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Thermal stability of highly nanotwinned copper: The role of grain boundaries and texture

Published online by Cambridge University Press:  27 November 2012

Yifu Zhao ,
Timothy Allen Furnish ,
Michael Ernest Kassner  and
Andrea Maria Hodge
Yifu Zhao
Affiliation:
Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, California 90089
Timothy Allen Furnish
Affiliation:
Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, California 90089
Michael Ernest Kassner
Affiliation:
Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, California 90089
Andrea Maria Hodge*
Affiliation:
Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, California 90089
*
a)Address all correspondence to this author. e-mail: ahodge@usc.edu
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Abstract

To study the effect of nanotwins on thermal stability, a comprehensive characterization study was performed on two types of ultrafine grained (UFG) copper samples, with and without nanotwins. The two samples were sequentially heat-treated at elevated temperatures, and the grain size, grain boundary character, and texture were characterized after each heat treatment. The as-prepared nanotwinned (nt) copper foil had an average columnar grain size of ∼700 nm with a high density of coherent twin boundaries (CTBs) (twin thickness, ∼40 nm), which remained stable up to 300 °C. In contrast, the other UFG sample had few CTBs, and rapid grain growth was observed at 200 °C. The thermal stability of nt copper is discussed with respect to the presence of the low energy nanotwins, triple junctions between the twins and columnar grains, texture and grain growth.

Keywords

nanostructureannealinggrain boundaries
Type
Articles
Information
Journal of Materials Research , Volume 27 , Issue 24 , 28 December 2012 , pp. 3049 - 3057
Copyright
Copyright © Materials Research Society 2012

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References

REFERENCES

Lu, L., Shen, Y., Chen, X., Qian, L., and Lu, K.: Ultrahigh strength and high electrical conductivity in copper. Science 304(5669), 422 (2004).CrossRefGoogle ScholarPubMed
Lu, L., Chen, X., Huang, X., and Lu, K.: Revealing the maximum strength in nanotwinned copper. Science 323(5914), 607 (2009).CrossRefGoogle ScholarPubMed
Lu, L., Lu, K., and Suresh, S.: Strengthening materials by engineering coherent internal boundaries at the nanoscale. Science 324(5925), 349 (2009).CrossRefGoogle ScholarPubMed
Hodge, A.M., Wang, Y.M., and Barbee, T.W. Jr.: Mechanical deformation of high-purity sputter-deposited nano-twinned copper. Scr. Mater. 59(2), 163 (2008).CrossRefGoogle Scholar
Shute, C.J., Myers, B.D., Xie, S., Li, S.Y., Barbee, T.W. Jr., Hodge, A.M., and Weertman, J.R.: Detwinning, damage and crack initiation during cyclic loading of Cu samples containing aligned nanotwins. Acta Mater. 59(11), 4569 (2011).CrossRefGoogle Scholar
Anderoglu, O., Misra, A., Wang, H., and Zhang, X.: Thermal stability of sputtered Cu films with nanoscale growth twins. J. Appl. Phys. 103(9), 094322 (2008).CrossRefGoogle Scholar
Zhang, X. and Misra, A.: Superior thermal stability of coherent twin boundaries in nanotwinned metals. Scr. Mater. 66(11), 860 (2012).CrossRefGoogle Scholar
Xu, D., Sriram, V., Ozolins, V., Yang, J.M., Tu, K.N., Stafford, G.R., Beauchamp, C., Zienert, I., Geisler, H., Hofmann, P., and Zschech, E.: Nanotwin formation and its physical properties and effect on reliability of copper interconnects. Microelectron. Eng. 85(10), 2155 (2008).CrossRefGoogle Scholar
Saldana, C., Murthy, T.G., Shankar, M.R., Stach, E.A., and Chandrasekar, S.: Stabilizing nanostructured materials by coherent nanotwins and their grain boundary triple junction drag. Appl. Phys. Lett. 94(2), 021910 (2009).CrossRefGoogle Scholar
Saldana, C., King, A.H., Stach, E.A., Compton, W.D., and Chandrasekar, S.: Vacancies, twins, and the thermal stability of ultrafine-grained copper. Appl. Phys. Lett. 99(23), 231911 (2011).CrossRefGoogle Scholar
Kobiyama, M., Inami, T., and Okuda, S.: Mechanical behavior and thermal stability of nanocrystalline copper film prepared by gas deposition method. Scr. Mater. 44(8–9), 1547 (2001).CrossRefGoogle Scholar
Zhang, J.M., Xu, K.W., and Ji, V.: Competition between surface and strain energy during grain growth in free-standing and attached Ag and Cu films on Si substrates. Appl. Surf. Sci. 187(1–2), 60 (2002).CrossRefGoogle Scholar
Ma, F., Zhang, J.M., and Xu, K.W.: Surface-energy-driven abnormal grain growth in Cu and Ag films. Appl. Surf. Sci. 242(1–2), 55 (2005).CrossRefGoogle Scholar
Mirpuri, K., Wendrock, H., Menzel, S., Wetzig, K., and Szpunar, J.: Texture evolution in copper film at high temperature studied in situ by electron back-scatter diffraction. Thin Solid Films 496(2), 703 (2006).CrossRefGoogle Scholar
Zhang, J.M., Xu, K.W., and Ji, V.: Dependence of strain energy on the grain orientations in an FCC-polycrystalline film on rigid substrate. Appl. Surf. Sci. 185(3–4), 177 (2002).CrossRefGoogle Scholar
A.S.T.M. International: Determining Average Grain Size Using Electron Backscatter Diffraction (EBSD) in Fully Recrystallized Polycrystalline Materials (ASTM Standard E2627., West Conshohocken, PA, 2010).Google Scholar
Humphreys, F.J.: Review grain and subgrain characterisation by electron backscatter diffraction. J. Mater. Sci. 36(16), 3833 (2001).CrossRefGoogle Scholar
Randle, V.: A methodology for grain boundary plane assessment by single-section trace analysis. Scr. Mater. 44(12), 2789 (2001).CrossRefGoogle Scholar
Wright, S.I. and Larsen, R.J.: Extracting twins from orientation imaging microscopy scan data. J. Microsc. 205(3), 245 (2002).CrossRefGoogle ScholarPubMed
Doherty, R.D., Hughes, D.A., Humphreys, F.J., Jonas, J.J., Juul Jensen, D., Kassner, M.E., King, W.E., McNelley, T.R., McQueen, H.J., and Rollett, A.D.: Current issues in recrystallization: A review. Mater. Today 1(2), 14 (1998).CrossRefGoogle Scholar
Sonnweber-Ribic, P., Gruber, P., Dehm, G., and Arzt, E.: Texture transition in Cu thin films: Electron backscatter diffraction vs. x-ray diffraction. Acta Mater. 54(15), 3863 (2006).CrossRefGoogle Scholar
Thompson, C.V. and Carel, R.: Grain growth and texture evolution in thin films. Mater. Sci. Forum 204–206, 83 (1996).CrossRefGoogle Scholar
Holm, E.A. and Foiles, S.M.: How grain growth stops: A mechanism for grain-growth stagnation in pure materials. Science 328(5982), 1138 (2010).CrossRefGoogle Scholar
Janssens, K.G.F., Olmsted, D., Holm, E.A., Foiles, S.M., Plimpton, S.J., and Derlet, P.M.: Computing the mobility of grain boundaries. Nat. Mater. 5(2), 124 (2006).CrossRefGoogle ScholarPubMed
Olmsted, D.L., Foiles, S.M., and Holm, E.A.: Survey of computed grain boundary properties in face-centered cubic metals: I. Grain boundary energy. Acta Mater. 57(13), 3694 (2009).CrossRefGoogle Scholar
Field, D.P., Bradford, L.T., Nowell, M.M., and Lillo, T.M.: The role of annealing twins during recrystallization of Cu. Acta Mater. 55(12), 4233 (2007).CrossRefGoogle Scholar
Fullman, R.L. and Fisher, J.C.: Formation of annealing twins during grain growth. J. Appl. Phys. 22(11), 1350 (1951).CrossRefGoogle Scholar
Lingk, C., Gross, M.E., and Brown, W.L.: Texture development of blanket electroplated copper films. J. Appl. Phys. 87(5), 2232 (2000).CrossRefGoogle Scholar
Berger, A., Wilbrandt, P.J., Ernst, F., Klement, U., and Haasen, P.: On the generation of new orientations during recrystallization: Recent results on the recrystallization of tensile-deformed fcc single crystals. Prog. Mater. Sci. 32(1), 1 (1988).CrossRefGoogle Scholar
Gottstein, G. and Shvindlerman, L.S.: Structure of grain boundaries, In Grain Boundary Migration in Metals: Thermodynamics, Kinetics, Applications, 2nd ed.; Ralph, B. ed. (CRC Press, Boca Raton, FL 2010); p. 111.Google Scholar