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Strong bonding of titanium to copper through the elimination of the brittle interfacial intermetallics

Published online by Cambridge University Press:  31 January 2011

M.K. Lee ,
J.G. Lee ,
J.K. Lee ,
J.J. Park ,
G.J. Lee ,
Y.R. Uhm  and
C.K. Rhee
M.K. Lee*
Affiliation:
Nuclear Materials Research Center, Korea Atomic Energy Research Institute, Yuseong, Daejeon 305-353, South Korea
J.G. Lee
Affiliation:
Nuclear Materials Research Center, Korea Atomic Energy Research Institute, Yuseong, Daejeon 305-353, South Korea
J.K. Lee
Affiliation:
Nuclear Materials Research Center, Korea Atomic Energy Research Institute, Yuseong, Daejeon 305-353, South Korea
J.J. Park
Affiliation:
Nuclear Materials Research Center, Korea Atomic Energy Research Institute, Yuseong, Daejeon 305-353, South Korea
G.J. Lee
Affiliation:
Nuclear Materials Research Center, Korea Atomic Energy Research Institute, Yuseong, Daejeon 305-353, South Korea
Y.R. Uhm
Affiliation:
Nuclear Materials Research Center, Korea Atomic Energy Research Institute, Yuseong, Daejeon 305-353, South Korea
C.K. Rhee
Affiliation:
Nuclear Materials Research Center, Korea Atomic Energy Research Institute, Yuseong, Daejeon 305-353, South Korea
*
a)Address all correspondence to this author. e-mail: leeminku@kaeri.re.kr
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Abstract

The microstructures, interfacial reactions, and bonding strength properties of the Ti–Cu dissimilar joints using a commercially available Ag–28Cu–2Ti filler were studied, particularly as they relate to the role of an Ag barrier layer at the Ti interface. A joint microstructure and interfacial reactions closely related to the formation of brittle interfacial Ti–Cu intermetallics were fully dominated by the presence of the Ag layer at the Ti interface. Reliable Ti(base)/TiAg/Ag/Ag–Cu eutectic/Cu(base) joints without any detrimental Ti–Cu intermetallics were achieved at low brazing temperatures below 810 °C by applying an Ag interlayer of suitable thickness. It was notable that their bonding strengths were strong enough to exceed the strength of a Cu bulk base metal. This research demonstrates the potential application of an Ag interlayer for the reliable Ti–Cu dissimilar joints.

Keywords

BrazingCuTi
Type
Articles
Information
Journal of Materials Research , Volume 23 , Issue 8 , August 2008 , pp. 2254 - 2263
Copyright
Copyright © Materials Research Society 2008

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References

REFERENCES

1Shiue, R.K., Wu, S.K., Chan, C.H.: Infrared brazing Cu and Ti using a 95Ag-5Al braze alloy. Metall. Mater. Trans. A 35, 3177 2004CrossRefGoogle Scholar
2Shiue, R.K., Wu, S.K., Chan, C.H.: The interfacial reactions of infrared brazing Cu and Ti with two silver-based braze alloys. J. Alloys Compd. 372, 148 2004Google Scholar
3Liaw, D.W., Shiue, R.K.: Brazing of Ti–6Al–4V and niobium using three silver-base braze alloys. Metall. Mater. Trans. A 36, 2415 2005Google Scholar
4Liu, C.C., Ou, C.L., Shiue, R.K.: The microstructural observation and wettability study of brazing Ti–6Al–4V and 304 stainless steel using three braze alloys. J. Mater. Sci. 37, 2225 2002CrossRefGoogle Scholar
5Shiue, R.K., Wu, S.K., Chan, C.H., Huang, C.S.: Infrared brazing of Ti–6Al–4V and 17-4 PH stainless steel with a nickel barrier layer. Metall. Mater. Trans. A 37, 2207 2006CrossRefGoogle Scholar
6He, P., Feng, J.C., Zhang, B.G., Qian, Y.Y.: A new technology for diffusion bonding intermetallic TiAl to steel with composite barrier layers. Mater. Charact. 50, 87 2003Google Scholar
7Liaw, D.W., Shiue, R.K.: Brazing of Ti–6Al–4V and niobium using three silver-base braze alloys. Metall. Mater. Trans. A 36, 2415 2005Google Scholar
8Chang, C.T., Shiue, R.K.: Infrared brazing Ti–6Al–4V and Mo using the Ti–15Cu–15Ni braze alloy. Int. J. Refract. Met. Hard Mater. 23, 161 2005CrossRefGoogle Scholar
9Massalski, T.B.: Binary Alloy Phase Diagrams, Vol. 2, ASM International Materials Park, OH 1990 1495Google Scholar
10Rongti, L., Wei, P., Jian, C., Jie, L.: Thermodynamic properties of Ti in Ag–Cu–Ti alloys. Mater. Sci. Eng., A 335, 21 2002Google Scholar
11Paulasto, M., van Loo, F.J.J., Kivilahti, J.K.: Thermodynamic and experimental study of Ti–Ag–Cu alloys. J. Alloys Compd. 220, 136 1995CrossRefGoogle Scholar
12Humpston, G., Jacobson, D.M.: Principles of Soldering and Brazing ASM International Materials Park, OH 1993 34Google Scholar
13Shiue, R.K., Wu, S.K., Chen, S.Y.: Infrared brazing of TiAl intermetallic using BAg–8 braze alloy. Acta Mater. 51, 1991 2003CrossRefGoogle Scholar
14Shiue, R.K., Wu, S.K., Chen, S.Y.: Infrared brazing of TiAl using Al-based brazed alloys. Intermetallics 11, 661 2003Google Scholar
15Massalski, T.B.: Binary Alloy Phase Diagrams, Vol. 1, ASM International Materials Park, OH 1990 29Google Scholar
16Massalski, T.B.: Binary Alloy Phase Diagrams, Vol. 2, ASM International Materials Park, OH 1990 106Google Scholar
17Dececco, N.A., Parks, J.M.: The brazing of titanium. Welding J. 32, 1071 1953Google Scholar
18Tiner, N.A.: Metallurgical aspects of silver brazing titanium. Welding J. 34, 846 1955Google Scholar
19Villars, P., Prince, A., Okamoto, H.: Handbook of Ternary Alloy Phase Diagrams ASM International Materials Park, OH 1995Google Scholar