Hostname: page-component-cd9895bd7-7cvxr Total loading time: 0 Render date: 2024-12-28T00:48:17.329Z Has data issue: false hasContentIssue false

Microwave sintering and properties of AlN/TiB2 composites

Published online by Cambridge University Press:  31 January 2011

Geng-fu Xu
Affiliation:
Department of Materials and Nuclear Engineering, University of Maryland, College Park, Maryland 20742
Yuval Carmel
Affiliation:
Institute for Research in Electronics and Applied Physics, University of Maryland, College Park, Maryland 20742
Tayo Olorunyolemi
Affiliation:
Institute for Research in Electronics and Applied Physics, University of Maryland, College Park, Maryland 20742
Isabel K. Lloyd
Affiliation:
Department of Materials and Nuclear Engineering and Institute for Research in Electronics and Applied Physics, University of Maryland, College Park, Maryland 20742
Otto C. Wilson Jr.
Affiliation:
Department of Materials and Nuclear Engineering and Institute for Research in Electronics and Applied Physics, University of Maryland, College Park, Maryland 20742
Get access

Abstract

The effect of TiB2 on the densification behavior and properties of microwave-sintered AlN/TiB2 ceramic was investigated. The densification of the composite was significantly retarded in nitrogen atmosphere due to strong nitridation of TiB2 compared to sintering in argon atmosphere. The densities of the AlN/TiB2 composites containing different amounts of TiB2 all reached 99% of the theoretical density during 2 h of sintering at 1850 and 1900 °C. Microstructure analysis revealed that the TiB2 particles were dispersed in the AlN matrix while AlN grains retained its contiguity. This microstructure led to a composite with superior properties; thermal conductivity as high as 149 W/(m K) was achieved. The microwave sintered composites are harder and tougher than pure AlN. Microwave-sintered AlN/TiB2 composite is a promising material for structural applications in which high thermal conductivity and controlled dielectric loss are important.

Type
Articles
Copyright
Copyright © Materials Research Society 2003

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Hale, D.K., J. Mater. Sci. 11, 2105 (1976).Google Scholar
2.Hatta, H. and Taya, M., Int. J. Eng. Sci. 24, 1159 (1986).Google Scholar
3.Calame, J.P. and Abe, D.K., Applications of Advanced Materials Technologies to Vacuum Electronic Devices, Proceedings of the IEEE (IEEE, Piscataway, NJ, 1999), Vol. 87, pp. 840864.Google Scholar
4.Borom, M.P., Slack, G.A., and Szymaszek, J.W., Am. Ceram. Soc. Bull. 51(11), 852 (1972).Google Scholar
5.Bhatt, H., Donaldson, K.Y., Hasselman, D.P.H., and Bhatt, R.T., J. Mater. Sci. 27, 6653 (1992).Google Scholar
6.Hasselman, D.P.H., in 20th International Thermal Conductivity Conference, edited by Hasselman, D.P.H. (Plenum Press, New York, 1989), pp. 141152.Google Scholar
7.Behrens, E., J. Compos. Mater. 2, 2 (1968).Google Scholar
8.Xu, G-f., Olorunyolemi, T., Carmel, Y., Wilson, O.C., Jr., and Lloyd, I.K., J. Mater. Res. 17(11), 2837 (2002).Google Scholar
9.Xu, G-f., Carmel, Y., Olorunyolemi, T., Wilson, O.C., Jr., and Lloyd, I.K., J. Am. Ceram. Soc. (in press).Google Scholar
10.Antis, G.R., Chantikul, P., Lawn, B.R., and Marshall, D.B., J. Am. Ceram. Soc. 64(9), 533 (1981).CrossRefGoogle Scholar
11.Samsonov, G.V. and Vinitskii, I.M., Refractory Compounds Handbook (in Russ.) (Mettalurgiya, Moscow, U.S.S.R., 1976).Google Scholar
12.Advanced Materials & Powders Handbook (American Ceramic Society Bulletin, Westerville, OH, 1999), pp. 6981.Google Scholar
13.Kittel, C., Introduction to Solid State Physics, 7th ed. (Wiley, New York, 1997).Google Scholar
14.Hasselman, D.P. and Johnson, E.F., J. Compos. Mater. 21(5), 508 (1987).CrossRefGoogle Scholar
15.Benveniste, Y., J. Appl. Phys. 61, 2840 (1987).CrossRefGoogle Scholar
16.Jackson, T.B., Vircar, A.V., More, K.L., Dinwiddie, R.B., Jr., and Cutler, R.A., J. Am. Ceram. Soc. 80, 1421 (1997).Google Scholar
17.Chang, E.K. and Kirschner, M.J., J. Mater. Sci. Lett. 15, 1580 (1996).Google Scholar
18.Buhr, H., Müller, G., Wiggers, H., Aldinger, F., Foley, P., Roosen, A., J. Am. Ceram. Soc. 74, 718 (1991).CrossRefGoogle Scholar
19.Bentsen, L.D., Hasselman, D.P.H., and Ruh, R., J. Am. Ceram. Soc. 66, C-4 (1983).CrossRefGoogle Scholar
20.Rafanieo, W., Cho, K., and Vircar, A., J. Mater. Sci. 16(12), 3479 (1981).CrossRefGoogle Scholar
21.Schneider, S.V., Desmaison-brut, M., Richter, G., Porz, F., Gault, C., Key Eng. Mater. 132–136, 524 (1997).CrossRefGoogle Scholar
22.Faber, K.T. and Evans, A.G., Acta Metall. 31, 565 (1983).Google Scholar
23.Evans, A.G. and Faber, K.T., J. Am. Ceram. Soc. 67, 394 (1981).Google Scholar
24.Tara, M., Hayashi, S., Kobayashi, A.S., and Yoon, H.S., J. Am. Ceram. Soc. 73, 1382 (1990).Google Scholar