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Interface modifications for improving the adhesion of a-C:H films to metals

Published online by Cambridge University Press:  31 January 2011

A. Grill ,
B. Meyerson  and
V. Patel
A. Grill
Affiliation:
IBMT. J. Watson Research Center, Yorktown Heights, New York 10598
B. Meyerson
Affiliation:
IBMT. J. Watson Research Center, Yorktown Heights, New York 10598
V. Patel
Affiliation:
IBMT. J. Watson Research Center, Yorktown Heights, New York 10598
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Abstract

The adhesion of diamondlike hard carbon films to silicide forming metals was improved by using an interfacial silicon film several atomic layers thick. The use of thicker (> 10nm) silicon layers results in a decrease in the adhesion, probably due to a degradation of the structural integrity by excessive silicide formation.

Type
Rapid Communications
Information
Journal of Materials Research , Volume 3 , Issue 2 , April 1988 , pp. 214 - 217
Copyright
Copyright © Materials Research Society 1988

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References

1Andersson, L-P., Thin Solid Films 86, 193 (1981).CrossRefGoogle Scholar
2Bubenzer, A., Dischler, B., Brandt, G., and Koidl, P., J. Appl. Phys. 54, 4590 (1983).CrossRefGoogle Scholar
3Zelez, J., J. Vac. Sci. Technol. 1, 305 (1983).CrossRefGoogle Scholar
4Savvides, N. and Window, B., J. Vac. Sci. Technol. A3, 2386 (1985).CrossRefGoogle Scholar
5Angus, J. C., Stultz, J. E., Schiller, P. J., MacDonald, J. R., Mirtich, M. J., and Domitz, S., Thin Solid Films 118, 311 (1984).CrossRefGoogle Scholar
6Weissmantel, C., Bevilogua, K., Breuer, K., Dietrich, D., Hebersbach, U., Erler, H. J., Rau, B. B., and Reisse, G., Thin Solid Films 96, 31 (1982).CrossRefGoogle Scholar
7Grill, J. A., Meyerson, B. S., Patel, V. V., Reimer, J. A., and Petrich, M. A., J. Appl. Phys. 61, 2874 (1987).CrossRefGoogle Scholar
8Desposito, J., Creative Computing 11 (8), 28 (1985).Google Scholar
9QUAD Group, Santa Barbara, California.Google Scholar
10Veprek, S. and Marecek, V., Solid State Electron. 11, 683 (1968).CrossRefGoogle Scholar
11Herd, S. R., Chaudhari, P., and Brodsky, M. H., J. Non-Cryst. Solids 7, 309 (1972).CrossRefGoogle Scholar
12Weissmantel, C., in Thin Films From Free Atoms and Molecules, edited by Klabunde, K. J. (Academic, New York, 1985), p. 153.CrossRefGoogle Scholar
13Murarka, S. P., J. Vac. Sci. Technol. 17, 775 (1980).CrossRefGoogle Scholar