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Investigation of vibration fracture behavior of Sn–Ag–Cu solders under resonance

Published online by Cambridge University Press:  03 March 2011

Jenn-Ming Song ,
Fang-I Li ,
Truan-Sheng Lui  and
Li-Hui Chen
Jenn-Ming Song
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, Tainan 701, Taiwan
Fang-I Li
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, Tainan 701, Taiwan
Truan-Sheng Lui
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, Tainan 701, Taiwan
Li-Hui Chen
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, Tainan 701, Taiwan
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Abstract

This study investigated the vibration fracture properties of Sn–Ag–Cu alloys with various Cu contents. Results show that the microstructure becomes finer with a higher Cu content. This leads to a lower damping capacity, higher deflection amplitude, and thus inferior vibration fracture resistance under a constant vibration force. It is of interest that when the Cu content reaches 1.5 wt%, the specimen possesses the highest damping capacity and greatest vibration life. The presence of massive primary Cu6Sn5 intermetallics probably accounts for this phenomenon.

Keywords

AlloyMicrostructureMechanical properties

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Type
Articles
Information
Journal of Materials Research , Volume 19 , Issue 9 , September 2004 , pp. 2665 - 2673
Copyright
Copyright © Materials Research Society 2004

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