Hostname: page-component-78c5997874-mlc7c Total loading time: 0 Render date: 2024-11-13T01:59:44.598Z Has data issue: false hasContentIssue false
  • English
  • Français

Microstructure and mechanical property of Cu/In–45Cu/Ni solder joints formed by transient liquid phase bonding

Published online by Cambridge University Press:  13 August 2020

Li Yang ,
Shiyuan Zhou ,
Yaocheng Zhang ,
Yifeng Xiong ,
Wei Jiang  and
Sai Shen
Li Yang*
Affiliation:
School of Mechanical Engineering, Guilin University of Aerospace Technology, Guilin541004, P.R. China School of Automotive Engineering, Changshu Institute of Technology, Jiangsu215500, P.R. China
Shiyuan Zhou*
Affiliation:
School of Mechanical and Electrical Engineering, Soochow University, Jiangsu215000, P.R. China
Yaocheng Zhang
Affiliation:
School of Automotive Engineering, Changshu Institute of Technology, Jiangsu215500, P.R. China
Yifeng Xiong
Affiliation:
School of Automotive Engineering, Changshu Institute of Technology, Jiangsu215500, P.R. China
Wei Jiang
Affiliation:
School of Automotive Engineering, Changshu Institute of Technology, Jiangsu215500, P.R. China
Sai Shen
Affiliation:
School of Automotive Engineering, Changshu Institute of Technology, Jiangsu215500, P.R. China
*
a)Address all correspondence to these authors. e-mail: linlideyu@126.com
b)e-mail: 963905640@qq.com
Get access

Abstract

In this paper, the microstructure and the shear property of Cu/In–45Cu/Ni solder joints by transient liquid phase were studied, and the intermetallic compounds (IMCs) growth mechanism was investigated. The results showed that the IMCs volume ratio of solder joints was increased firstly and then decreased with increasing bonding time, and the IMCs volume ratio reached its maximum value of 95.8% at 60 min. The Cu interfacial IMC of the solder joint with dense microstructure was Cu2In phase at 60 min, and the Ni interfacial IMC was Ni3In7. The maximum shear strength of solder joints was obtained at 60 min, which is 15.21 MPa. The shear fracture appeared honeycomb structure, and the fracture occurred at the phase interface of Ni3In7/Cu11In9. The thickness of the interfacial IMCs and the white IMCs around the Cu particles (Cu@IMC) was increased continuously with increasing bonding time, and thus, the interconnection of Cu–Ni substrates was realized ultimately.

Keywords

intermetallic compoundsTLP bondingsolder jointmicrostructure shear propertybonding mechanism
Type
Article
Information
Journal of Materials Research , Volume 35 , Issue 21 , 16 November 2020 , pp. 2848 - 2858
Check for updates
Copyright
Copyright © The Author(s), 2020, published on behalf of Materials Research Society by Cambridge University Press

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

Roccaforte, F., Giannazzo, F., Iucolano, F., Eriksson, J., Weng, M.H., and Raineri, V.: Surface and interface issues in wide band gap semiconductor electronics. Appl. Surf. Sci. 256, 5727–5735 (2010).CrossRefGoogle Scholar
Wang, D., Li, D., Zhao, M., Xu, Y., and Wei, Q.F.: Multifunctional wearable smart device based on conductive reduced graphene oxide/polyester fabric. Appl. Surf. Sci. 454, 218–226 (2018).CrossRefGoogle Scholar
Roccaforte, F., Fiorenza, P., Greco, G., Nigro, R.L., Giannazzo, F., Iucolano, F., and Saggio, M.: Emerging trends in wide band gap semiconductors (SiC and GaN) technology for power devices. Microelectron. Eng. 187, 66–77 (2017).Google Scholar
Yin, L.M., Wei, S., Xu, Z.L., and Geng, Y.F.: The effect of joint size on the creep properties of microscale lead-free solder joints at elevated temperatures. J. Mater. Sci.: Mater. Electron 24, 1369–1374 (2013).Google Scholar
Stoyanov, S., Bailey, C., and Desmulliez, M.: Optimisation modelling for thermal fatigue reliability of lead-free interconnects in fine-pitch flip-chip packaging. Solder. Surf. Mt. Technol. 21, 11–24 (2009).CrossRefGoogle Scholar
Amalu, E.H., Ekere, N.N., Bhatti, R.S., Mallik, S., Takyi, G., and Ibhadode, A.O.A.: Numerical investigation of thermo-mechanical behaviour of ball grid array solder joint at high temperature excursion. Adv. Mater. Res. 367, 287–292 (2011).CrossRefGoogle Scholar
Zhao, H.Y., Liu, J.H., Li, Z.L., Zhao, Y.X., Niu, H.W., Song, X.G., and Dong, H.J.: Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process. Mater. Lett. 186, 283–288 (2017).CrossRefGoogle Scholar
Chen, W. and Duh, J.: Suppression of Cu3Sn layer and formation of multi-orientation IMCs during thermal aging in Cu/Sn–3.5Ag/Cu–15Zn transient liquid-phase bonding in novel 3D-IC Technologies. Mater. Lett. 186, 279–282 (2017).CrossRefGoogle Scholar
Liu, X.D., He, S.L., and Nishikawa, H.: Thermally stable Cu3Sn/Cu composite joint for high-temperature power device. Scr. Mater. 110, 101–104 (2016).CrossRefGoogle Scholar
Zhang, R.H., Guo, F., Liu, J.P., Shen, H., and Tai, F.: Morphology and growth of intermetallics at the interface of Sn-based solders and Cu with different surface finishes. J. Electron. Mater. 38, 241–251 (2009).CrossRefGoogle Scholar
Tai, F.C., Wang, K.J., and Duh, J.D.: Application of electroless Ni–Zn–P film for under-bump metallization on solder joint. Scr. Mater. 61, 748–751 (2009).CrossRefGoogle Scholar
Kadoguchi, T., Take, N., Yamanaka, K., Nagao, S., and Suganuma, K.: Highly thermostable joint of a Cu/Ni–P plating/Sn–0.7Cu solder added with Cu balls. J. Mater. Sci. 52, 3244–3254 (2017).CrossRefGoogle Scholar
Dong, H.J., Li, Z.L., Song, X.G., Zhao, H.Y., Tian, H., Liu, J.H., and Yan, J.C.: Grain morphology evolution and mechanical strength change of intermetallic joints formed in Ni/Sn/Cu system with variety of transient liquid phase soldering temperatures. Mater. Sci. Eng. A 705, 1026–1031 (2017).Google Scholar
Mo, L.P., Guo, C.W., Zhou, Z., Wu, F.S., and Liu, C.Q.: Microstructural evolution of Cu–Sn–Ni compounds in full intermetallic micro-joint and in situ micro-bending test. J. Mater. Sci.: Mater. Electron 29, 11920–11929 (2018).Google Scholar
Zhong, Y., Huang, M., Ma, H., Dong, W., Wang, Y.P., and Zhao, N.: In situ study on Cu–Ni cross-interaction in Cu/Sn/Ni solder joints under temperature gradient. J. Mater. Res. 31, 609–617 (2016).CrossRefGoogle Scholar
Ji, H.J., Qiao, Y.F., and Li, M.Y.: Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn–0.7Cu solder for high temperature packaging application. Scr. Mater. 110, 19–23 (2016).CrossRefGoogle Scholar
Huang, Y.S., Hsiao, H.Y., Chen, C., and Tu, K.N.: The effect of a concentration gradient on interfacial reactions in microbumps of Ni/SnAg/Cu during liquid-state soldering. Scr. Mater. 66, 741–744 (2012).CrossRefGoogle Scholar
Zhao, N., Wang, M.Y., Zhong, Y., Ma, H.T., Wang, Y.P., and Wong, C.P.: Effect of Zn content on Cu–Ni cross-interaction in Cu/Sn–xZn/Ni micro solder joints. J. Mater. Sci.: Mater. Electron 29, 5064–5073 (2018).Google Scholar
Yoon, J.W. and Lee, B.S.: Sequential interfacial reactions of Au/In/Au transient liquid phase-bonded joints for power electronics applications. Thin Solid Films 660, 618–624 (2018).CrossRefGoogle Scholar
Tian, Y.H., Hang, C.J., Zhao, X., Liu, B.L., Wang, N., and Wang, C.Q.: Phase transformation and fracture behavior of Cu/In/Cu joints formed by solid–liquid interdiffusion bonding. J. Mater. Sci.: Mater. Electron 25, 4170–4178 (2014).Google Scholar
Lin, S.K., Wang, Y.H., and Kuo, H.C.: Strong coupling effects during Cu/In/Ni interfacial reactions at 280 °C. Intermetallics 58, 91–97 (2015).CrossRefGoogle Scholar
Dorini, T.T. and Eleno, L.T.F.: Thermodynamic reassessment of the Ni–In system using ab-initio data for end-member compound energies. Calphad 62, 42–48 (2018).CrossRefGoogle Scholar
Noren, L., Withers, R.L., and Tabira, Y.: New B8-B8 phases in the Ni–In system. J. Alloys Compd 309, 179–187 (2000).CrossRefGoogle Scholar
Shang, P.J., Liu, Z.Q., Li, D.X., and Shang, J.K.: Intermetallic compound identification and Kirkendall void formation in eutectic SnIn/Cu solder joint during solid-state aging. Philos. Mag. Lett. 91, 410–417 (2011).CrossRefGoogle Scholar
Baheti, V.A., Kashyap, S., Praveen, K., Chattopadhyay, K., and Paul, A.: Bifurcation of the Kirkendall marker plane and the role of Ni and other impurities on the growth of Kirkendall voids in the Cu–Sn system. Acta Mater. 131, 260–270 (2017).CrossRefGoogle Scholar
Yu, C., Yang, Y., Wang, Y.K., Xu, J.J., Chen, J.M., and Lu, H.: Relation between Kirkendall voids and intermetallic compound layers in the SnAg/Cu solder joints. J. Mater. Sci.: Mater. Electron 23, 124–129 (2012).Google Scholar
Liu, H., Wang, K., Aasmundtveit, K.E., and Hoivik, N.: Intermetallic compound formation mechanisms for Cu–Sn solid–liquid interdiffusion bonding. J. Electron. Mater. 41, 2453–2462 (2012).CrossRefGoogle Scholar
Chu, K., Sohn, Y., and Moon, C.: A comparative study of Cn/Sn/Cu and Ni/Sn/Ni solder joints for low temperature stable transient liquid phase bonding. Scr. Mater. 109, 113–117 (2015).CrossRefGoogle Scholar
Chen, L.D., Huang, M.L., and Zhou, S.M.: Effect of electromigration on intermetallic compound formation in line-type Cu/Sn/Cu and Cu/Sn/Ni interconnects. In 60th Electronic Components and Technology Conference (ECTC) (IEEE: Las Vegas, NV, USA, 2010).Google Scholar
Rizvi, M.J., Chan, Y.C., Bailey, C., Lu, H., Islam, M.N., and Wu, B.Y.: Wetting and reaction of Sn–2.8Ag–0.5Cu–1.0Bi solder with Cu and Ni substrates. J. Electron. Mater. 34, 1115–1122 (2005).CrossRefGoogle Scholar
Piao, S.Y. and Lidin, S.: A new compound in the Cu–In system—the synthesis and structure of Cu10In7. Z. Anorg. Allg. Chem. 634, 2589–2593 (2008).CrossRefGoogle Scholar
Sun, L., Chen, M.H., and Zhang, L.: Microstructure evolution and grain orientation of IMC in Cu–Sn TLP bonding solder joints. J. Alloys Compd. 786, 677–687 (2019).CrossRefGoogle Scholar
Pao, H., Huang, J.Y., Ji, H.J., and Li, M.Y.: Enhancing the solid/liquid interfacial metallurgical reaction of Sn + Cu composite solder by ultrasonic-assisted chip attachment. J. Alloys Compd. 784, 603–610 (2019).Google Scholar
Lee, J.B., Hwang, H.Y., and Rhee, M.W.: Reliability investigation of Cu/In TLP bonding. J. Electron. Mater. 44, 435–441 (2015).CrossRefGoogle Scholar
Li, H.L., Rong, A., Wang, C.Q., and Jiang, Z.: In situ quantitative study of microstructural evolution at the interface of Sn3.0Ag0.5Cu/Cu solder joint during solid state aging. J. Alloys Compd. 634, 94–98 (2015).CrossRefGoogle Scholar
El-Daly, A.A., Fawzy, A., Mansour, S.F., and Younis, M.J.: Thermal analysis and mechanical properties of Sn–1.0Ag–0.5Cu solder alloy after modification with SiC nano-sized particles. J. Mater. Sci.: Mater. Electron 24, 2976–2988 (2013).Google Scholar
Wu, F.S., Wang, B., Du, B., An, B., and Wu, Y.P.: Effect of stand-off height on microstructure and tensile strength of the Cu/Sn9Zn/Cu solder joint. J. Electron. Mater. 38, 860–865 (2009).CrossRefGoogle Scholar
Liu, C.M., Yu, D.J., and Chen, X.: Simulation implementation on the direction prediction of crack propagation based on the first principal stress. Key Eng. Mater. 795, 361–366 (2019).CrossRefGoogle Scholar
Bieler, T.R., Eisenlohr, P., Roters, F., Kumar, D., Mason, D.E., Crimp, M.A., and Raabe, D.: The role of heterogeneous deformation on damage nucleation at grain boundaries in single phase metals. Int. J. Plast. 25, 1655–1683 (2009).CrossRefGoogle Scholar
Lee, D.Y., Barrera, E.V., Stark, J.P., and Marcus, H.L.: The influence of alloying elements on impurity induced grain boundary embrittlement. Metall. Mater. Trans. A 15, 1415–1430 (1984).CrossRefGoogle Scholar
Briant, C.L.: On the chemistry of grain boundary segregation and grain boundary fracture. Metall. Mater. Trans. A 21, 2339–2354 (1990).CrossRefGoogle Scholar
Tian, F.F., Liu, Z.Q., and Guo, J.D.: Phase transformation between Cu(In,Sn)2 and Cu2(In,Sn) compounds formed on single crystalline Cu substrate during solid state aging. J. Appl. Phys. 115, 1335 (2014).CrossRefGoogle Scholar
Supplementary material: Image

Yang et al. Supplementary Materials

Yang et al. Supplementary Materials 1

Download Yang et al. Supplementary Materials(Image)
Image 114.5 KB
Supplementary material: Image

Yang et al. Supplementary Materials

Yang et al. Supplementary Materials 2

Download Yang et al. Supplementary Materials(Image)
Image 486.2 KB