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Electronic Speckle Pattern Interferometry Applied to the Displacement Measurement of Sandwich Plates with Single ‘Fully Potted’ Insert

Published online by Cambridge University Press:  05 May 2011

S. J. Huang*
Affiliation:
Department of Mechanical Engineering, National Chung Cheng University, Ming-Hsiung, Chia-Yi, Taiwan 621, R.O.C.
H. L. Lin*
Affiliation:
Department of Mechanical Engineering, National Chung Cheng University, Ming-Hsiung, Chia-Yi, Taiwan 621, R.O.C.
*
* Assistant Professor
** Master
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Abstract

The construction and operation of electronic speckle pattern interferometer (ESPI) applied to single-inserted sandwich plates have been earliest presented in this paper. Proposed ESPI has advantages of full-field and non-destructive testing, which can measures microscopic out-of-plane displacement in the elastic region without wasting specimen. For validation purpose, the finite element method (FEM) analysis was conducted. By comparing the results of ESPI and FEM displacement fields around the inserts that a convincing agreement is revealed. The effect of potting material diameter on the displacement of single-inserted sandwich plates was obtained by the ESPI and FEM.

Type
Articles
Copyright
Copyright © The Society of Theoretical and Applied Mechanics, R.O.C. 2004

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