Hostname: page-component-cd9895bd7-q99xh Total loading time: 0 Render date: 2024-12-28T05:17:54.204Z Has data issue: false hasContentIssue false
  • English
  • Français

Predicting Fatigue Initiation Life of Sn/3.8Ag/0.7Cu Solder using Endochronic Cyclic Damage-Coupled Viscoplastic Theory

Published online by Cambridge University Press:  05 May 2011

C. F. Lee  and
Z. H. Lee
C. F. Lee*
Affiliation:
Department of Engineering Science, National Cheng-Kung University, Tainan, Taiwan 70101, R.O.C.
Z. H. Lee*
Affiliation:
Department of Engineering Science, National Cheng-Kung University, Tainan, Taiwan 70101, R.O.C.
*
*Professor
**Graduate student
Get access

Abstract

This paper studied cyclic behavior Sn/3.8Ag/0.7Cu solder with dendritic microstructure. A cyclic damage factor D under constant strain amplitude fatigue tests, was defined by using the reducing rate of maximum cyclic tensile stress σa. The critical cyclic damage DC and it's fatigue initiation life NI were determined very consistently by using separately the experimental σavs. N curves and the percolation theory. The endochronic cyclic damage-coupled viscoplastic theory proposed by the 1st author was used to simulate cyclic stress-strain hysteresis loops with damage under strain amplitude (εa) 0.8% at 298K. The results were in very good agreement with data. Combining the evolution equation of intrinsic damage and the computed cyclic stress-inelastic strain relation, a modified Coffin-Manson relationship was derived. By setting DC = 0.3, it predicted very effectively the NI data under σa from 0.2% to 1.0%.

Keywords

Endochronic cyclic damage-coupled viscoplastic theoryEvolution equation of intrinsic damageSn/3.8Ag/0.7Cu solderCritical cyclic damageModified Coffin-Manson relationshipFatigue initiation life
Type
Articles
Information
Journal of Mechanics , Volume 24 , Issue 4 , December 2008 , pp. 369 - 377
Copyright
Copyright © The Society of Theoretical and Applied Mechanics, R.O.C. 2008

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1.Solomon, H. D., “Predicting Thermal and Mechanical Fatigue Lives from Isothermal Low Cycle Data,” Solder Joint Reliability, chap. 14, Lau, J.H., Ed., van No strand Reinhold, N. Y. pp. 406–454 (1991).CrossRefGoogle Scholar
2.Lau, J. H., Wong, C. P., Prince, J. L. and Nakayama, W., Electronic Packaging: Design, Materials, Process, and 376 Reliability, McGrawHill Comp., Inc. (1998).Google Scholar
3.Wei, Y., Chow, C. L., Vianco, P. and Fang, E., “Isothermal Fatigue Damage Model for Lead-Free Solder,” Int. J. Damage Mechanics, 15, pp. 109–119 (2006).CrossRefGoogle Scholar
4.Lee, C. F. and Shieh, T. J., “Theory of Endochronic Cyclic Viscoplasticity of Eutectic Tin/Lead Solder Alloy,” Journal of Mechanics, 22, pp. 181–191 (2006).CrossRefGoogle Scholar
5.Stolkarts, V., Keer, L. M. and Fine, M. E., “Damage Evolution Governed by Microcrack Nucleation with Application to the Fatigue of 63Sn-37Pb Solder,” J. Mech. Phys. Solids Packaging, 47, pp. 2451–2468 (1999).CrossRefGoogle Scholar
6.Kachanov, L. M., Introduction to Continuum Damage Mechanics, Kluwer Academic Publishers (1986).CrossRefGoogle Scholar
7.Rabotnov, Y. N., Creep Problems in Structural Members, North Holland Pub. Co. (1969).Google Scholar
8.Lee, C. F. and Chen, Y. C., “Thermodynamic Formulation of Endochronic Cyclic Viscoplasticity with Damage-Application to Eutectic Sn/Pb Solder Alloy,” Journal of Mechanics, 23, pp. 433–444 (2007).CrossRefGoogle Scholar
9.Zeng, Q., Wang, Z., Xian, A. and Shang, J., “Low Cycle Fatigue Behavior of Sn-3.8Ag-0.7Cu Lead-Free Solder,” Chinese J. Material Research, 18, pp. 11–17 (2004).Google Scholar
10.Shang, J. K., Zeng, Q. L., Zhang, L. and Zhu, Q. S., “Mechanical Fatigue of Sn-Rich Pb-Free Solder Alloys,” J. of Mater. Sci.: Mater. in Electron., 18, pp. 211–227(2007).Google Scholar
11.Lemaitre, J., A Course on Damage Mechanics, Springer-Verlag, Germany (1992).CrossRefGoogle Scholar
12.Lee, C. F., “Recent Finite Element Applications of the Incremental Endochronic Plasticity,” International Journal of Plasticity, 11, pp. 843–865 (1995).CrossRefGoogle Scholar