Hostname: page-component-cd9895bd7-hc48f Total loading time: 0 Render date: 2024-12-28T00:44:18.974Z Has data issue: false hasContentIssue false
  • English
  • Français

Prediction of formation of intermetallic compounds in diffusion couples

Published online by Cambridge University Press:  31 January 2011

Huashan Liu ,
Hang Wang ,
Wenjun Zhu ,
Xiaoma Tao  and
Zhanpeng Jin
Huashan Liu*
Affiliation:
School of Materials Science and Engineering, Central South University, Changsha, Hunan 410083, People’s Republic of China
Hang Wang
Affiliation:
School of Materials Science and Engineering, Central South University, Changsha, Hunan 410083, People’s Republic of China
Wenjun Zhu
Affiliation:
School of Materials Science and Engineering, Central South University, Changsha, Hunan 410083, People’s Republic of China
Xiaoma Tao
Affiliation:
School of Materials Science and Engineering, Central South University, Changsha, Hunan 410083, People’s Republic of China
Zhanpeng Jin
Affiliation:
School of Materials Science and Engineering, Central South University, Changsha, Hunan 410083, People’s Republic of China
*
a)Address all correspondence to this author. e-mail: hsliu@mail.csu.edu.cn
Get access

Abstract

Formation of intermetallic compounds (IMCs) at the interface between two metals during soldering processing exerts much influence on the electrical and mechanical performance of integrate circuits (ICs). Considering both of the thermodynamic and kinetic factors (including nucleation and growth) on phase formation, a new model capable of predicting phase formation sequence at the interface between two metals with different structures has been proposed in this work. Application of this new model on the interfacial reactions between pure elemental pairs of metals such as Ni/Sn, Cu/In, Cu/Sn, and Co/Sn at different temperatures shows good agreement between predictions by this model and experimental observations.

Keywords

KineticsPhase transformationSoldering
Type
Articles
Information
Journal of Materials Research , Volume 22 , Issue 6 , June 2007 , pp. 1502 - 1511
Copyright
Copyright © Materials Research Society2007

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1Bader, S., Gust, W.Hieber, H.: Rapid formation of intermetallic compounds by interdiffusion in the Cu–Sn and Ni–Sn systems. Acta Metall. Mater. 43, 329 1995Google Scholar
2Tu, K.N.Rosenburg, R.: Room temperature interaction in bimetallic thin film couples. Jpn. J. Appl. Phys.(Suppl. 2, Part 1) 633 1974CrossRefGoogle Scholar
3Gur, D.Bamaerger, M.: Reactive isothermal solidification in the Ni–Sn system. Acta Mater. 46, 4917 1998CrossRefGoogle Scholar
4Tu, K.N.: Interdiffusion and reaction in bimetallic Cu–Sn thin films. Acta Metall. 21, 347 1973CrossRefGoogle Scholar
5Chopra, R.Ohring, M.: Low temperature compound formation in Cu/Sn thin film couples. Thin Solid Films 94, 279 1982CrossRefGoogle Scholar
6Su, L.H., Yen, Y.W., Lin, C.C.Chen, S.W.: Interfacial reactions in molten Sn/Cu and molten In/Cu couples. Metall. Mater. Trans. B 28, 927 1997CrossRefGoogle Scholar
7Manna, I., Bader, S., Gust, W.Predel, B.: Interdiffusion between In layer and bulk Cu or Cu–In alloy. Phys. Status Solidi A 119, K9 1990CrossRefGoogle Scholar
8Roy, R., Sen, S.K.Sen, S.: Formation of intermetallics in Cu/In thin films. J. Mater. Res. 7, 1377 1992CrossRefGoogle Scholar
9Johnson, W.L.: Non-equilibrium processing of materials. Prog. Mater. Sci. 30, 81 1986CrossRefGoogle Scholar
10d’Heurle, F.M.: Nucleation of a new phase from the interaction of two adjacent phases: Some silicides. J. Mater. Res. 3, 167 1988CrossRefGoogle Scholar
11Clevenger, L.A.Thompson, C.V.: Nucleation-limited phase selection during reactions in nickel/amorphous-silicon multilayer thin films. J. Appl. Phys. 67, 1323 1990Google Scholar
12Thompson, C.V.: On the role of diffusion in phase selection during reactions at interfaces. J. Mater. Res. 7, 367 1992CrossRefGoogle Scholar
13Turnbull, D.: Solid State Physics, edited by F. Seitz and D. Turnbull (Academic Press, New York, 1956), Vol. 3, p. 225CrossRefGoogle Scholar
14Lee, B.J., Hwang, N.M.Lee, H.M.: Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation. Acta Mater. 45, 1867 1997CrossRefGoogle Scholar
15Choi, W.K.Lee, H.M.: Prediction of primary intermetallic compound formation during interfacial reaction between Sn-based solder and Ni substrate. Scripta Mater. 46, 777 2002CrossRefGoogle Scholar
16Nishizawa, T.Chiba, A.: Phenomenological consideration on inter-phase equilibrium in diffusion couple. J. Jpn. Inst. Met. 34, 629 1970CrossRefGoogle Scholar
17Gösele, U.Tu, K.N.: Growth kinetics of planar binary diffusion couples: “Thin-film case” versus “Bulk cases.” J. Appl. Phys. 53, 3252 1982CrossRefGoogle Scholar
18Thompson, C.V., Clevenger, L.A., DeAvillez, R.R., Ma, E.Miura, H.Kinetics and thermodynamics of amorphous silicide formation in metal/amorphous-silicon multilayer thin films, in Thin Film Structures and Phase Stability,edited by B.M. Clemens and W.L. Johnson, (Mater. Res. Soc. Symp. Proc. 187, Pittsburgh, PA, 1990), p. 61CrossRefGoogle Scholar
19Highmore, R.J., Greer, A.L., Leake, J.A.Evetts, J.E.: Transient nucleation model for solid state amorphisation. Mater. Lett. 6, 401 1988CrossRefGoogle Scholar
20Van Loo, F.J.J.: Multiphase diffusion in binary and ternary solid-state systems. Prog. Solid State Chem. 20, 47 1990CrossRefGoogle Scholar
21Zeng, K.Kivilahti, J.K.: Use of multicomponent phase diagrams for predicting phase evolution in solder/conductor systems. J. Electr. Mater. 30, 35 2001CrossRefGoogle Scholar
22Liu, C.L., Liu, H.S.Jin, Z.P.: Application of CALPHAD in soldering of electronic materials. Chinese J. Trans. Non-Ferr. Met. 13, 1343 2003Google Scholar
23Wang, J., Liu, H.S., Liu, L.B.Jin, Z.P.: Interfacial reaction between Sn–Bi alloy and Ni substrate. J. Electron. Mater. 35, 1842 2006CrossRefGoogle Scholar
24Johnson, W.A.Mehl, R.F.: Reaction kinetics of nucleation and growth. Trans. AIME 135, 416 1939Google Scholar
25Toschev, S.Gutzow, I.: Time lag in heterogeneous nucleation due to nonstationary effects. Phys. Status Solidi 21, 683 1967CrossRefGoogle Scholar
26Kelly, T.F., Cohen, M.Sande, J.B. Vander: Rapid solidification of a droplet-prcessed stainless steel. Metall. Trans. A 15, 819 1984CrossRefGoogle Scholar
27Hillert, M.Fick’s first law and its application, in Diffusion and Thermodynamics in Alloys, translated by H.Y. Lai and G. X. Liu (Press of Metallurgic Industry, Beijing, China, 1984)Google Scholar
28Christian, J.W.The Theory of Transformations in Metals and Alloys, 1st ed., (Pergamon Press, Oxford, UK, 1965), p. 537Google Scholar
29Gagliano, R.A.Fine, M.E.: Thickening kinetics of interfacial Cu6Sn5and Cu3Sn layers during reaction of liquid tin with solid copper. J. Electron. Mater. 32, 1441 2003CrossRefGoogle Scholar
30Shim, J.H., Oh, C.S., Lee, B.J.Lee, D.N.: Thermodynamic assessment of the Cu–Sn system. Z. Metallkd. 87, 205 1996Google Scholar
31Chen, S.W., Lee, S.W.Yip, M.C.: Mechanical properties and intermetallic compound formation at the Sn/Ni and Sn–0.7wt%Cu/Ni joints. J. Electron. Mater. 32, 1284 2003CrossRefGoogle Scholar
32Kang, S.K.Ramachandran, V.: Growth kinetics of intermetallic phases at the liquid Sn and solid Ni interface. Scripta Metall. 14, 421 1980CrossRefGoogle Scholar
33Kim, J.H., Jeong, S.W., Kim, H.D.Lee, H.M.: Morphological transition of interfacial Ni3Sn4grains at the Sn–3.5Ag/Ni joint. J. Electr. Mater. 32, 1228 2003CrossRefGoogle Scholar
34Liu, H.S., Wang, J.Jin, Z.P.: Thermodynamic optimization of the Ni–Sn binary system. CALPHAD 28, 363 2004CrossRefGoogle Scholar
35Liu, H.S., Liu, X.J., Cui, Y., Wang, C.P., Ohnuma, I., Kainuma, R., Jin, Z.P.Ishida, K.: Thermodynamic assessment of the Cu–In binary system. J. Phase Equil. 23, 409 2002CrossRefGoogle Scholar
36Guilmin, P., Guyot, P.Marchal, G.: Amorphization of crystalline Co and Sn multilayers by solid state reaction. Phys. Lett. A 109, 174 1985CrossRefGoogle Scholar
37Jiang, M., Sato, J., Ohnuma, I., Kainuma, R.Ishida, K.: A thermodynamic assessment of the Co–Sn system. CALPHAD 28, 213 2004CrossRefGoogle Scholar
38Fecht, H.J.Johson, W.L.: Entropy and enthalpy catastrophe as a stability limit for crystalline material. Nature 334, 50 1988CrossRefGoogle Scholar
39Eustathopoulos, N., Coudurier, L., Joud, J.C.Desré, P.: Thermodynamic study of solid/liquid interface tension for a binary metal system.: Pt. 3. Experimental study of the Cu–Pb system—Application to the determination of the interface tension of pure Cu. J. Chim. Phys. 71, 1465 1974CrossRefGoogle Scholar