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A new method for mechanical testing of thin films: Application to aluminum

Published online by Cambridge University Press:  31 January 2011

T. Kruml ,
M. Stranyanek ,
R. Ctvrtlik ,
P. Bohac ,
T. Vystavel  and
P. Panek
T. Kruml*
Affiliation:
Institute of Physics of Materials AS CR, 61662 Brno, Czech Republic
M. Stranyanek
Affiliation:
Institute of Physics of Materials AS CR, 61662 Brno, Czech Republic
R. Ctvrtlik
Affiliation:
Institute of Physics AS CR, 182 21 Prague 8, Czech Republic; and Joint Laboratory of Optics, Palacky University and Institute of Physics AS CR, 77207 Olomouc, Czech Republic
P. Bohac
Affiliation:
Institute of Physics AS CR, 182 21 Prague 8, Czech Republic
T. Vystavel
Affiliation:
FEI Company, 61200 Brno, Czech Republic
P. Panek
Affiliation:
ON Semiconductor Czech Republic, 75661 Roznov pod Radhostem, Czech Republic
*
a) Address all correspondence to this author. e-mail: kruml@ipm.cz
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Abstract

A new method for measuring plastic properties of thin films deposited on a substrate is presented. Micrometric cylindrical specimens with the axis perpendicular to the film surface were prepared by milling out the surrounding material using the focused ion beam technique. Such specimens were deformed by means of a nanoindenter outfitted with a flat diamond tip. An equivalent to the macroscopic compressive curve was obtained. Elastic modulus and hardness of the film were then measured using a Berkovich tip. The precise knowledge of the gage length and the independent measurement of elastic properties enable the accurate determination of the stress–strain curve. As compared with the results published in the literature on the specimens with the same dimensions, the studied material deforms less heterogeneously, probably as a consequence of the symmetric crystallographic orientation of the specimens.

Keywords

AlFilmStress/strain relationship
Type
Articles
Information
Journal of Materials Research , Volume 24 , Issue 4 , April 2009 , pp. 1353 - 1360
Copyright
Copyright © Materials Research Society 2009

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