Hostname: page-component-cd9895bd7-dzt6s Total loading time: 0 Render date: 2024-12-28T16:53:33.265Z Has data issue: false hasContentIssue false

Simulation of Crack Propagation in Three-Point Bending Piezoelectric Beam Based on Three-Dimensional Anisotropic Piezoelectric Damage Mechanics

Published online by Cambridge University Press:  07 December 2011

X. H. Yang
Affiliation:
School of Civil Engineering and Mechanics, Huazhong University of Science and Technology, Wuhan 430074, China
W. Z. Cao*
Affiliation:
School of Civil Engineering and Mechanics, Huazhong University of Science and Technology, Wuhan 430074, China
X. B. Tian
Affiliation:
School of Civil Engineering and Mechanics, Huazhong University of Science and Technology, Wuhan 430074, China
*
**Ph.D candidate, corresponding author
Get access

Abstract

A finite element method combined with three-dimensional anisotropic piezoelectric continuum damage mechanics is presented to simulate quasi-static crack propagation behavior in piezoelectric ceramics in this paper. In this method, the three-dimensional anisotropic piezoelectric damage constitutive model is utilized for characterizing the effects of mechanical and electrical damages on the fields near the crack tip, the combined-damage from the dominant mechanical and electrical damage components is regarded as the fracture criterion, and the gradient of combined-damage is assumed to control crack growth direction. A set of numerical simulations of the midspan crack propagation in a three-point bending PZT-4 beam are performed in various loading conditions. After the numerical results are validated by comparison with the corresponding experimental ones, the effects of mechanical and electrical loads on the cracking be havior are respectively evaluated. It is found from the obtained results that mechanical and electrical loads influence on the damage fields in the vicinity of the crack-tip, as well as the crack growth rate, in a significant way. With the increment in mechanical loading, the crack growth rate obviously increases. This means that positive and negative electric fields enhance and inhibit crack propagation, respectively.

Type
Articles
Copyright
Copyright © The Society of Theoretical and Applied Mechanics, R.O.C. 2011

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Park, S. B. and Sun, C. T., “Fracture Criteria of Piezoelectric Ceramics,” Journal of the American Ceramic Society, 78, pp. 14751480 (1995).CrossRefGoogle Scholar
2.Pak, Y. E., “Crack Extension Force in a Piezoelectric Material,” Transactions ASME Journal of Applied Mechanics, 57, pp. 647653 (1990).CrossRefGoogle Scholar
3.Pak, Y. E., “Linear Electro-Elastic Fracture Mechanics of Piezoelectric Materials,” International journal of Fracture, 54, pp. 79100 (1992).Google Scholar
4.Sosa, H. and Pak, Y. E., “Three-Dimensional Eigenfunction Analysis of a Crack in a Piezoelectric Material,” International Journal of Solids and Structures, 26, pp. 115 (1990).Google Scholar
5.Sosa, H., “Plane Problems in Piezoelectric Media with Defects,” International Journal of Solids and Structures, 28, pp. 491505 (1991).Google Scholar
6.Sosa, H., “On the Fracture Mechanics of Piezoelectric Solids,” International Journal of Solids and Structures, 29, pp. 26132622 (1992).CrossRefGoogle Scholar
7.Suo, Z., Kuo, C. M., Barnett, D. M. and Willis, J. R., “Fracture Mechanics for Piezoelectric Ceramics,” Journal of Mechanics and Physics of Solids, 40, pp. 739765 (1992).Google Scholar
8.Heyer, V., Schneider, G. A., Balke, H., Drescher, J. and Bahr, H. A., “A fracture Criterion for Conducting Cracks in Homogeneously Poled Piezo electric PZT-PIC 151 Ceramics,” Acta Materialia, 46, pp. 66156622 (1998).CrossRefGoogle Scholar
9.Gao, H., Zhang, T. Y. and Tong, P., “Local and Global Energy Release Rates for an Electrically Yielded Crack in a Piezoelectric Ceramic,” Journal of Mechanics and Physics of Solids, 45, pp. 491510 (1997).CrossRefGoogle Scholar
10.Zhang, T. Y., Zhao, M. H. and Liu, G. N., “Failure Behavior and Failure Criterion of Conductive Cracks (Deep Notches) in Piezoelectric Ceramics I – The Charge-Free Zone Model,” Acta Materialia, 52, pp. 20132024 (2004).Google Scholar
11.Zhang, T. Y. and Gao, C. F., “Fracture Behaviors of Piezoelectric Materials,” Theoretical and Applied Fracture Mechanics, 41, pp. 339379 (2004).CrossRefGoogle Scholar
12.Yu, S. W. and Qin, Q. H., “Damage Analysis of Thermopiezoelectric Properties: Part II – Effective Crack Model,” Theoretical and Applied Fracture Mechanics, 25, pp. 279288 (1996).Google Scholar
13.Qin, Q. H., Mai, Y. W. and Yu, S. W., “Some Problems in Plane Thermopiezoelectric Materials with Holes,” International Journal of Solids and Structures, 36, pp. 427439 (1999).Google Scholar
14.Qin, Q. H. and Yu, S. W., “Effective Moduli of Piezoelectric Material with Microcavities,” International Journal of Solids and Structures, 35, pp. 50855095 (1998).Google Scholar
15.Wu, T. L., “Micromechanics Determination of Electroelastic Properties of Piezoelectric Materials Containing Voids,” Materials Science and Engineering A, 280, pp. 320327 (2000).Google Scholar
16.Li, Z. H., Wang, C. and Chen, C. Y., “Effective Electromechanical Properties of Transversely Isotropic Piezoelectric Ceramics with Microvoids,” Computational Materials Science, 27, pp. 381392 (2003).CrossRefGoogle Scholar
17.Mizuno, M., “Constitutive Equation of Piezoelectric Ceramics Taking Into Account Damage Development,” Key Engineering Materials, 233–236, pp. 8994 (2002).Google Scholar
18.Yang, X. H., Chen, C. Y. and Hu, Y. T., “Analysis of Damage Near a Conducting Crack in a Piezoelectric Ceramic,” Acta Mechanica Solida Sinica, 16, pp. 147154 (2003).Google Scholar
19.Shen, S. and Nishioka, T., “Fracture of Piezoelectric Materials: Energy Density Criterion,” Theoretical and Applied Fracture Mechanics, 33, pp. 5765 (2000).Google Scholar
20.Sih, G. C. and Zuo, J. Z., “Multiscale Behavior of Crack Initiation and Growth in Piezoelectric Ceramics,” Theoretical and Applied Fracture Mechanics, 34, pp. 123141 (2000).Google Scholar
21.Zuo, J. Z. and Sih, G. C., “Energy Density Theory Formulation and Interpretation of Cracking Behavior for Piezoelectric Ceramics,” Theoretical and Applied Fracture Mechanics, 34, pp. 1733 (2000).CrossRefGoogle Scholar
22.Fang, D. N., Zhang, Z. K., Soh, A. K. and Lee, K. L., “Fracture Criteria of Piezoelectric Ceramics With Defects,” Mechanics of Materials, 36, pp. 917928 (2004).CrossRefGoogle Scholar
23.Yang, X. H., Chen, C. Y., Hu, Y. T. and Wang, C., “Combined Damage Facture Criteria for Piezoelectric Ceramics,” Acta Mechanica Solida Sinica, 18, pp. 2127 (2005).Google Scholar
24.Yang, X. H., Dong, L., Chen, C. Y., Wang, C. and Hu, Y. T., “Damage Extension Forces and Piezo electric Fracture Criteria,” Journal of Mechanics, 20, pp. 277283 (2004).Google Scholar
25.Mizuno, M. and Honda, Y., “Simplified Analysis of Steady-State Crack Growth of Piezoelectric Ceramics Based on the Continuum Damage Mechanics,” Acta Mechanica, 179, pp. 157168 (2005).CrossRefGoogle Scholar
26.Yang, X. H., Chen, C. Y., Hu, Y. T. and Wang, C., “Damage Analysis and Fracture Criteria for Piezoelectric Ceramics,” International Journal of Non-Linear Mechanics, 40, pp. 12041213 (2005).Google Scholar
27.Yang, X. H., Dong, L., Wang, C., Chen, C. Y. and Hu, Y. T., “Transversely Isotropic Damage Around Conducting Crack-Tip in Four-Point Bending Piezoelectric Beam,” Applied Mathematics and Mechanics, 26, pp. 431440 (2005).Google Scholar
28.Tobin, A. G. and Pak, Y. E., “Effect of Electric Fields on Fracture Behavior of PZT Ceramics,” Proceedings of SPIE — The International Society for Optical Engineering, 1916, pp. 7886 (1993).Google Scholar