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Improving tensile and fatigue properties of Sn–58Bi/Cu solder joints through alloying substrate

Published online by Cambridge University Press:  31 January 2011

QingKe Zhang ,
HeFei Zou  and
Zhe-Feng Zhang
Zhe-Feng Zhang*
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, People's Republic of China
*
a)Address all correspondence to this author. e-mail: zhfzhang@imr.ac.cn
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Abstract

To eliminate the Bi segregation and interfacial embrittlement of the SnBi/Cu joints, we deliberately added some Ag or Zn elements into the Cu substrate. Then, the reliability of the SnBi/Cu–X (X = Ag or Zn) solder joints was evaluated by investigating their interfacial reactions, tensile property, and fatigue life compared with those of the SnBi/Cu and SnAg/Cu joints. The experimental results demonstrate that even after aging for a long time, the addition of the Ag or Zn elements into the Cu substrate can effectively eliminate the interfacial Bi embrittlement of the SnBi/Cu–X joints under tensile or fatigue loadings. Compared with the conventional SnAg/Cu joints, the SnBi/Cu–X joints exhibit higher adhesive strength and comparable fatigue resistance. Finally, the fatigue and fracture mechanisms of the SnBi/Cu–X solder joints were discussed qualitatively. The current findings may pave the new way for the Sn–Bi solder widely used in the electronic interconnection in the future.

Keywords

SolderingMicroelectronics

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Type
Articles
Information
Journal of Materials Research , Volume 25 , Issue 2 , February 2010 , pp. 303 - 314
Copyright
Copyright © Materials Research Society 2010

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