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Internal friction of artificially multilayered Cu–Ni(100) membranes produced by electrodeposition

Published online by Cambridge University Press:  31 January 2011

R. R. Oberle ,
R. C. Cammarata ,
C. M. Su  and
M. Wuttig
R. R. Oberle
Affiliation:
Department of Materials Science and Engineering, Johns Hopkins University, Baltimore, Maryland 21218
R. C. Cammarata
Affiliation:
Department of Materials Science and Engineering, Johns Hopkins University, Baltimore, Maryland 21218
C. M. Su
Affiliation:
University of Maryland, Department of Materials and Nuclear Engineering, College Park, Maryland 20742
M. Wuttig
Affiliation:
University of Maryland, Department of Materials and Nuclear Engineering, College Park, Maryland 20742
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Abstract

The internal stress and internal friction of electrodeposited multilayered Cu–Ni(100) thin films were investigated as a function of temperature by a sensitive vibrating membrane technique. Each membrane was in a state of biaxial stress (approaching the yield strength) resulting from contributions of the growth stress in the as-deposited film and from the thermal stress as the membrane was heated. The measured internal friction of these stressed multilayered films was enhanced by over an order of magnitude compared to the predicted value of classic damping related to the modulus defect when the effect of the internal stress was taken into account.

Type
Rapid Communications
Information
Journal of Materials Research , Volume 14 , Issue 10 , October 1999 , pp. 3837 - 3839
Copyright
Copyright © Materials Research Society 1999

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References

REFERENCES

1.Cammarata, R.C., Thin Solid Films 248, 82 (1994).CrossRefGoogle Scholar
2.Berry, B.S. and Pritchet, W.C., Thin Solid Films 33, 19 (1976).CrossRefGoogle Scholar
3.Su, C.M., Oberle, R.R., Cammarata, R.C., and Wuttig, M., in Evolution of Surface Thin Film Microstructure, edited by Atwater, H.A., Chason, E.H., Grabow, M.L. and Lagally, M.G., (Mater. Res. Soc. Symp. Proc. 280, Pittsburgh, PA, 1993), p. 527.Google Scholar
4.Schuller, I.K., Phys. Rev. Lett. 44, 1597 (1980).CrossRefGoogle Scholar
5.Wah, T., J. Acoust. Soc. Am. 34, 275 (1962).CrossRefGoogle Scholar
6.Greer, A.L. and Spaepen, F., in Synthetic Modulated Structures, edited by Chang, L.L. and Giessen, B.C. (Academic, Orlando, 1985), p. 419.CrossRefGoogle Scholar
7.Norwick, A.S. and Berry, B.S., Anelastic Relaxation in Crystalline Solids (Academic, New York, 1972), p. 19.Google Scholar
8.Su, C.M., Kim, T., Oberle, R.R., Cammarata, R.C., and Wuttig, M., J. Appl. Phys. 76, 4567 (1994).CrossRefGoogle Scholar
9.Oberle, R.R., M.S. Thesis, Johns Hopkins University, Baltimore, MD, 1992.Google Scholar