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Synthesis of surface-metallized polymeric films by in situ reduction of (4,4,4-trifluoro-1-(2-thienyl)-1,3-butanedionato) silver(I) in a polyimide matrix

Published online by Cambridge University Press:  31 January 2011

Robin E. Southward*
Affiliation:
Materials Division, National Aeronautics and Space Administration, Langley Research Center, Hampton, Virginia 23681
Carey K. Bagdassarian
Affiliation:
The Departments of Chemistry and Biology, College of William and Mary, Williamsburg, Virginia 23187
Christopher J. Sudol
Affiliation:
The Departments of Chemistry and Biology, College of William and Mary, Williamsburg, Virginia 23187
Jennifer L. Wasyk
Affiliation:
The Departments of Chemistry and Biology, College of William and Mary, Williamsburg, Virginia 23187
Susanna H. Sproul
Affiliation:
The Departments of Chemistry and Biology, College of William and Mary, Williamsburg, Virginia 23187
Sharon T. Broadwater
Affiliation:
The Departments of Chemistry and Biology, College of William and Mary, Williamsburg, Virginia 23187
Joseph L. Scott
Affiliation:
The Departments of Chemistry and Biology, College of William and Mary, Williamsburg, Virginia 23187
David W. Thompson
Affiliation:
The Departments of Chemistry and Biology, College of William and Mary, Williamsburg, Virginia 23187
*
a) Address all correspondence to this author.
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Abstract

Thermal curing of the (4,4,4-trifluoro-1-(2-thienyl)-1,3-butanedionato)silver(I)-containing poly(amic acid) formed from 3,3′,4,4′-benzophenone tetracarboxylic acid dianhydride (BTDA) and 4,4′-oxydianiline (4,4′-ODA) in dimethylacetamide gives both polyimide films via cyclodehydration and reduction of silver(I) to the native metal. Silver(0) migrates to the surface resulting in surface metallized composite films, which can have excellent reflectivity, but do not exhibit surface electrical conductivity. The films retain mechanical and thermal properties similar to those of the parent polyimide. X-ray diffraction shows crystalline face-centered-cubic silver in the films after thermal curing. Microscopy data show that the surface particle sizes are in the range of approximately 50–100 nm. Significant silver remains in the bulk of the polyimide film with varying particles sizes generally less than approximately 15 nm. The interior of the metallized films is not electrically conducting. Films were characterized by x-ray diffraction, differential scanning calorimetry, thermal gravimetric analysis, x-ray photoelectron spectroscopy, transmission electron microscopy, scanning electron microscopy, and mechanical measurements.

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Articles
Copyright
Copyright © Materials Research Society 1999

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References

REFERENCES

1.Clusters and Colloids: From Theory to Applications, edited by Schmid, G. (VCH, Weinheim, 1994).CrossRefGoogle Scholar
2.Creighton, J.A. and Eadon, D.G., J. Chem. Soc., Faraday Trans. 87, 3881 (1991).CrossRefGoogle Scholar
3.Gehr, R.J. and Boyd, R.W., Chem. Mater. 8, 1807 (1996) and references therein.CrossRefGoogle Scholar
4.Lewis, L.N., Chem. Rev. 93, 2693 (1993).CrossRefGoogle Scholar
5.Halperin, W.P., Rev. Mod. Phys. 58, 533 (1986) and references therein.CrossRefGoogle Scholar
6.Southward, R.E., Thompson, D.S., Thompson, D.W., Caplan, M.L., and Clair, A.K.St., Chem. Mater. 7, 2171 (1995).CrossRefGoogle Scholar
7.Southward, R.E., Thompson, D.W., and Clair, A.K.St., Chem. Mater. 9, 501 (1997).CrossRefGoogle Scholar
8.Southward, R.E., Thompson, D.S., Thompson, D.W., and Clair, A.K.St., Chem. Mater. 9, 1691 (1997).CrossRefGoogle Scholar
9.Southward, R.E., Boggs, C.M., Thompson, D.W., and Clair, A.K.St., Chem. Mater. 10, 1408 (1998).CrossRefGoogle Scholar
10.Southward, R.S., Thompson, D.S., Thompson, D.W., and Clair, A.K.St., in Materials in Space—Science Technology and Exploration, edited by Hepp, A.J., Prahl, J.M., Keith, T.G., Bailey, S.G., and Fowler, J.R. (Mater. Res. Soc. Symp. Proc. 551, Warrendale, PA, in press).Google Scholar
11.Bower, G.M. and Frost, L.W., J. Polym Sci A 1, 3135 (1963).Google Scholar
12.Sroog, C.E., Endrey, A.L., Abramo, S.V., Berr, C.E., Edwards, W.M., and Olivier, K.L., J. Polym. Sci. A 3, 1373 (1965).Google Scholar
13. (a)Madix, R.J., in Oxygen Complexes and Oxygen Activation by Transition Metals, edited by Martell, A.E. and Sawyer, D.T. (Plenum, New York, 1988), pp. 253264 and references therein;CrossRefGoogle Scholar
(b)Madix, R.J., Science 233, 1159 (1986).CrossRefGoogle Scholar
14.Gliem, R. and Schlamp, G., Metall. 41, 34 (1987).Google Scholar
15. (a)Gierow, P.A., Proc. ASME-JSME-JSES Solar Energy Conference, Reno, NV (1991) pp. 17;Google Scholar
(b)Ehricke, K., “The Solar Powered Space Ship,” ARS paper 310–56, Meeting of the American Rocket Society, Cleveland, OH, June 18–20 (1956).Google Scholar
16.Gulino, D.A., Egger, R.A., and Bauholzer, W.F., “Oxidation-Resistant Reflective Surfaces for Solar Dynamic Power Generation in Near Earth Orbit,” NASA Technical Memorandum 88865 (1986).Google Scholar
17.Freeland, R.E. and Bilyou, G., “In-Step Inflatable Antenna Experiment,” 43rd Congress of the International Astronautical Federation, IAF-92–0301, Washington, DC (1992).Google Scholar
18.Liedberg, H. and Lundeberg, T., Urol. Res. 17, 359 (1989).CrossRefGoogle Scholar
19.The Chemistry of Metal CVD, edited by Kodas, T.T. and Hampden-Smith, M.J. (VCH, Weinheim, 1994).CrossRefGoogle Scholar
20.Burger, R.W. and Gerenser, L.J., in Metallized Plastics, edited by Mittal, K.L. (Plenum, New York, 1992), Vol. 3, pp. 179193.CrossRefGoogle Scholar
21.Mittal, K.L., J. Vac. Sci. Technol. 13, 19 (1976).CrossRefGoogle Scholar
22.Rozovskis, G., Vinkevicius, J., and Jaciauskiene, J., J. Adhes. Sci. Technol. 10, 399 (1996).CrossRefGoogle Scholar
23. (a)Coggin, P. and McPhail, A.T., J. Chem. Soc., Chem. Commun., 91 (1972);Google Scholar
(b)Blakeslee, A.E. and Hoard, J.L., J. Am. Chem. Soc. 78, 3029 (1965);CrossRefGoogle Scholar
(c)Griffin, R.G., Ellett, J.D., Mehring, M., Bullitt, J.G., and Waugh, J.S., J. Chem. Phys. 57, 2147 (1972).CrossRefGoogle Scholar
24. (a)Brown, H.R., Yang, A.C.M, Russell, T.P., Volksen, W., and Kramer, E.J., Polymer 29, 1807 (1988);CrossRefGoogle Scholar
(b)Stoffel, N.C., Dai, C., Kramer, E.J., Russell, T.P., Deline, V., Volksen, W., Wu, W., and Satija, S., Macromolecules 29, 6880 (1996);CrossRefGoogle Scholar
(c)Kramer, E.J., MRS Bull. 21(1), 37 (1996).CrossRefGoogle Scholar
25. (a)Stoffel, N.C., Hseih, M., Chandra, S., and Kramer, E.J., Chem. Mater. 8, 1035 (1996);CrossRefGoogle Scholar
(b)Lee, K.W., Kowalczyk, S.P., and Shaw, J.M., Macromolecules 23, 2097 (1990).CrossRefGoogle Scholar
26. (a)Plechaty, M.M. and Thomas, R.R., J. Electrochem. Soc. 139, 810 (1992);CrossRefGoogle Scholar
(b)Thomas, R.R., Buchwalter, S.L., Buchwalter, L.P., and Chao, T.H., Macromolecules 25, 4559 (1992).CrossRefGoogle Scholar
27.Xia, Y., Zhao, X-M., Kim, E., and Whitesides, G.M., Chem. Mater. 7, 2332 (1995).CrossRefGoogle Scholar
28. (a)Faupel, F., Proc. Int. Conf. Polymer-Solid Interfaces, Namur, Belgium, Sept. 1991 (IOP Publishing, Ltd., Bristol, U.K., 1992), p. 171;Google Scholar
(b)Foitzik, A. and Faupel, F., in Electronic Packaging Materials Science V, edited by Lillie, E.D., Ho, P.S., Jaccodine, R., and Jackson, K. (Mater. Res. Soc. Symp. Proc. 203, Pittsburgh, PA, 1991), p. 59. (1991);Google Scholar
(c)Faupel, F., Defect and Diffusion Forum 95–98, 1201 (1993).CrossRefGoogle Scholar
29. (a)Wagner, C.D., The NIST X-Ray Photoelectron Spectroscopy Database, Technical Note 1289, U.S. Department of Commerce (1991);CrossRefGoogle Scholar
(b)Handbook of X-ray Photoelectron Spectroscopy, edited by Wagner, C.D., Riggs, W.M., Davis, L.E., Moulder, J.F., and Muilenberg, G.E. (Perkin-Elmer Corporation, Physical Electronics Division, Eden Prairie, MN).Google Scholar
30.Drummer, L.F. and Haas, G., Physics of Thin Films, edited by Haas, G. and Thun, R.E. (Academic Press, New York, 1964), Vol. 2, pp. 305361.Google Scholar