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Strain-controlled bulge test

Published online by Cambridge University Press:  31 January 2011

B. Erdem Alaca*
Affiliation:
College of Engineering, Koc University, Rumeli Feneri Yolu 34450 Sariyer, Istanbul, Turkey
K. Bugra Toga
Affiliation:
College of Engineering, Koc University, Rumeli Feneri Yolu 34450 Sariyer, Istanbul, Turkey
Orhan Akar
Affiliation:
Electrical and Electronics Engineering Department, Middle East Technical University, 06531 Ankara, Turkey
Tayfun Akin
Affiliation:
Electrical and Electronics Engineering Department, Middle East Technical University, 06531 Ankara, Turkey
*
a)Address all correspondence to this author. e-mail: ealaca@ku.edu.tr
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Abstract

A closed-loop approach is adopted to implement strain rate control during the bulge test. Due to the difficulty of measuring strains directly, the technique is based on the conversion of displacement measurements to the corresponding strains using the plane-strain formulation. The necessary temporal evolution of the midpoint displacement of a rectangular diaphragm is derived under the condition of constant strain rate and is imposed as a control criterion. The technique is demonstrated on 500-nm-thick Au diaphragms by applying strain rates ranging from 2 × 10−6 to 2 × 10−4 s–1. By measuring the corresponding yield strength values, a strain rate sensitivity of 0.11 is obtained, which is close to what was previously reported on similar specimens using the microbending test.

Type
Articles
Copyright
Copyright © Materials Research Society 2008

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References

REFERENCES

1Beams, J.W.: Mechanical properties of thin films of gold and silver in Proceedings of International Conference on Structure and Properties of Thin Films edited by C.A. Neugebauer, J.B. Newkirk, and D.A. Vermilya John Wiley NY 1959 183–192Google Scholar
2Bromley, E.I.: A technique for the determination of stress in thin films. J. Vac. Sci. Technol., B 1, 1364 1983Google Scholar
3Vlassak, J.J., Nix, W.D.: A new bulge test technique for the determination of Young’s modulus and Poisson’s ratio of thin films. J. Mater. Res. 7, 3242 1992CrossRefGoogle Scholar
4Edwards, R.L., Coles, G., Sharpe, W.N. Jr.: Comparison of tensile and bulge tests for thin-film silicon nitride. Exp. Mech. 44, 49 2004CrossRefGoogle Scholar
5Xiang, Y., Chen, X., Vlassak, J.J.: Plane-strain bulge test for thin films. J. Mater. Res. 20, 2360 2005Google Scholar
6Kalkman, A.J., Verbruggen, A.H., Janssen, G.C.A.M.: Young’s modulus measurements and grain boundary sliding in free-standing thin metal films. Appl. Phys. Lett. 78, 2673 2001CrossRefGoogle Scholar
7Hall, J.D., Apperson, N.E., Crozier, B.T., Xu, C., Richards, R.F., Bahr, D.F., Richards, C.D.: A facility for characterizing the dynamic mechanical behavior of thin membranes for microelectromechanical systems. Rev. Sci. Instrum. 73, 2067 2002Google Scholar
8Alaca, B.E., Selby, J.C., Saif, M.T.A., Sehitoglu, H.: Biaxial testing of nanoscale films on compliant substrates: Fatigue and fracture. Rev. Sci. Instrum. 73(8), 2963 2002Google Scholar
9Kalkman, A.J., Verbruggen, A.H., Janssen, G.C.A.M., Radelaar, S.: Transient creep in free-standing thin polycrystalline aluminum films. J. Appl. Phys. 92, 4968 2002CrossRefGoogle Scholar
10Hyun, S., Hooghan, T.K., Brown, W.L., Vinci, R.P.: Linear viscoelasticity in aluminum films. Appl. Phys. Lett. 87, 061902 2005Google Scholar
11Cieslar, M., Oliva, V., Karimi, A., Martin, J-L.: Plasticity of thin Al films as a function of temperature. Mater. Sci. Eng., A 387–389, 734 2004Google Scholar
12Dieter, G.E.: Mechanical Metallurgy,SI Metric ed. (McGraw-Hill Book Company,Singapore, 1988 295–301Google Scholar
13Emery, R.D., Povirk, G.L.: Tensile behavior of free-standing gold films. Part I. Coarse-grained films. Acta Mater. 51, 2067 2003CrossRefGoogle Scholar
14Emery, R.D., Povirk, G.L.: Tensile behavior of free-standing gold films. Part II. Fine-grained films. Acta Mater. 51, 2079 2003Google Scholar
15Chasiotis, I., Bateson, C., Timpano, K., McCarty, A.S., Barker, N.S., Stanec, J.R.: Strain rate effects on the mechanical behavior of nanocrystalline Au films. Thin Solid Films 515, 3183 2007CrossRefGoogle Scholar
16Wang, L., Prorok, B.C.: Characterization of the strain rate dependent behavior of nanocrystalline gold films. J. Mater. Res. 23, 55 2008Google Scholar
17Zamiri, A., Porboghrat, F., Jiang, H., Bieler, T.R., Barlat, F., Brem, J., Compton, C., Grimm, T.L.: On mechanical properties of the superconducting niobium. Mater. Sci. Eng., A 435–436, 658 2006CrossRefGoogle Scholar
18Broomhead, P., Grieve, R.J.: The effect of strain rate on the strain to fracture of a sheet steel under biaxial tensile stress conditions. J. Eng. Mater. Technol. Trans. ASME 104, 102 1982CrossRefGoogle Scholar
19Montay, G., François, M., Tourneix, M., Guelorget, B., Vial-Edwards, C., Lira, I.: Strain and strain-rate measurement during the bulge test by electronic speckle pattern interferometry. J. Mater. Process. Technol. 184, 428 2007Google Scholar
20Atkinson, M.: An investigation of hydraulic bulging as a biaxial straining test for sheet metal. J. Test. Eval. 33, 537 2005CrossRefGoogle Scholar
21Espinosa, H.D., Prorok, B.C., Peng, B.: Plasticity size effects in free-standing submicron polycrystalline FCC films subjected to pure tension. J. Mech. Phys. Solids 52, 667 2004CrossRefGoogle Scholar
22Renault, P-O., Bourhis, E. Le, Villain, P., Goudeau, Ph., Badawi, K.F., Faurie, D.: Measurement of the elastic constants of textured anisotropic thin films from x-ray diffraction data. Appl. Phys. Lett. 83, 473 2003CrossRefGoogle Scholar
23Vinci, R.P., Vlassak, J.J.: Mechanical behavior of thin films. Annu. Rev. Mater. Sci. 26, 431 1996Google Scholar
24Nix, W.D.: Mechanical properties of thin films. Metall. Trans. A 20, 2217 1989Google Scholar