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Inhibition effect of longitudinal alternating current during annealing on growth of interfacial layers of copper cladding aluminum composite

Published online by Cambridge University Press:  22 May 2017

Yongfu Wu ,
Xinhua Liu ,
Yanbin Jiang  and
Jianxin Xie
Yongfu Wu
Affiliation:
Key Laboratory for Advanced Materials Processing of Ministry of Education, Institute for Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China; and Laboratory of Aluminum Alloy, Aluminum Corporation of China (CHINALCO) Research Institute of Science and Technology, Beijing 102209, China
Xinhua Liu*
Affiliation:
Key Laboratory for Advanced Materials Processing of Ministry of Education, Institute for Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China; and Beijing Laboratory of Metallic Materials and Processing for Modern Transportation, University of Science and Technology Beijing, Beijing 100083, China
Yanbin Jiang
Affiliation:
Key Laboratory for Advanced Materials Processing of Ministry of Education, Institute for Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China; and Beijing Laboratory of Metallic Materials and Processing for Modern Transportation, University of Science and Technology Beijing, Beijing 100083, China
Jianxin Xie
Affiliation:
Key Laboratory for Advanced Materials Processing of Ministry of Education, Institute for Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China; and Beijing Laboratory of Metallic Materials and Processing for Modern Transportation, University of Science and Technology Beijing, Beijing 100083, China
*
a) Address all correspondence to this author. e-mail: liuxinhua@ustb.edu.cn
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Abstract

The effect of longitudinal alternating current (LAC) on the growth of the interfacial layers of the copper cladding aluminum (CCA) composite flat bar during isothermal annealing was investigated. The results showed that the application of LAC could remarkably inhibit the growth of interfacial compounds as well as improve the interfacial bonding property of the CCA composite. When the CCA flat bars were annealed at temperatures ranging from 723 to 773 K for 1 h with a LAC density higher than 0.625 A/mm2, the total thickness of the interfacial compound layers was reduced by more than 75% in comparison to CCA flat bars annealed without LAC. The reduction of the thickness of the interfacial layers resulted in an improvement of the bonding strength of the CCA composite. The mechanism of the inhibition effect was that the application of LAC could accelerate the vacancy annihilation in component metals.

Keywords

annealingcompositemetallic conductor
Type
Articles
Information
Journal of Materials Research , Volume 32 , Issue 12 , 28 June 2017 , pp. 2335 - 2342
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Copyright
Copyright © Materials Research Society 2017 

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Footnotes

Contributing Editor: Yang-T. Cheng

References

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