Hostname: page-component-cd9895bd7-gbm5v Total loading time: 0 Render date: 2024-12-28T15:50:26.606Z Has data issue: false hasContentIssue false
  • English
  • Français

Selective laser sintering of composite copper–tin powders

Published online by Cambridge University Press:  12 August 2014

David C. Walker ,
William F. Caley  and
Mathieu Brochu
David C. Walker*
Affiliation:
Department of Mining and Materials Engineering, McGill University, Montréal, Quebec, Canada
William F. Caley
Affiliation:
Department of Process Engineering and Applied Science, Dalhousie University, Halifax, Nova Scotia, Canada
Mathieu Brochu
Affiliation:
Department of Mining and Materials Engineering, McGill University, Montréal, Quebec, Canada
*
a)Address all correspondence to this author. e-mail: david.walker@mail.mcgill.ca
Get access

Abstract

Selective laser sintering (SLS) is a rapidly developing additive manufacturing technique, with advantages in flexibility and low material waste. Many parameters used in a SLS process are determined by powder type: blended powders have limitations due to wetting and diffusion, while prealloyed powders require processing in a small temperature range dictated by the alloy composition. As an alternative to these, a coated powder was fabricated by electrochemical means. This tin–copper composite powder was compared with a blend of tin and copper powders, using metallographic, crystallographic, and thermal analysis techniques as well as SLS. It was found that, because of the uniform distribution of liquid and increased contact between phases in the composite powder, sintering took place in the composite powder but not in the blend. After a homogenization treatment, mechanical testing of the sintered samples showed that the strength and ductility were comparable to high-porosity materials produced using other techniques.

Type
Articles
Information
Journal of Materials Research , Volume 29 , Issue 17: Focus Issue: The Materials Science of Additive Manufacturing , 14 September 2014 , pp. 1997 - 2005
Copyright
Copyright © Materials Research Society 2014 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Kruth, J.P., Levy, G., Klocke, F., and Childs, T.H.C.: Consolidation phenomena in laser and powder-bed based layered manufacturing. CIRP Ann.-Manuf. Technol. 56(2), 730 (2007).Google Scholar
Gu, D. and Shen, Y.: Balling phenomena in direct laser sintering of stainless steel powder: Metallurgical mechanisms and control methods. Mater. Des. 30(8), 2903 (2009).Google Scholar
Hasouna, A.T., Nogi, K., and Ogino, K.: Effects of temperature and atmosphere on the wettability of solid copper by liquid tin. Trans. Jpn. Inst. Met. 29(9), 748 (1988).Google Scholar
Gu, D. and Shen, Y.: Effects of dispersion technique and component ratio on densification and microstructure of multi-component Cu-based metal powder in direct laser sintering. J. Mater. Process. Technol. 182(1–3), 564 (2007).CrossRefGoogle Scholar
Kruth, J.P., Van der Schueren, B., Bonse, J.E., and Morren, B.: Basic powder metallurgical aspects in selective metal powder sintering. CIRP Ann.-Manuf. Technol. 45(1), 183 (1996).Google Scholar
Kathuria, Y.P.: Microstructuring by selective laser sintering of metallic powder. Surf. Coat. Technol. 116–119(0), 643 (1999).Google Scholar
Agarwala, M., Bourell, D., Beaman, J., Marcus, H., and Barlow, J.: Direct selective laser sintering of metals. Rapid Prototyping J. 1(1), 26 (1995).Google Scholar
Klocke, F. and Wagner, C.: Coalescence behaviour of two metallic particles as base mechanism of selective laser sintering. CIRP Ann.-Manuf. Technol. 52(1), 177 (2003).Google Scholar
Saunders, N. and Miodownik, A.P.: The Cu-Sn (copper-tin) system. Bull. Alloy Phase Diagrams 11(3), 278 (1990).Google Scholar
Price, J.W.: Tin and Tin Alloy Plating (Electrochemical Publications Limited, Ayr, Scotland, 1983).Google Scholar
German, R.M.: Powder Metallurgy & Particulate Materials Processing (Metal Powder Industries Federation, Princeton, NJ, 2005).Google Scholar
German, R.M.: Particle Packing Characteristics (Metal Powder Industries Federation, Princeton, NJ, 1989).Google Scholar
Fujiwara, Y. and Enomoto, H.: Intermetallic phase formation in electrochemical alloy deposition. J. Solid State Electrochem. 8(3), 167 (2004).Google Scholar
Zhai, W., Wang, W.L., Geng, D.L., and Wei, B.: A DSC analysis of thermodynamic properties and solidification characteristics for binary Cu–Sn alloys. Acta Mater. 60(19), 6518 (2012).Google Scholar
Fürtauer, S., Li, D., Cupid, D., and Flandorfer, H.: The Cu–Sn phase diagram, Part I: New experimental results. Intermetallics 34(0), 142 (2013).Google Scholar
Mei, Z., Sunwoo, A.J., and Morris, J.W.: Analysis of low-temperature intermetallic growth in copper-tin diffusion couples. Metall. Trans. A 23(3), 857 (1992).Google Scholar
Tuah-Poku, I., Dollar, M., and Massalski, T.B.: A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint. Metall. Trans. A 19(3), 675 (1988).Google Scholar
Zhou, Y.: Analytical modeling of isothermal solidification during transient liquid phase (TLP) bonding. J. Mater. Sci. Lett. 20(9), 841 (2001).Google Scholar
Kennon, N.F. and Bowles, J.S.: The crystallography of the B.C.C. to orthorhombic γ′1 martensite transformation in copper-tin alloys. Acta Metall. 17(4), 373 (1969).Google Scholar
Saunders, N. and Miodownik, A.P.: Phase formation in co-deposited metallic alloy thin films. J. Mater. Sci. 22(2), 629 (1987).Google Scholar
Castrodeza, E.M. and Mapelli, C.: Processing of brass open-cell foam by silica-gel beads replication. J. Mater. Process. Technol. 209(11), 4958 (2009).Google Scholar
Ramirez, D.A., Murr, L.E., Li, S.J., Tian, Y.X., Martinez, E., Martinez, J.L., Machado, B.I., Gaytan, S.M., Medina, F., and Wicker, R.B.: Open-cellular copper structures fabricated by additive manufacturing using electron beam melting. Mater. Sci. Eng., A 528(16–17), 5379 (2011).Google Scholar
Shehata Aly, M., Almajid, A., Nakano, S., and Ochiai, S.: Fracture of open cell copper foams under tension. Mater. Sci. Eng., A 519(1–2), 211 (2009).Google Scholar
Parvanian, A.M. and Panjepour, M.: Mechanical behavior improvement of open-pore copper foams synthesized through space holder technique. Mater. Des. 49(0), 834 (2013).Google Scholar