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Role of titanium on the reactive spreading of lead-free solders on alumina

Published online by Cambridge University Press:  03 March 2011

Laurent Gremillard ,
Eduardo Saiz ,
Velimir R. Radmilovic  and
Antoni P. Tomsia
Laurent Gremillard*
Affiliation:
Materials Sciences Division, Lawrence Berkeley National Laboratory (MSD-LBNL), Berkeley, California 94720; and Materials Science Department, UMR CNRS 5510, National Institute of Applied Science (GEMPPM-INSA), 69621 Villeurbanne, France
Eduardo Saiz
Affiliation:
Materials Sciences Division, Lawrence Berkeley National Laboratory (MSD-LBNL), Berkeley, California 94720
Velimir R. Radmilovic
Affiliation:
National Center for Electron Microscopy, Lawrence Berkeley National Laboratory (NCEM-LBNL), Berkeley, California 94720
Antoni P. Tomsia
Affiliation:
Materials Sciences Division, Lawrence Berkeley National Laboratory (MSD-LBNL), Berkeley, California 94720
*
a) Address all correspondence to this author. e-mail: laurent.gremillard@insa-lyon.fr
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Abstract

The wetting of Sn3Ag-based alloys on Al2O3 has been studied using the sessile-drop configuration. Small additions of Ti decrease the contact angle of Sn3Ag alloys on alumina from 115° to 23°. Adsorption of Ti-species at the solid–liquid interface prior to reaction is the driving force for the observed decrease in contact angle, and the spreading kinetics is controlled by the kinetics of Ti dissolution into the molten alloy. The addition of Ti increases the transport rates at the solid–liquid interface, resulting in the formation of triple-line ridges that pin the liquid front and promote a wide variability in the final contact angles.

Keywords

MicrostructureSolderingSurface reaction
Type
Articles
Information
Journal of Materials Research , Volume 21 , Issue 12 , December 2006 , pp. 3222 - 3233
Copyright
Copyright © Materials Research Society 2006

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