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X-ray tensile testing of thin films

Published online by Cambridge University Press:  31 January 2011

I.C. Noyan  and
G. Sheikh
I.C. Noyan
Affiliation:
IBM Research Division, T.J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598
G. Sheikh
Affiliation:
IBM Research Division, T.J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598
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Abstract

The “x-ray tensile test” is the combination of the standard uniaxial tensile test with x-ray diffraction techniques. In this test, in addition to the mechanical stress-strain values usually obtained from a tensile test, one measures the x-ray strain and stress in the diffracting regions of the sample. In multilayer thin films or in multiphase materials, x-ray diffraction enables the determination of strains and stresses in the individual layers or phases. Correlation of the x-ray data with the mechanical stress-strain values may be used to analyze strain and load partitioning within the specimen. In this paper an extended theoretical analysis of this technique and its application to evaporated Cu films on Ni substrates is presented.

Type
Articles
Information
Journal of Materials Research , Volume 8 , Issue 4 , April 1993 , pp. 764 - 770
Copyright
Copyright © Materials Research Society 1993

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References

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