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A high-throughput strategy to screen interfacial diffusion barrier materials for thermoelectric modules

Published online by Cambridge University Press:  06 February 2019

Ming Gu Open the ORCID record for Ming Gu [Opens in a new window] ,
Shengqiang Bai ,
Jiehua Wu ,
Jincheng Liao ,
Xugui Xia ,
Ruiheng Liu Open the ORCID record for Ruiheng Liu [Opens in a new window]  and
Lidong Chen
Ming Gu
Affiliation:
The State Key Lab of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 201899, China
Shengqiang Bai*
Affiliation:
The State Key Lab of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 201899, China
Jiehua Wu
Affiliation:
The State Key Lab of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 201899, China
Jincheng Liao
Affiliation:
The State Key Lab of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 201899, China
Xugui Xia
Affiliation:
The State Key Lab of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 201899, China
Ruiheng Liu
Affiliation:
The State Key Lab of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 201899, China
Lidong Chen*
Affiliation:
The State Key Lab of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 201899, China
*
a)Address all correspondence to these authors. e-mail: bsq@mail.sic.ac.cn
b)e-mail: cld@mail.sic.ac.cn
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Abstract

Diffusion barrier materials play an important role in both structure reliability and performance stability of thermoelectric (TE) modules. Preferred barrier materials are screened out from various candidates by comparing the interdiffusion at the barrier material/TE substrate interfaces. Traditionally, for each barrier material candidate, complicated fabrication processing of TE elements (electrode/barrier material/TE material) must be finished to obtain relative interfaces, which makes the screening costly and time consuming. In this article, using a high-throughput strategy, we developed a high-efficiency screening method of barrier materials. By cosintering the mixture of TE substrate material and various barrier material candidates simply following the TE material’s sintering parameters, various microinterfaces were integrated to one single sample. This enables parallel aging and microstructure characterization of different interfaces, and preferred barrier materials can be swiftly screened out. As a result, it makes the design and optimization of TE modules much more efficient and economical.

Keywords

thermoelectricdiffusionbarrier layer
Type
Article
Information
Journal of Materials Research , Volume 34 , Issue 7: Focus Section: Interconnects and Interfaces in Energy Conversion Materials , 15 April 2019 , pp. 1179 - 1187
Copyright
Copyright © Materials Research Society 2019 

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