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Nanocrystalline diamond films prepared by pulsed electron beam ablation on different substrates

Published online by Cambridge University Press:  26 August 2015

Redhouane Henda*
Affiliation:
School of Engineering, Laurentian University, Sudbury, Ontario P3E 2C6, Canada
Omar Alshekhli
Affiliation:
Jubail Technical Institute, Saudia Arabia
Matiar Howlader
Affiliation:
Department of Electrical and Computer Engineering, McMaster University, Hamilton, Ontario L8S 4K1, Canada
Jamal Deen
Affiliation:
Department of Electrical and Computer Engineering, McMaster University, Hamilton, Ontario L8S 4K1, Canada
*
a)Address all correspondence to this author. e-mail: rhenda@laurentian.ca
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Abstract

Nanocrystalline diamond films have been deposited by pulsed electron beam ablation from a single target and on different substrates at room temperature and under argon background gas at 0.5 Pa. The films have been deposited from a highly ordered pyrolytic graphite target on four different substrate materials, which include silicon, stainless steel, sapphire, and cubic boron nitride. Based on experimental measurement data, obtained from various analytical techniques, it has been observed that sp3 bonded carbon content, grain size, film roughness, and nanocrystalline fraction of the films do not seem to be much affected by the type of substrate material used. The thickness of the films, in the range of ∼70–90 nm, seems to be relatively the same irrespective of the substrate material. Hardness measurements have shown that film hardness, ranging between 18.5 and 19.5 GPa, is not remarkably influenced by the type of substrate material.

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Article
Copyright
Copyright © Materials Research Society 2015 

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References

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