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Phase Equilibria in the Sn-Rich Corner of the Sn–Cu–Ni Ternary Alloy System at 240 °C

Published online by Cambridge University Press:  03 March 2011

Chia-Ying Li  and
Jenq-Gong Duh
Chia-Ying Li
Affiliation:
Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan 300, People’s Republic of China
Jenq-Gong Duh
Affiliation:
Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan 300, People’s Republic of China
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Abstract

The interfacial reactions between solders and under bump metallization (UBM) have been of great interest recently in flip chip technology. Intermetallic compounds (IMCs), i.e., (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4, usually formed between solders and UBM. To fully understand the interfacial reactions and phase transformation phenomenon, a suitable phase diagram concerning solders, IMCs, and UBM materials is required. In particular, a Sn-rich phase region in the Sn–Cu–Ni ternary diagram is very critical in determining the concentration tendency of x and y values in (Ni1−x,Cux)3Sn4 and (Cu1−y,Niy)6Sn5 compounds. In this study, ternary Sn–Cu–Ni alloys were prepared and annealed at 240 °C. Three equilibrium phases, Sn, Ni3Sn4, and Cu6Sn5, were identified by x-ray diffraction analysis and also showed in backscattered electron imaging. Using electron probe microanalysis quantitative analysis, three acme compositions of the ternary region in the Sn–Cu–Ni isotherm near the Sn-rich corner were determined as 98.5 at.% Sn, (Ni0.80, Cu0.20)3Sn4 and (Cu0.59,Ni0.41)6Sn5. In addition, the solubility of Cu and Ni in (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 compounds was evaluated. Finally, the isothermal section of the ternary Sn–Cu–Ni system at 240 °C was proposed on the basis of experimental results in this study.

Keywords

Intermetallic alloysPhase equilibriaX-ray diffraction (XRD)
Type
Articles
Information
Journal of Materials Research , Volume 20 , Issue 11 , November 2005 , pp. 3118 - 3124
Copyright
Copyright © Materials Research Society 2005

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References

REFERENCES

1Lau, J.H.: Flip Chip Technologies (McGraw-Hill, New York, 1996), pp. 26–30.Google Scholar
2Lee, T.Y., Choi, W.J., Tu, K.N., Jang, J.W., Kuo, S.M., Lin, J.K., Frear, D.R., Zeng, K. and Kivilahti, J.K.: Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu. J. Mater. Res. 17, 291 (2002).CrossRefGoogle Scholar
3Chang, C.S., Oscilowski, A. and Bracken, R.C.: Future challenges in electronics packaging. IEEE Circuits Dev. 14, 45 (1998).CrossRefGoogle Scholar
4Loomans, M.E., Vaynman, S., Ghosh, G. and Fine, M.E.: Investigation of multicomponent lead-free solder. J. Electron. Mater. 23, 741 (1994).CrossRefGoogle Scholar
5Liu, A.A., Kim, H.K., Tu, K.N. and Totta, P.A.: Spalling of Cu6Sn5 spheroids in the soldering reaction of eutectic SnPb on Cr/Cu/Au thin films. J. Appl. Phys. 80, 2774 (1996).CrossRefGoogle Scholar
6Lin, K.L. and Liu, Y.C.: Manufacturing of Cu/electroless nickel/Sn–Pb flip chip solder bumps. IEEE Trans. Adv. Packag. 22, 575 (1999).Google Scholar
7Kim, H.K., Tu, K.N. and Totta, P.A.: Ripening-assisted asymmetric spalling of Cu–Sn compound spheroids in solder joints on Si wafers. Appl. Phys. Lett. 68, 2204 (1996).CrossRefGoogle Scholar
8Harper, C.A.: Electronic Packaging and Interconnection Handbook, 3rd ed. (McGraw-Hill, New York, 2000), pp. 6.78–6.82.Google Scholar
9Abtew, M. and Selvaduray, G.: Lead-free solders in microelectronics. Mater. Sci. Eng. R-Rep. 27, 95 (2001).CrossRefGoogle Scholar
10Morris, J.W., Goldstein, J.L.F. and Mei, Z.: Microstructure and mechanical-properties of Sn–In and Sn–Bi Solders. JOM 45, 25 (1993).CrossRefGoogle Scholar
11Zeng, K. and Tu, K.N.: Six cases of reliability study of Pb-free solder joints in electronic packaging technology. Mater. Sci. Eng. R-Rep. 38, 55 (2002).CrossRefGoogle Scholar
12Young, C.C., Duh, J.G. and Tsai, S.Y.: Microstructural evoluation in the Sn–Cu–Ni and Pb–Sn solder joints with Cu and Pt–Ag metallized Al2O3 substrate. J. Electron. Mater. 30, 1241 (2001).CrossRefGoogle Scholar
13Lee, Y.G. and Duh, J.G.: Interfacial morphology and concentration profile in the unleaded solder/Cu joint assembly. J. Mater. Sci. 10, 33 (1999).Google Scholar
14Lee, Y.G. and Duh, J.G.: Phase analysis in the solder joint of Sn–Cu solder/IMC/Cu substrate. Mater. Charact. 42, 143 (1999).CrossRefGoogle Scholar
15Zeng, K., Vuorinen, V. and Kivilahti, J.K.: Interfacial reactions between lead-free SnAgCu solder and Ni(P) surface finish on printed circuit boards. IEEE Trans. Electron. Packag. Manuf. 25, 162 (2002).CrossRefGoogle Scholar
16Tsai, J.Y., Hu, Y.C., Tsai, C.M. and Kao, C.R.: A study on the reaction between cu and Sn3.5Ag solder doped with small amounts of Ni. J. Electron. Mater. 32, 1203 (2003).CrossRefGoogle Scholar
17Ghosh, G.: Interfacial microstructure and the kinetics of interfacial reaction in diffusion couples between Sn–Pb solder and Cu/Ni/Pd metallization. Acta Mater. 48, 3719 (2000).CrossRefGoogle Scholar
18Young, B.L. and Duh, J.G.: Interfacial reaction and microstructural evolution for electroplated Ni and electroless Ni in the under bump metallurgy with 42Sn58Bi solder during annealing. J. Electron. Mater. 30, 878 (2001).CrossRefGoogle Scholar
19Kang, S.K., Rai, R.S. and Purushothaman, S.: Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich solders. J. Electron. Mater. 25, 1113 (1996).CrossRefGoogle Scholar
20Lin, C.R., Chen, S.W. and Wang, C.H.: Phase equilibria and solidification properties of Sn–Cu–Ni alloys. J. Electron. Mater. 31, 907 (2002).CrossRefGoogle Scholar
21Huang, C.S., Duh, J.G., Chen, Y.M. and Wang, J.H.: Effects of Ni thickness and reflow times on interfacial reactions between Ni/Cu under-bump metallization and eutectic Sn–Pb solder in flip-chip technology. J. Electron. Mater. 32, 89 (2003).CrossRefGoogle Scholar
22Huang, C.S., Yeh, J.H., Young, B.L. and Duh, J.G.: Phenomena of electroless Ni–P and intermetallic-compound stripping and dissolving in Sn–Bi and Sn–Pb solder joints with Au/EN/Cu metallization. J. Electron. Mater. 31, 1230 (2002).CrossRefGoogle Scholar
23Huang, C.S. and Duh, J.G.: Interface reactions and phase equilibrium between Ni/Cu under-bump metallization and eutectic SnPb flip-chip solder bumps. J. Mater. Res. 18, 935 (2003).CrossRefGoogle Scholar
24Jang, G.Y., Huang, C.S., Hsiao, L.Y. and Duh, J.G.: Mechanism of interfacial reaction for Sn–Pb solder bump with Ni/Cu UBM in flip chip technology. J. Electron. Mater. 33, 1118 (2004).CrossRefGoogle Scholar
25Goldstein, J.I., Newbury, D.E., Echlin, P., Joy, D.C., Lyman, C.E., Lifshin, E., Sawyer, L. and Michael, J.R.: Scanning Electron Microscopy and X-ray Microanalysis, 3rd ed. (Plenum Press, New York, 2003), pp. 391–420.CrossRefGoogle Scholar