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Following is a list of microscopy-related meetings and courses. The
editors would greatly appreciate input to this list via the electronic
submission form found in the MSA World-Wide Web page at http://www.msa.microscopy.com. We will gladly
add hypertext links to the notice on the web and insert a listing of the
meeting in the next issue of the Journal. Send comments and questions to
Nestor Zaluzec, zaluzec@aaem.amc.anl.gov.
WELCOME! On behalf of the Microscopy Society of America (MSA), the
Microbeam Analysis Society (MAS), the International Metallographic Society
(IMS), and the Microscopy Society of Canada/Société de
Microscopie du Canada (MSC/SMC), we invite scientists throughout the
world who develop and use microscopy to the jointly-sponsored Microscopy
and Microanalysis 2006 meeting in Chicago, Illinois. The meeting will take
place from July 30 through August 3, 2006. The venue for the meeting is
the exciting, and popular Navy Pier. The Program Committee, chaired by
Paul Kotula, has arranged a unique series of symposia and tutorials
covering both instrumentation and applications development as well as
sessions illustrating the practical uses of these developments in the
biological and physical sciences. As you look through this booklet, we
think you will agree that the Program Committee has put together a program
that will excite microscopists in all fields. The program features two
named Symposia. The first will be on “Cell Biology and
Microscopy” and is dedicated to the memory of Hans Ris and the
second will cover “Quantitative X-ray Microanalysis” and
honors Art Chodos. The program also has sessions celebrating the 50th
Anniversary of the Observation of Dislocations and the 50th Anniversary of
X-ray Mapping. Of course, an essential aspect of the scientific program is
your vital contributed paper! We encourage you to contribute your work for
presentation as part of this exciting program.
MODERN DEVELOPMENTS AND APPLICATIONS IN MICROBEAM
ANALYSIS
Deposition of Ti/N compositionally gradient film onto Ti-6Al-4V
alloy substrates was carried out by reactive DC sputtering, not only to
improve the blood compatibility of the alloy but also to relax the stress
concentrated at the interface between the film and the alloy substrate.
The compositional gradient was realized by varying continuously the
nitrogen content in Ar-N2 sputter gas during deposition. In
Auger electron spectroscopy (AES) analysis, Auger spectra were acquired in
the N(E) mode using the beam brightness modulation (BBM) method to
overcome the problem of the peak overlap of the principal Auger nitrogen
transition peak (N-KLL) with one of titanium peaks (Ti-LMM). The deposited
film appeared to be uniform and adhesive. TiN formation at the surface of
the film was assumed, because of its yellow gold color and the X-ray
diffraction (XRD) pattern for it. Under scanning electron microscopy, it
was found that the surface had fine particles dispersed on a smooth
accumulated deposit and that this depositing method improved the
structural property of the film at the surface. According to AES in-depth
profiles, the nitrogen (N) concentration in the film gradually decreased
in the depth direction from the surface toward the alloy, confirming that
a Ti/N compositionally gradient film had formed on the alloy
substrate.