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Simulation of Wire Bonding Process Using Explicit Fem with Ale Remeshing Technology

Published online by Cambridge University Press:  02 December 2019

C. C. Yang ,
Y. F. Su ,
Steven Y. Liang  and
K. N. Chiang Open the ORCID record for K. N. Chiang [Opens in a new window]
C. C. Yang
Affiliation:
Dept. of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan, R.O.C.
Y. F. Su
Affiliation:
Dept. of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan, R.O.C.
Steven Y. Liang
Affiliation:
Georgia Institute of Technology, George W Woodruff School of Mechanical Engineering, Atlanta, USA
K. N. Chiang*
Affiliation:
Dept. of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan, R.O.C.
*
*Corresponding author (knchiang@pme.nthu.edu.tw)
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Abstract

Thermosonic wire bonding is a common fabrication process for connecting devices in electronic packaging. However, when the free air ball (FAB) is compressed onto the I/O pad of the chip during bonding procedure, chip cracking may occur if the contact pressure is too large. This study proposes an effective simulation technique that can predict the wire ball geometry after bonding in an accurate range. The contact force obtained in the simulation can be used for possible die cracking behavior evaluation. The simulation in this study used the explicit time integration scheme to deal with the time marching problem, and the second-order precision arbitrary Lagrangian-Eulerian (ALE) algorithm was used to deal with the large deformation of the wire ball during the bonding process. In addition, the equilibrium smoothing algorithm in LS-DYNA can make the contact behavior and geometry of the bonding wire almost the same as the experiment, which can also significantly reduce the distortion of the mesh geometry after remeshing.

Keywords

Wire Bondingelectronic packagingArbitrary Lagrangian-Eulerian (ALE)contact forceexplicit time integrationLS-DYNA
Type
Articles
Information
Journal of Mechanics , Volume 36 , Issue 1 , February 2020 , pp. 47 - 54
Copyright
Copyright © 2019 The Society of Theoretical and Applied Mechanics 

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References

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