Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Colgan, E.G.
1990.
A review of thin-film aluminide formation.
Materials Science Reports,
Vol. 5,
Issue. 1,
p.
1.
Pretorius, R.
Marais, T. K.
Muller, A. E.
and
Knoesen, D.
1991.
Prediction of First Phase Formation at Au-METAL Interfaces Using the Effective Heat of Formation Model.
MRS Proceedings,
Vol. 238,
Issue. ,
d'Heurle, F.M.
and
Ghez, R.
1992.
Reactive diffusion in a prototype system: nickel - aluminum II: The ordered Cu3Au rule and the sequence of phase formation, nucleation.
Thin Solid Films,
Vol. 215,
Issue. 1,
p.
26.
Strane, J. W.
Russell, S. W.
Li, Jian
and
Mayer, J. W.
1992.
Thermal Studies of Au-Ti Thin Films Deposited on Oxide Substrates.
MRS Proceedings,
Vol. 260,
Issue. ,
Wang, Shi-Qing
Suthar, Sailesh
Hoeflich, Christine
and
Burrow, Brad J.
1993.
Diffusion barrier properties of TiW between Si and Cu.
Journal of Applied Physics,
Vol. 73,
Issue. 5,
p.
2301.
Pretorius, R.
Marais, T.K.
and
Theron, C.C.
1993.
Thin film compound phase formation sequence: An effective heat of formation model.
Materials Science Reports,
Vol. 10,
Issue. 1-2,
p.
1.
Wiener, G.
Michaelsen, C.
Knoth, J.
Schwenke, H.
and
Bormann, R.
1995.
Concentration-depth profiling using total-reflection x-ray fluorescence spectrometry in combination with ion-beam microsectioning techniques.
Review of Scientific Instruments,
Vol. 66,
Issue. 1,
p.
20.
Günther, R.
Wiener, G.
Knoth, J.
Schwenke, H.
and
Bormann, R.
1996.
Determination of concentration depth profiles using total-reflection x-ray fluorescence spectrometry in combination with ion-beam etching.
Review of Scientific Instruments,
Vol. 67,
Issue. 6,
p.
2332.
Kwak, J. S.
Kim, H. N.
Baik, H. K.
Lee, J.-L.
Shin, D. W.
Park, C. G.
Kim, H.
and
Pyun, K.-E.
1996.
Microstructural and electrical investigations of Pd/Ge/Ti/Au ohmic contact to n-type GaAs.
Journal of Applied Physics,
Vol. 80,
Issue. 7,
p.
3904.
Theron, C.C.
Ndwandwe, O.M.
Lombaard, J.C.
and
Pretorius, R.
1996.
First phase formation at interfaces: Comparison between Walser-Bené and effective heat of formation model.
Materials Chemistry and Physics,
Vol. 46,
Issue. 2-3,
p.
238.
Henry, B.M
Staton-Bevan, A.E
Sharma, V.K.M
and
Crouch, M.A
1997.
A SIMS and TEM investigation of Au/Ti/Pd solid state Ohmic contacts on p-GaAs.
Applied Surface Science,
Vol. 108,
Issue. 4,
p.
485.
Richter, Katrin
Keiter, Katrin
Bergner, Dietrich
M�ller, Angelika
Raub, Christoph J.
and
Ott, Dieter
1997.
Applicability of a Au(50 at%) Ti(50 at%)-alloy for diffusion measurements in the Au-Ti system.
Mikrochimica Acta,
Vol. 125,
Issue. 1-4,
p.
115.
d’Heurie, François M.
Lavoie, Christian
Gas, Patrick
and
Philibert, Jean
2005.
Diffusion Processes in Advanced Technological Materials.
p.
283.
d'Heurle, François M.
Lavoie, Christian
Gas, Patrick
and
Philibert, Jean
2005.
Diffusion Processes in Advanced Technological Materials.
p.
283.
Kumar, A. K.
and
Paul, A.
2010.
Interdiffusion studies in bulk Au–Ti system.
Journal of Materials Science: Materials in Electronics,
Vol. 21,
Issue. 11,
p.
1202.
Ong, Fei Shen
Tobe, Hirobumi
Fujii, Go
and
Sato, Eiichi
2020.
Microstructural evolution and mechanical characterization of Nb-interlayer-inserted Ti–6Al–4V/Si3N4 joints brazed with AuNiTi filler.
Materials Science and Engineering: A,
Vol. 778,
Issue. ,
p.
139093.