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Substrate effects on indentation plastic zone development in thin soft films

Published online by Cambridge University Press:  31 January 2011

D. E. Kramer ,
A. A. Volinsky ,
N. R. Moody  and
W. W. Gerberich
D. E. Kramer
Affiliation:
Metallurgy Division, National Institute of Standards and Technology, Gaithersburg, Maryland 20899–8553
A. A. Volinsky
Affiliation:
Motorola, DigitalDNA Labs, Process and Materials Characterization Lab, Mesa, Arizona 85202
N. R. Moody
Affiliation:
Materials Reliability Division, Sandia National Labs, Livermore, California 94551–0969
W. W. Gerberich
Affiliation:
Department of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, Minnesota 55455
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Abstract

Plastic zone evolution in Al–2 wt% Si metal films on silicon and sapphire substrates was studied using nanoindentation and atomic force microscopy (AFM). AFM was used to measure the extent of plastic pileup, which is a measure of the plastic zone radius in the film. It was found that the plastic zone size develops in a self-similar fashion with increasing indenter penetration when normalized by the contact radius, regardless of film hardness or underlying substrate properties. This behavior was used to develop a hardness model that uses the extent of the plastic zone radius to calculate a core region within the indenter contact that is subject to an elevated contact pressure. AFM measurements also indicated that as film thickness decreases, constraint imposed by the indenter and substrate traps the film thereby reducing the pileup volume.

Type
Articles
Information
Journal of Materials Research , Volume 16 , Issue 11 , November 2001 , pp. 3150 - 3157
Copyright
Copyright © Materials Research Society 2001

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