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Thin Film Microstructure Control Using Glancing Angle Deposition by Sputtering

Published online by Cambridge University Press:  31 January 2011

J. C. Sit ,
D. Vick ,
K. Robbie  and
M. J. Brett
J. C. Sit
Affiliation:
Department of Electrical and Computer Engineering, University of Alberta, Edmonton, Alberta, Canada T6G 2G7 and Alberta Microelectronic Corporation, Edmonton, Alberta, Canada T6G 2T9
D. Vick
Affiliation:
Department of Electrical and Computer Engineering, University of Alberta, Edmonton, Alberta, Canada T6G 2G7 and Alberta Microelectronic Corporation, Edmonton, Alberta, Canada T6G 2T9
K. Robbie
Affiliation:
Department of Electrical and Computer Engineering, University of Alberta, Edmonton, Alberta, Canada T6G 2G7 and Alberta Microelectronic Corporation, Edmonton, Alberta, Canada T6G 2T9
M. J. Brett
Affiliation:
Department of Electrical and Computer Engineering, University of Alberta, Edmonton, Alberta, Canada T6G 2G7 and Alberta Microelectronic Corporation, Edmonton, Alberta, Canada T6G 2T9
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Abstract

Thin films with microstructures controlled on a nanometer scale have been fabricated using a recently developed process called glancing angle deposition (GLAD) which combines oblique angle evaporation with controlled substrate motion. Critical to the production of GLAD thin films is the requirement for a narrow angular flux distribution centered at an oblique incidence angle. We report here recent work with low-pressure, long-throw sputter deposition with which we have succeeded in fabricating porous titanium thin films possessing “zig-zag,” helical, and “pillar” microstructures, demonstrating microstructural control on a level consistent with evaporated GLAD. The use of sputtering for GLAD simplifies process control and should enable deposition of a broader range of thin film materials.

Type
Articles
Information
Journal of Materials Research , Volume 14 , Issue 4 , April 1999 , pp. 1197 - 1199
Copyright
Copyright © Materials Research Society 1999

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