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High-temperature lead-free SnSb solders: Wetting reactions on Cu foils and phased-in Cu–Cr thin films

Published online by Cambridge University Press:  31 January 2011

J. W. Jang ,
P. G. Kim ,
K. N. Tu  and
Michael Lee
J. W. Jang
Affiliation:
Department of Materials Science and Engineering, University of California at Los Angeles, Los Angeles, CA 90095–1595
P. G. Kim
Affiliation:
Department of Materials Science and Engineering, University of California at Los Angeles, Los Angeles, CA 90095–1595
K. N. Tu
Affiliation:
Department of Materials Science and Engineering, University of California at Los Angeles, Los Angeles, CA 90095–1595
Michael Lee
Affiliation:
Fujitsu Computer Packaging Technologies, San Jose, CA 95134
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Abstract

We report the soldering behaviors of high-temperature (300 °C) lead-free SnSb alloys on Cu foils and phased-in Cu–Cr thin films. By increasing the Sb content from 5 to 15 wt%, the solder surface became rougher and the wetting angle decreased from 50° to 20° on the Cu foils. Interfacial compounds were found to be Cu6Sn5 and Cu3Sn. The Cu6Sn5 showed a scallop-type morphology, whereas the Cu3Sn had a layer-type morphology. The growth of the latter was found to be diffusion limited. On phased-in Cu–Cr thin films, the solders showed much lower wetting angles than on the Cu foils, but the dewetting phenomenon was observed after 1 min of reflow time in the 85Sn15Sb alloy. In comparison, we found no dewetting of the high-temperature 95Pb5Sn solder.

Type
Articles
Information
Journal of Materials Research , Volume 14 , Issue 10 , October 1999 , pp. 3895 - 3900
Copyright
Copyright © Materials Research Society 1999

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References

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