Hostname: page-component-cd9895bd7-gbm5v Total loading time: 0 Render date: 2024-12-28T16:00:17.432Z Has data issue: false hasContentIssue false
  • English
  • Français

Improvements of microstructure, wettability, tensile and creep strength of eutectic Sn–Ag alloy by doping with rare-earth elements

Published online by Cambridge University Press:  31 January 2011

C. M. L. Wu ,
D. Q. Yu ,
C. M. T. Law  and
L. Wang
C. M. L. Wu*
Affiliation:
Department of Physics and Materials Science, City University of Hong Kong, 83 Tat Chee Avenue, Hong Kong SAR, People's Republic of China
D. Q. Yu
Affiliation:
Department of Materials Engineering, Dalian University of Technology, Dalian, People's Republic of China
C. M. T. Law
Affiliation:
Department of Physics and Materials Science, City University of Hong Kong, 83 Tat Chee Avenue, Hong Kong SAR, People's Republic of China
L. Wang
Affiliation:
Department of Materials Engineering, Dalian University of Technology, Dalian, People's Republic of China
*
a)Address all correspondence to this author.Lawrence.Wu@cityu.edu.hk
Get access

Abstract

To improve the properties of the eutectic Sn–Ag lead-free solder alloy, various amounts of mixed rare-earth (RE) elements, mainly Ce and La, were added. The microstructure, wetting properties, melting behavior, mechanical properties, and creep behavior were studied. It was revealed that RE elements can refine the intermetallics, and with 0.5% RE addition, the RE-bearing phase can be detected in the microstructure of the slow-cooled alloy. The results of differential scanning calorimetry indicate that the melting points of the RE-doped alloys are slightly lower than that of the Sn–3.5Ag and have a eutectic peak. The wetting property and creep resistance of the Sn–3.5Ag–0.25RE alloy are better than those of the Sn–3.5Ag alloy. The creep properties were studied at the temperatures of 303, 348, and 393 K, at various stress levels between 8 and 34 MPa. The stress exponents of the Sn–3.5Ag and Sn–3.5Ag–0.25RE were obtained at these temperatures. Tensile, creep, and wetting properties were found to improve with the addition of RE elements. The improvement of creep resistance is due to the fine dispersion of intermetallics and the decrease in interface energy between matrix and intermetallics. The wettability improvement is mainly due to the accumulation of RE elements at the solder/flux interface, leading to the reduction of the interfacial tension between solder and flux.

Type
Articles
Information
Journal of Materials Research , Volume 17 , Issue 12 , December 2002 , pp. 3146 - 3154
Copyright
Copyright © Materials Research Society 2002

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1.Glazer, J., J. Electron. Mater. 23, 693 (1994).CrossRefGoogle Scholar
2.Wu, C.M.L., Huang, M.L., Chan, Y.C., and Lai, J.K.L., J. Electron. Mater. 29, 1015 (2000).CrossRefGoogle Scholar
3.McCormack, M., Jin, S., and Chen, H.S., J. Electron. Mater. 23, 687 (1994).CrossRefGoogle Scholar
4.Miller, C.M., Anderson, I.E., and Smith, J.F., J. Electron. Mater. 23, 595 (1994).CrossRefGoogle Scholar
5.Vianco, P.T. and Rejent, J.A.. J. Electron. Mater. 28, 1127 (1999).Google Scholar
6.Suganuma, K., Niihara, K., Shoutoka, T., and Nakamura, Y., J. Mater. Res. 13, 2859 (1998).CrossRefGoogle Scholar
7.Suganuma, K., Murota, T., Noguchi, H., and Toyoda, Y., J. Mater. Res. 15, 884 (2000).CrossRefGoogle Scholar
8.Zhu, Y., Kang, H., Qu, P., Fang, H.Y., and Qian, Y.Y., Chin, J., Rare Earth Soc. 17, 16 (1999).Google Scholar
9.Ma, X., Qian, Y.Y., and Yoshida, F., J. Alloys Compd. 334, 224 (2002).Google Scholar
10.Wu, C.M.L., Law, C.M.T., Yu, D.Q., and Wang, L., J. Electron. Mater. 31, 921 (2002).CrossRefGoogle Scholar
11.Mavoori, H., Ramirez, A.G., and Jin, S.. Appl. Phys. Lett. 78, 2976 (2001).Google Scholar
12.Wu, C.M.L., Yu, D.Q., Law, C.M.T., and Wang, L., J. Electron. Mater., J. Electron. Mater. 31, 928 (2002).Google Scholar
13.Raeder, C.H., Schmeelk, G.D., Mitlin, D., Barbieri, T., Wang, W., Felton, L.E., Messler, R.W. Jr., Knorr, D.B., and Lee, D., Proc. IEEE/CPMT Int. Electron. Manu. Technol. Symp., Sept. 12–14, La Jolla, CA, 1 (1994).Google Scholar
14.Baker, H. et al. , ed., Alloy Phase Diagrams, ASM Handbook Vol. 3, edited by Baker, H. (ASM Int., Materials Park, OH, 1990), p. 137.Google Scholar
15.Baker, H. et al. , ed., Alloy Phase Diagrams, ASM Handbook Vol. 3, edited by Baker, H. (ASM Int., Materials Park, OH, 1990), p. 275.Google Scholar
16.Baker, H. et al. , ed., Alloy Phase Diagrams, ASM Handbook Vol. 3, edited by Baker, H. (ASM Int., Materials Park, OH, 1990), p. 132.Google Scholar
17.McCabe, R.J. and Fine, M.E., JOM 52, 33 (2000).Google Scholar
18.Igoshev, V.I., Kleiman, J.I., Shangguan, D., Lock, C., and Wong, S., J. Electron. Mater. 27, 1367 (1998).CrossRefGoogle Scholar
19.Oliver, W.C. and Nix, W.D., Acta Metall. 30, 1335 (1982).Google Scholar
20.Igoshev, V.I. and Kleiman, J.I., J. Electron. Mater. 29, 244 (2000).CrossRefGoogle Scholar
21.Igoshev, V.I., Kleiman, J.I., and Shangguan, D., J. Electron. Mater. 29, 1356 (2000).CrossRefGoogle Scholar