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Thermal Performance of Cooling Enhancement of Miniature Flat Plate Heat Pipe Under Different Angle

Published online by Cambridge University Press:  08 September 2015

J.-S. Chen*
Affiliation:
Department of Engineering Science, National Cheng Kung University, Tainan, Taiwan
J.-H. Chou
Affiliation:
Department of Engineering Science, National Cheng Kung University, Tainan, Taiwan
*
* Corresponding author (shun.chen0727@gmail.com)
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Abstract

The possibility of cooling enhancement of flat plate heat pipes (FPHPs) by tilting was examined experimentally in this study. All of the FPHPs were made of Al and were partially filled with acetone. They had the same size of 120 mm (length) by 36 mm (width) by 2.5 mm (thickness) and the same liquid filling ratio of 25.1%. The effects of six tilting angles of -30°, -15°, -10°, 0°, 45°, and 90° were explored. The results showed that the thermal resistance decreased and the effective thermal conductivity increased when the tilting angle was increased. By increasing the tilting angle from 0° to 45° and further to 90°, the maximum effective thermal conductivity increased by a factor of 1.205 from 4561 W/mK to 5497 W/mK and of 1.212 to 5530 W/mK, respectively. The corresponding maximum heat transport capability increased by a factor of 2.89 from 39.8 W to 115 W and of 3.27 to 130 W. Hence, by proper tilting into positve angles, cooling enhancement of the FPHPs can be greatly achieved.

Type
Research Article
Copyright
Copyright © The Society of Theoretical and Applied Mechanics, R.O.C. 2016 

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References

1.Wang, Y. X. and Peterson, G. P., “Analysis of Wire-bonded Micro Heat Pipe Arrays,” Journal of Ther-mophysics and Heat Transfer, 16, pp. 346355 (2002).Google Scholar
2.Chien, L. H. and Shih, Y.C.An Experimental Study of Mesh Type Flat Heat Pipes,” Journal of Mechanics, 27, pp. 167176 (2011).Google Scholar
3.Lefevre, F., Conrardy, J.-B., Raynaud, M. and Bon-jour, J., “Experimental Investigations of Flat Plate Heat Pipes with Screen Meshes or Grooves Covered with Screen Meshes as Capillary Structure,” Applied Thermal Engineering, 37, pp. 95102 (2012).Google Scholar
4.Wang, S. F., Chen, J. J., Hu, Y. X. and W., Zhang, “Effect of Evaporation Section and Condensation Section Length on Thermal Performance of Flat Plate Heat Pipe,” Applied Thermal Engineering, 31, pp. 23672373 (2011).Google Scholar
5.Longtin, J. P., Badran, B. and Gerner, F. M., “A One-dimensional Model of a Micro-heat Pipe During Steady-state Operation,” Journal of Heat Transfer-Transactions of the ASME, 116, pp. 709715 (1994).CrossRefGoogle Scholar
6.Rulliere, R., Lefevre, F. and Lallemand, M., “Prediction of the Maximum Heat Transfer Capability of Two-phase Heat Spreaders-Experimental validation,” International Journal of Heat and Mass Transfer, 50, pp. 12551262 (2007).Google Scholar
7.Lefevre, F., Rulliere, R., Lips, S. and Bonjour, J., “Confocal Microscopy for Capillary Film Measurements in a Flat Plate Heat Pipe,” Journal of Heat Transfer-Transactions of the ASME, 132, pp. 16 (2010).Google Scholar
8.Lips, S., Lefevre, F. and Bonjour, J., “Combined Effects of the Filling Ratio and the Vapour Space Thickness on the Performance of a Flat Plate Heat Pipe,” International Journal of Heat and Mass Transfer, 53, pp. 694702 (2010).Google Scholar
9.Lefèvre, F., Lips, S. and Bonjour, J., “Investigation of Evaporation and Condensation Processes Specific to Grooved Flat Heat Pipes,” Frontiers in Heat Pipes, 1, pp. 18 (2010).Google Scholar
10.Lefevre, F., Rulliere, R., Pandraud, G. and Lallemand, M., “Prediction of the Temperature Field in Flat Plate Heat Pipes with Micro-grooves-Experimental Validation,” International Journal of Heat and Mass Transfer, 51, pp. 40834094 (2008).CrossRefGoogle Scholar
11.Lips, S., Lefevre, F. and Bonjour, J., “Physical Mechanisms Involved in Grooved Flat Heat Pipes: Experimental and Numerical Analyses,” International Journal of Thermal Sciences, 50, pp. 12431252 (2011).Google Scholar
12.Fan, C. L., Sun, F. R., Yang, L., Chen, L. G., Qu, W. and Ma, T. Z., “Experimental Investigation of Flat Miniature Heat Pipes with Three Kinds of Micro Grooves,” Journal of Enhanced Heat Transfer, 11, pp. 467475 (2004).Google Scholar
13.Gao, M., Cao, Y., Beam, J. E. and Donovan, B., “Structural Optimization of Axially Grooved Flat Miniature Heat pipes,” Journal of Enhanced Heat Transfer, 7, pp. 361369 (2000).Google Scholar
14.Boukhanouf, R., Haddad, A., North, M. T. and Buffone, C., “Experimental Investigation of a Flat Plate Heat Pipe Performance Using IR Thermal Imaging Camera,” Applied Thermal Engineering, 26, pp. 21482156 (2006).Google Scholar
15.Chen, J.-S. and Chou, J.-H., “Cooling Performance of Flat Plate Heat Pipes with Different Liquid Filling Ratios,” International Journal of Heat and Mass Transfer, 77, pp. 874882 (2014).Google Scholar
16.Sonan, R., Harmand, S., Pelle, J., Leger, D. and Fakes, M., “Transient Thermal and Hydrodynamic Model of Flat Heat Pipe for the Cooling of Electronics Components,” International Journal of Heat and Mass Transfer, 51, pp. 60066017 (2008).CrossRefGoogle Scholar
17.Harmand, S., Sonan, R., Fakes, M. and Hassan, H., “Transient Cooling of Electronic Components by Flat Heat Pipes,” Applied Thermal Engineering, 31, pp. 18771885 (2011).CrossRefGoogle Scholar