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Generation of microwave plasma under high pressure and fabrication of ultrafine carbon particles

Published online by Cambridge University Press:  31 January 2011

H. Yagi ,
T. Ide ,
H. Toyota  and
Y. Mori
H. Yagi
Affiliation:
Department of Mechanical Engineering, Ehime University, Matsuyama 79077,Japan
T. Ide
Affiliation:
Department of Mechanical Engineering, Ehime University, Matsuyama 79077,Japan
H. Toyota
Affiliation:
Department of Mechanical Engineering, Ehime University, Matsuyama 79077,Japan
Y. Mori
Affiliation:
Department of Precision Science and Technology, Osaka University, Suita 565, Japan
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Abstract

A microwave plasma generator, which functions under high pressure, has been developed and used in the fabrication of fine carbon particles. The plasma generator is a two-stage-type resonator, which consists of rectangular and semi-cylindrical-type resonators which are coupled in series for torching plasma and keeping it stable under high pressure. The plasma can be torched in helium gas at 3 × 106 Pa by tuning the dimensions of apparatus elements. Fine carbon particles of ~50 nm are obtained using a mixture of helium and methane gas. The particles are found to be crystalline from the results of transparent electron microscopy and diffraction analysis.

Type
Articles
Information
Journal of Materials Research , Volume 13 , Issue 6 , June 1998 , pp. 1724 - 1727
Copyright
Copyright © Materials Research Society 1998

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References

REFERENCES

1.Zhang, S.-L., Buchta, R., and Sigurd, D., Thin Solid Films 246 (1–2), 151–157 (1994).Google Scholar
2.Richard, A., St-Onge, L., and Malvos, H., J. Phys. III, Appl. Phys. Mater. Sci. Fluid Plasma Instrum. 5 (8), 1269–1285 (1995).Google Scholar
3.Sola, A., Calzada, M. D., and Gamero, A., J. Phys. D, Appl. Phys. 28 (6), 1099–1110 (1995).CrossRefGoogle Scholar
4.Moisan, M., Pantel, R., and Hubert, J., Contrib. Plasma Phys. 30 (2), 293–314 (1990).CrossRefGoogle Scholar
5.Guest, G. E. and Dandl, R. A., Plasma Chem. Plasma Process 9 (1), SUPPL. 55S-64 (1989).CrossRefGoogle Scholar
6.Hanamura, S., Smith, B. W., and Wineforder, J. D., Can. J. Spectrosc. 29 (1), 13–18 (1984).Google Scholar
7.Mitsuda, Y., Yoshida, T., and Akashi, K., Rev. Sci. Instrum. 60 (2), 249–252 (1989).CrossRefGoogle Scholar
8.Bajorek, R., Parposa, R., and Reszke, E., Plasma Chem. Plasma Process 7 (3), 341–348 (1987).Google Scholar
9.Kitahara, K., Appl. Phys. Lett. 53, 1812–1814 (1988).CrossRefGoogle Scholar