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Monotonic and cyclic mechanical reliability of metallization lines on polymer substrates

Published online by Cambridge University Press:  21 April 2017

Oleksandr Glushko
Affiliation:
Erich Schmid Institute of Materials Science, Austrian Academy of Sciences and Department of Material Physics, Montanuniversität Leoben, Leoben A-8700, Austria
Andreas Klug
Affiliation:
NanoTecCenter Weiz Forschungsgesellschaft mbH, Weiz A-8160, Austria
Emil J.W. List-Kratochvil
Affiliation:
Institut für Physik, Institut für Chemie & IRIS Adlershof, Humboldt-Universität zu Berlin, Berlin 12489, Germany
Megan J. Cordill*
Affiliation:
Erich Schmid Institute of Materials Science, Austrian Academy of Sciences and Department of Material Physics, Montanuniversität Leoben, Leoben A-8700, Austria
*
a) Address all correspondence to this author. e-mail: megan.cordill@oeaw.ac.at
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Abstract

Mechanical stability of Ag and Cu printed and evaporated metallization lines on polymer substrates is investigated by means of monotonic tensile and cyclic bending tests. It is shown that lines which demonstrate good performance during monotonic tests fail at lower strains during a cyclic bending tests. Evaporated lines with the grain size of several hundreds of nanometers have good ductility and consequently good stability during monotonic loading but at the same time they fail at low strains during cyclic bending. Printed lines with nanocrystalline microstructure, in contrast, demonstrate more intensive cracking during monotonic loading but higher failure strains during cyclic bending. Apart from the grain size effect, the effect of film thickness on the saturation crack density after cyclic bending is also demonstrated. Thinner films have higher crack density in accordance with the shear lag model.

Type
Articles
Copyright
Copyright © Materials Research Society 2017 

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Footnotes

b)

Present Address: AVL List GmbH, Hans-List-Platz 1, A-8020 Graz, Austria, andreas.klug@avl.com

Contributing Editor: Erik G. Herbert

References

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