Hostname: page-component-cd9895bd7-jn8rn Total loading time: 0 Render date: 2024-12-28T18:17:35.087Z Has data issue: false hasContentIssue false
  • English
  • Français

Modeling of Solder Fatigue Failure due to Ductile Damage

Published online by Cambridge University Press:  28 September 2011

K. Aluru ,
F.-L. Wen  and
Y.-L. Shen
K. Aluru*
Affiliation:
Department of Mechanical Engineering, University of New Mexico, Albuquerque, NM 87131, U.S.A.
F.-L. Wen*
Affiliation:
Department of Mechanical and Computer-Aided Engineering, St. John's University, Taipei, Taiwan25135, R.O.C.
Y.-L. Shen*
Affiliation:
Department of Mechanical Engineering, University of New Mexico, Albuquerque, NM 87131, U.S.A.
*
* Graduate Student
** Professor
*** Professor, corresponding author
Get access

Abstract

A numerical study is undertaken to simulate failure of solder joint caused by cyclic shear deformation. A progressive ductile damage model is incorporated into the rate-dependent elastic-viscoplastic finite element analysis, resulting in the capability of simulating damage evolution and eventual failure through crack formation. It is demonstrated that quantitative information of fatigue life, as well as the temporal and spatial evolution of fatigue cracks, can be explicitly obtained.

Keywords

Solder jointFatigueDuctile damagePlastic deformationFinite element analysis
Type
Technical Note
Information
Journal of Mechanics , Volume 26 , Issue 4 , December 2010 , pp. N23 - N27
Copyright
Copyright © The Society of Theoretical and Applied Mechanics, R.O.C. 2010

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Plumbridge, W. J., “Solders in Electronics,” Journal of Materials Science, 31, pp. 2501–2514 (1996).CrossRefGoogle Scholar
2. Lee, W. W., Nguyen, L. T. and Selvaduray, G. S., “Solder Joint Fatigue Models: Review and Applicability to Chip Scale Packages,” Microelectronics Reliability, 40, pp. 231–244 (2000).CrossRefGoogle Scholar
3. Atluri, V. P., Mahajan, R. V., Patel, P. R., Mallik, D., Tang, J., Wakharkar, V. S., Chrysler, G. M., Chiu, C.-P., Choksi, G. N. and Viswanath, R. S., “Critical Aspects of High-Performance Microprocessor Packaging,” MRS Bulletin, 28, pp. 21–34 (2003).CrossRefGoogle Scholar
4. Lee, C. F., Lee, Z. H. and Qu, S. H., “The Endochronic Viscoplasticity for Sn/3.9Ag/0.6Cu Solder under Low Strain Rate Fatigue Loading Coupled with Thermal Cycling,” Journal of Mechanics, 25, pp. 261–270 (2009).CrossRefGoogle Scholar
5Lee, C. F. and Lee, Z. H., “Predicting Fatigue Initiation Life of Sn/3.8Ag/0.7Cu Solder Using Endochronic Cyclic Damage-Coupled Viscoplastic Theory,” Journal of Mechanics, 24, pp. 369–377 (2008).CrossRefGoogle Scholar
6. Basquin, O. H., “The Exponential Law of Endurance Tests,” Proceedings of the American Society for Testing and Materials, 10, pp. 625–630 (1910).Google Scholar
7. Coffin, L. F. Jr., “A Study of the Effects of Cyclic Thermal Stresses on a Ductile Metal,” Transactions of ASME, 76, pp. 931–950 (1954).Google Scholar
8. Manson, S. S., “Behavior of Materials under Conditions of Thermal Stress,” Proceedings of the Heat Transfer Symposium, University of Michigan Engineering Research Institute, pp. 9–75 (1953).Google Scholar
9. Hong, B. Z., “Finite Element Modeling of Thermal Fatigue and Damage of Solder Joints in a Ceramic Ball Grid Array Package,” Journal of Electronic Materials, 26, pp. 814–820 (1997).CrossRefGoogle Scholar
10. Li, Y., Mahajan, R. L. and Subbarayan, G., “The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints,” Journal of Electronic Packaging, 120, pp. 54–60 (1998).CrossRefGoogle Scholar
11. Gu, Y. and Nakamura, T., “Interfacial Delamination and Fatigue Life Estimation of 3D Solder Bumps in Flip-Chip Packages,” Microelectronics Reliability, 44, pp. 471–483 (2004).CrossRefGoogle Scholar
12. Kim, Y. B., Noguchi, H. and Amagai, M., “Vibration Fatigue Reliability of BGA-IC Package with Pb-free Solder and Pb-Sn Solder,” Microelectronics Reliability, 46, pp. 459–466 (2006).CrossRefGoogle Scholar
13. Ghorbani, H. R. and Spelt, J. K., “An Analytical Elasto-Creep Model of Solder Joints in Leadless Chip Resistors: Part 2—Applications in Fatigue Reliability Predictions for SnPb and Lead-free Solders,” IEEE Transactions on Advanced Packaging, 30, pp. 695–704 (2007).CrossRefGoogle Scholar
14. Lee, C.-C., Lee, C.-C., Ku, H.-T., Chang, S.-M. and Chiang, K.-N., “Solder Joints Layout Design and Reliability Enhancements of Wafer Level Packaging Using Response Surface Methodology,” Microelectronics Reliability, 47, pp. 196–204 (2007).CrossRefGoogle Scholar
15. Shen, Y.-L., Chawla, N., Ege, E. S. and Deng, X., “De-formation Analysis of Lap-Shear Testing of Solder Joints,” Acta Materialia, 53, pp. 2633–2642 (2005).CrossRefGoogle Scholar
16. Moy, W. H. and Shen, Y.-L., “On the Failure Path in Shear-Tested Solder Joints,” Microelectronics Reliability, 47, pp. 1300–1305 (2007).CrossRefGoogle Scholar
17. Shen, Y.-L., “Externally Constrained Plastic Flow in Miniaturized Metallic Structures: A Continuum-Based Approach to Thin Films, Lines, and Joints,” Progress in Materials Science, 53, pp. 838–891 (2008).CrossRefGoogle Scholar
18. Wong, E.-H., Selvanayagam, C. S., Seah, S. K. W., van Driel, W. D., Caers, J. F. J. M., Zhao, X. J., Owens, N., Tan, L. C., Frear, D. R., Leoni, M., Lai, Y.-S. and Yeh, C.-L., “Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling,” Journal of Electronic Materials, 37, pp. 829–836 (2008).CrossRefGoogle Scholar
19. Abaqus 6.8, User's Manual, Dassault Systèmes Simulia Corp., Providence, RI.Google Scholar
20. Hillerborg, A., Modeer, M. and Petersson, P. E., “Analysis of Crack Formation and Crack Growth in Concrete by Means of Fracture Mechanics and Finite Elements,” Cement and Concrete Research, 6, pp. 773–781 (1976).CrossRefGoogle Scholar
21. Shen, Y.-L. and Aluru, K, “Numerical Study of Ductile Failure Morphology in Solder Joints under Fast Loading Conditions,” Microelectronics Reliability, in press.Google Scholar