, D.T., Gleiser, M., and Kelley, K.K., Selected Values of the Thermodynamic Properties of Binary Alloys (ASM Metals Park, OH, 1973), pp. 151–155.Google Scholar
19.Hultgren, R., Desai, P.D., Hawkins, D.T., Gleiser, M., and Kelley, K.K., Selected Values of the Thermodynamic Properties of Binary Alloys (ASM Metals Park, OH, 1973), pp. 795–800.Google Scholar
20.Hultgren, R., Desai, P.D., Hawkins, D.T., Gleiser, M., and Kelley, K.K., Selected Values of the Thermodynamic Properties of Binary Alloys (Metals Park, OH, 1973), pp. 810–822.Google Scholar
21.Onishi, M. and Fujibuchi, H., Trans. JIM 16 539 (1975).CrossRefGoogle Scholar
22.Lazarus, D., Solid State Comm. 32 (10), 175 (1979).CrossRefGoogle Scholar
23.Westbrook, J.H., Intermetallic Compounds (Wiley, New York, 1967), pp. 378–380.Google Scholar