Hostname: page-component-78c5997874-g7gxr Total loading time: 0 Render date: 2024-11-13T05:14:34.247Z Has data issue: false hasContentIssue false
  • English
  • Français

Overview Study of Solder Joint Reliablity due to Creep Deformation

Published online by Cambridge University Press:  02 July 2018

V. Ramachandran ,
K. C. Wu  and
K. N. Chiang
V. Ramachandran
Affiliation:
Department of Power Mechanical EngineeringNational Tsing Hua UniversityHsinchu, Taiwan
K. C. Wu
Affiliation:
Department of Power Mechanical EngineeringNational Tsing Hua UniversityHsinchu, Taiwan
K. N. Chiang*
Affiliation:
Department of Power Mechanical EngineeringNational Tsing Hua UniversityHsinchu, Taiwan
*
*Corresponding author (knchiang@pme.nthu.edu.tw)
Get access

Abstract

The effective lifetimes of electronic packages are affected by various thermos-mechanical deformations. Creep is considered the most salient mechanism in the failure of solder joints. Many researchers have conducted reasonable studies to portray the behavior of creep deformation using numerical models and further extended their research scope to forecast the lifetimes of packages with the results obtained from creep models. Many studies have identified particular creep and lifetime models to be nominal based on experimental data.

In this study, the characteristics of familiar creep models were examined in detail, and their significance was made known. Lifetime prediction models that seem prominent among researchers were discussed in detail. Finite element analysis of a wafer level chip-scale package (WLCSP) used to figure out the engagement of different creep models and their capability of materializing creep deformation was investigated via simulation. The results from the simulation were applied to different lifetime prediction models, and their predictions were examined carefully. After considering the various factors that affected the reliability study of the solders, the Garofalo-Arrhenius creep model and modified strain energy density model seemed to be convincingly productive for studying the reliability of various electronic packages.

Keywords

CreepLifetime predictionSteady-state creepModified energy density model
Type
Research Article
Information
Journal of Mechanics , Volume 34 , Issue 5 , October 2018 , pp. 637 - 643
Copyright
Copyright © The Society of Theoretical and Applied Mechanics 2018 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Darveaux, R., “Constitutive Relations for Tin-Based Solder Joints,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15, pp. 1013–1024 (1992).Google Scholar
2. Liu, D., Pons, D. J. and Wong, E. H., “Creep-Integrated Fatigue Equation for Metals,” International Journal of Fatigue, 98, pp. 167–175 (2017).Google Scholar
3. Ma, H., “Constitutive Models of Creep for Lead-Free Solders,” Journal of Materials Science, 44, pp. 3841–3851 (2009).Google Scholar
4. Garofalo, F., Fundamentals of Creep and Creep-Rupture in Metals, Macmillan Publishing (1965).Google Scholar
5. Anand, L., “Constitutive Equations for Hot-Working of Metals,” International Journal of Plasticity, 1, pp. 213–231 (1985).Google Scholar
6. Su, Y. F., Liang, S. Y. and Chiang, K. N., “Design and Reliability Assessment of Novel 3D-IC Packaging,” Journal of Mechanics, 33, pp. 193–203 (2017).Google Scholar
7. Darveaux, R., “Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction,” Journal of Electronic Packaging, 124, pp. 147–154 (2002).Google Scholar
8. Zhu, Y., Li, X., Wang, C. and Gao, R., “A New Creep-Fatigue Life Model of Lead-free Solder Joint,” Microelectronics Reliability, 55, pp. 1097–1100 (2015).Google Scholar
9. Lee, C. H., Wu, K. C. and Chiang, K. N., “A Novel Acceleration-Factor Equation for Packaging-Solder Joint Reliability Assessment at Different Thermal Cyclic Loading Rates,” Journal of Mechanics, 33, pp. 35–40 (2017).Google Scholar
10. Ma, H., “Constitutive Models of Creep for Lead-Free Solders,” Journal of Materials Science, 44, pp. 3841–3851 (2009).Google Scholar
11. Chen, X., Chen, G. and Sakane, M., “Prediction of Stress-Strain Relationship with An Improved Anand Constitutive Model for Lead-free Solder Sn-3.5Ag,” IEEE Transactions on Components and Packaging Technologies, 28, pp. 111–116 (2005).Google Scholar
12. Gu, Y. and Nakamura, T., “Interfacial Delamination and Fatigue Life Estimation of 3D Solder Bumps in Flip-Chip Packages,” Microelectronics Reliability, 44, pp. 471–483 (2004).Google Scholar
13. Lee, Y. and Basaran, C., “A Creep Model for Solder Alloys,” Journal of Electronic Packaging Laboratory, 113 (2011).Google Scholar
14. Amalu, E. H. and Ekere, N. N., “Modelling Evaluation of Garofalo-Arrhenius Creep Relation for Lead-Free Solder Joints in Surface Mount Electronic Component Assemblies,” Journal of Manufacturing Systems, 39, pp. 9–23 (2016).Google Scholar
15. Hasnine, M., Suhling, J. C., Prorok, B. C., Bozack, M. J. and Lall, P., “Anisotropic Mechanical Properties of SAC Solder Joints in Microelectronic Packaging and Prediction of Uniaxial Creep Using Nanoindentation Creep,” Experimental Mechanics, 57, pp. 603–614 (2017)Google Scholar
16. Fu, N. J., Suhling, J. C. and Lall, P., “Cyclic Stress-Strain Behavior of SAC305 Lead Free Solder: Effects of Aging, Temperature, Strain Rate, and Plastic Strain Range,” 66th ECTC, Las Vegas, NV (2016).Google Scholar
17. Benabou, L., Sun, Z., Pougnet, P. and Dahoo, P. R., “Continuum Damage Approach for Fatigue Life Prediction of Viscoplastic Solder Joints,” Journal of Mechanics, 31, pp. 525–531 (2015).Google Scholar
18. Wong, E. H., Van Driel, W. D., Dasgupta, A. and Pecht, M., “Creep Fatigue Models of Solder Joints: A Critical Review,” Microelectronics Reliability, 31, pp. 1–12 (2016).Google Scholar