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Grain boundary strengthening in copper/niobium multilayered foils and fine-grained niobium

Published online by Cambridge University Press:  31 January 2011

A.C. Lewis ,
C. Eberl ,
K.J. Hemker  and
T.P. Weihs
A.C. Lewis*
Affiliation:
Johns Hopkins University, Department of Materials Science and Engineering, Baltimore, Maryland 21218
C. Eberl
Affiliation:
Johns Hopkins University, Department of Mechanical Engineering, Baltimore, Maryland 21218
K.J. Hemker
Affiliation:
Johns Hopkins University, Departments of Materials Science and Engineering, and Mechanical Engineering, Baltimore, Maryland 21218
T.P. Weihs
Affiliation:
Johns Hopkins University, Departments of Materials Science and Engineering, and Mechanical Engineering, Baltimore, Maryland 21218
*
a) Address all correspondence to this author. e-mail: alexis.lewis@nrl.navy.mil Present address: Naval Research Laboratory, Multifunctional Materials Branch, Washington, DC, 20375.
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Abstract

Uniaxial tensile tests were performed on Cu/Nb multilayered foils to investigate yield strength and grain boundary strengthening in the layered foils at room temperature and in fine-grained Nb at 600 °C. At room temperature, yielding in Cu/Nb multilayered foils is controlled by deformation in both layers, and grain boundary strengthening is observed with a Hall–Petch slope (kRT) of 198 ± 56 MPa·μm1/2 at a strain rate of 10−4 s−1. At 600 °C, yielding in Cu/Nb multilayered foils is controlled by deformation in just the Nb layers. Hall–Petch strengthening is observed over a range of strain rates, but the Hall–Petch slope decreases from 197 ± 71 MPa·μm1/2 for a strain rate of 10−4 s−1 to only 25 ± 40 MPa·μm1/2 for a strain rate of 10−6 s−1. The significant drop in the Hall–Petch slope for Nb with decreasing strain rate indicates a change in the controlling deformation mechanism from dislocation glide to dislocation creep.

Keywords

Stress–strain relationshipNbGrain size
Type
Articles
Information
Journal of Materials Research , Volume 23 , Issue 2 , February 2008 , pp. 376 - 382
Copyright
Copyright © Materials Research Society 2007

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References

REFERENCES

1Ahuja, R.Fraser, H.L.: Microstructural transitions in titanium–aluminum thin-film multilayers. J. Electron. Mater. 23, 1027 1994CrossRefGoogle Scholar
2Anderson, P.M., Bingert, J.F., Misra, A.Hirth, J.P.: Rolling textures in nanoscale Cu/Nb multilayers. Acta Mater. 51, 6059 2003CrossRefGoogle Scholar
3Cammarata, R.C., Schlesinger, T.E., Kim, C., Qadri, S.B.Edelstein, A.S.: Nanoindentation study of the mechanical properties of copper–nickel multilayered thin-films. Appl. Phys. Lett. 56, 1862 1990CrossRefGoogle Scholar
4Dück, A., Gamer, N., Gesatzke, W., Griepentrog, M., Österle, W., Sahre, M.Urban, I.: Ti/TiN multilayer coatings: Deposition technique, characterization and mechanical properties. Surf. Coat. Technol. 142, 579 2001CrossRefGoogle Scholar
5Lehoczky, S.L.: Retardation of dislocation generation and motion in thin- layered metal laminates. Phys. Rev. Lett. 41, 1814 1978CrossRefGoogle Scholar
6Mitchell, T.E., Lu, Y.C., Griffin, A.J., Nastasi, M.Kung, H.: Structure and mechanical properties of copper/niobium multilayers. J. Am. Ceram. Soc. 80, 1673 1997CrossRefGoogle Scholar
7Ruud, J.A., Jervis, T.R.Spaepen, F.: Nanoindentation of Ag/Ni multilayered thin-films. J. Appl. Phys. 75, 4969 1994CrossRefGoogle Scholar
8Tambwe, M.F., Stone, D.S., Griffin, A.J., Kung, H., Lu, Y.C.Nastasi, M.: Haasen plot analysis of the Hall–Petch effect in Cu/Nb nanolayer composites. J. Mater. Res. 14, 407 1999CrossRefGoogle Scholar
9Tench, D.White, J.: Enhanced tensile strength for electrodeposited nickel–copper multilayer composites. Metall. Trans. A 15, 2039 1984CrossRefGoogle Scholar
10Tixier, S., Boni, P.Van Swygenhoven, H.: Hardness enhancement of sputtered Ni3Al/Ni multilayers. Thin Solid Films 342, 188 1999CrossRefGoogle Scholar
11Genin, F.Y.: Effect of stress on grain boundary motion in thin films. J. Appl. Phys. 77, 5130 1995CrossRefGoogle Scholar
12Frost, H.J.Ashby, M.F.: Deformation-Mechanism Maps Pergamon Press New York 1982 20–42Google Scholar
13Misra, A., Hoagland, R.G.Kung, H.: Thermal stability of self-supported nanolayered Cu/Nb films. Philos. Mag. 84, 1021 2004CrossRefGoogle Scholar
14Lewis, A.C., Van Heerden, D., Josell, D.Weihs, T.P.: Creep deformation in multilayered and microlaminate materials. JOM 55, 34 2003CrossRefGoogle Scholar
15Eberl, C., Lewis, A.C., Weihs, T.P.Hemker, K.J.: Microstructural stability of Cu/Nb multilayers during high-temperature creep (unpublished research) 2007Google Scholar
16Lewis, A.C.: The Effect of Interfaces on the Stability and Mechanical Properties of Polycrystalline Multilayers Johns Hopkins University Baltimore, MD 2003Google Scholar
17Conrad, H., Feuerstein, S.Rice, L.: Effects of grain size on the dislocation density and flow stress of niobium. Mater. Sci. Eng. 2, 157 1967CrossRefGoogle Scholar
18Omar, A.M.Entwisle, A.R.: Effect of grain size on deformation of niobium. Mater. Sci. Eng. 5, 263 1969CrossRefGoogle Scholar
19Szkopiak, Z.C.: Hall–Petch parameters of niobium determined by grain-size and extrapolation methods. Mater. Sci. Eng. 9, 7 1972CrossRefGoogle Scholar
20Hansen, N.Ralph, B.: The strain and grain size dependence of the flow stress of copper. Acta Met. 30, 411 1982CrossRefGoogle Scholar