Hostname: page-component-cd9895bd7-jn8rn Total loading time: 0 Render date: 2024-12-28T00:34:07.315Z Has data issue: false hasContentIssue false
  • English
  • Français

Silver-copper oxide based reactive air braze for joining yttria-stabilized zirconia

Published online by Cambridge University Press:  01 March 2005

J.Y. Kim ,
J.S. Hardy  and
K.S. Weil
J.Y. Kim
Affiliation:
Pacific Northwest National Laboratory, Richland, Washington 99352
J.S. Hardy
Affiliation:
Pacific Northwest National Laboratory, Richland, Washington 99352
K.S. Weil
Affiliation:
Pacific Northwest National Laboratory, Richland, Washington 99352
Get access

Abstract

We investigated a new method of ceramic-to-metal joining, referred to as reactive air brazing, as a potential method of sealing ceramic components in high-temperature electrochemical devices. Sessile drop wetting experiments and joint strength testing were conducted using yttria stabilized zirconia (YSZ) substrates and CuO–Ag-based air brazes. Results from our studies indicate that the wettability of the braze improves substantially with increasing CuO content, over a compositional range of 1–8 mol% CuO, which is accompanied by an increase in the bend strength of the corresponding brazed YSZ joint. The addition of a small amount of TiO2 (0.5 mol%) to the CuO–Ag braze further improves wettability due to the formation of a titanium zirconate reaction product along the braze/substrate interface. However, with one notable exception, the bend strength of these ternary braze joints remained nearly identical to those measured in comparable binary braze joints. Scanning electron microscopy analysis conducted on the corresponding fracture surfaces indicated that in the binary braze joints, failure occurs primarily at the braze/YSZ interface. Similarly in the case of the ternary, TiO2-doped brazes joint failure occurs predominantly along the interface between the braze filler metal and the underlying titanium zirconate reaction layer.

Keywords

BrazingMechanical propertiesMicrostructure
Type
Articles
Information
Journal of Materials Research , Volume 20 , Issue 3 , March 2005 , pp. 636 - 643
Copyright
Copyright © Materials Research Society 2005

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Eichler, K., Solow, G., Otschik, P. and Schaffrath, W.: Degradation effects of sealing glasses for the SOFG, in Proceedings of the Fourth European Solid Oxide Fuel Cell Forum, edited by McEvoy, A.J. (European Fuel Cell Forun, Oberrohrdorf, Switzerland, 2000), p. 899.Google Scholar
2.Singh, M., Shibayama, T., Hinoki, T., Ando, M., Katoh, Y. and Kohyama, A.: Joining of silicon carbide composites for fusion energy applications. J. Nucl. Mater. 283–287B, 1258 (2000).Google Scholar
3.Pippel, E., Woltersdorf, J., Colombo, P. and Donato, A.: Structure and composition of interlayers in joints between SiC bodies. J. Eur. Ceram. Soc. 17, 1259 (1997).CrossRefGoogle Scholar
4.Kim, J-H. and Yoo, Y-C.: Bonding of alumina to metals with Ag-Cu-Zr brazing alloy. J. Mater. Sci. Lett. 16, 1212 (1997).CrossRefGoogle Scholar
5.Rice, J.P., Paxton, D.M. and Weil, K.S.: Oxidation behavior of a commercial gold-based braze alloy for cermic-to-metal joining, in Ceramic Engineering and Science Proceedings, edited by Lin, H-T. and Singh, M. (Am. Ceram. Soc., Westerville, OH, 2002), p. 809.Google Scholar
6.Weil, K.S., Hardy, J.S. and Kim, J.Y.: Use of a novel ceramic-metals braze for joining in high-temperature electrochemical devices, in The Joining of Advanced and Specialty Materials V, edited by Indacochea, J.E., DuPont, J.N., Lienert, T.J., Tillmann, W., Sobczak, N., Gale, W.F., and Singh, M. (ASM International, Materials Park, OH, 2003), p. 47.Google Scholar
7.Hardy, J.S., Kim, J.Y. and Weil, K.S.: Joining mixed conducting oxides using an air-fired electrically conductive braze. J. Electrochem. Soc. 151, J43 (2004).CrossRefGoogle Scholar
8.Kim, J.Y. and Weil, K.S.: Development of a copper oxide - silver braze for ceramic joining, in Advances in Joining of Ceramics, edited by Lewinsohn, Charles A., Singh, Mrityunjay, and Loehman, Ronald (Ceramic Transaction 138, American Ceramic Society, Westerville, OH, 2002 , pp. 119–132.CrossRefGoogle Scholar
9.Kim, J.Y., Hardy, J.S., and Weil, K.S.: Effects of CuO content on wetting behavior and mechanical properties of CuO–Ag braze for ceramic joining. J. Am. Ceram. Soc. (in press).Google Scholar
10.Meier, A.M., Chidambaram, P.R. and Edwards, G.R.: A comparison of the wettability of copper-copper oxide and silver-copper oxide on polycrystalline alumina. J. Mater. Sci. 30, 4781 (1995).CrossRefGoogle Scholar
11.Shüler, C.C., Stuck, A., Beck, N., Keser, H. and Täck, U.: Direct silver bonding—An alternative for substrates in power semiconductor packaging. J. Mater. Sci. Mater. Electron. 11, 389 (2000).CrossRefGoogle Scholar
12.Lu, F-H., Fang, F-X. and Chen, Y-S.: Eutectic reaction between copper oxide and titanium dioxide. J. Eur. Cer. Soc. 21, 1093 (2001).CrossRefGoogle Scholar
13.Mortimer, D.A. and Nicholas, M.G.: The wetting of carbon and carbides by copper alloys. J. Mater. Sci. 8, 640 (1973).CrossRefGoogle Scholar
14.Locatelli, M.R., Tomsia, A.P., Nakashima, K., Dalgleish, B.J. and Glaeser, A.M.: New strategies for joining ceramics for high-temperature applications. Key Eng. Mater. 111–112, 157 (1995).CrossRefGoogle Scholar
15.Cahn, J.W.: Critical point wetting. J. Chem. Phys. 66, 3667 (1977).CrossRefGoogle Scholar
16.Reed-Hill, R.E.: Physical Metallurgy Principle, 2nd ed. (D. Van Nostrand Company, New York, 1973), Chap. 10.Google Scholar