Hostname: page-component-cd9895bd7-dzt6s Total loading time: 0 Render date: 2024-12-27T09:18:49.339Z Has data issue: false hasContentIssue false
  • English
  • Français

Influence of deposition parameters on the residual stresses of WC-Wo sputtered thin films

Published online by Cambridge University Press:  20 February 2020

R.R. Phiri ,
O.P. Oladijo  and
E.T. Akinlabi
R.R. Phiri*
Affiliation:
Department of Chemical, Materials and Metallurgical Engineering, Botswana International University of Science and Technology, Palapye, Botswana
O.P. Oladijo
Affiliation:
Department of Chemical, Materials and Metallurgical Engineering, Botswana International University of Science and Technology, Palapye, Botswana Department of Mechanical Engineering Science, University of Johannesburg, Auckland Park, Kingsway Campus, Johannesburg, South Africa
E.T. Akinlabi
Affiliation:
Department of Mechanical Engineering Science, University of Johannesburg, Auckland Park, Kingsway Campus, Johannesburg, South Africa
*
*(Email: resego.phiri@studentmail.biust.ac.bw)
Get access

Abstract

Control and manipulation of residual stresses in thin films is a key for attaining coatings with high mechanical and tribological performance. It is therefore imperative to have reliable residual stress measurements methods to further understand the dynamics involved. The sin2ψ method of X-ray diffraction was used to investigate the residual stresses on the tungsten carbide cobalt thin films deposited on a mild steel surface to understand the how the deposition parameters influence the generation of residual stresses within the substrate surface. X-ray spectra of the surface revealed an amorphous phase of the thin film therefore the stress measured was of the substrate surface and the effects of sputtering parameters on residual stress were analysed. Compressive stresses were identified within all samples studied. The results reveal that as the sputtering parameters are varied, the residual stresses also change. Optimum deposition parameters in terms of residual stresses were suggested.

Keywords

x-ray diffraction (XRD)thin filmsputtering
Type
Articles
Information
MRS Advances , Volume 5 , Issue 23-24: African Materials Research Society 2019 , 2020 , pp. 1215 - 1223
Check for updates
Copyright
Copyright © Materials Research Society 2020

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

Parker, D. S., “Defense Technical Information Center Compilation Part Notice Coatings on High Strength Steel,” 2003.Google Scholar
York, B. R., “Residual Stress/Strain Analysis in Thin Films by X-ray Diffraction,” Crit. Rev. Solid State Mater. Sci., vol. 20, no. 2, pp. 125–177, 1995.Google Scholar
Waters, P., “Stress analysis and mechanical characterization of thin films for microelectronics and MEMS applications,” no. 2008, pp. 1–215, 2008.Google Scholar
Vlassak, J., “Thin Film Mechanics,” Harvard Univ., 2004.Google Scholar
Withers, P. J. J. and Bhadeshia, H. K. D. H. K. D. H., “Residual stress Part 1 – Measurement techniques,” Mater. Sci. Technol., vol. 17, no. 4, pp. 355–365, 2001.CrossRefGoogle Scholar
Stoney, G. G., “The Tension of Metallic Films Deposited by Electrolysis,” Proc. R. Soc. A Math. Phys. Eng. Sci., vol. 82, no. 553, pp. 172–175, 1909.Google Scholar
Chason, E. and Guduru, P. R., “Tutorial: Understanding residual stress in polycrystalline thin films through real-time measurements and physical models,” J. Appl. Phys., vol. 119, no. 19, 2016.CrossRefGoogle Scholar
Zaroog, O. S., Yap, C., Ken, W., Noorlina, A., and Manap, A., “Current and Challenge of Residual Stress Measurement Techniques,” Int. J. Sci. Res. , vol. 3, no. 9, pp. 2319–7064, 2012.Google Scholar
Uses, G., Applications, E. O. F., Time, E. A., Of, C., and Techniques, R., “X-Ray Diffraction Residual Stress Techniques,” Mater. Charact., pp. 380–392, 2018,Google Scholar
Prevéy, P. S. and Research, L., “Current Applications of X-Ray Diffraction Residual Stress Measurement,” Dev. Mater. Charact. Technol., no. 513, pp. 103–110, 1996.Google Scholar
Prevéy, P. S., “Problems with non-destructive surface x-ray diffraction residual stress measurement,” Shot Peen., no. 513, pp. 47–54, 1992.Google Scholar
Hu, Z. Q., Amorphous Materials, no. c. Elsevier B.V., 2011.CrossRefGoogle Scholar
Lee, Y. H. and Kwon, D., “Estimation of biaxial surface stress by instrumented indentation with sharp indenters,” Acta Mater., vol. 52, no. 6, pp. 1555–1563, 2004.CrossRefGoogle Scholar
Engwall, A. M., Rao, Z., and Chason, E., “Origins of residual stress in thin films: Interaction between microstructure and growth kinetics,” Mater. Des., vol. 110, pp. 616–623, 2016.CrossRefGoogle Scholar
Mani, A., Aubert, P., Mercier, F., Khodja, H., Berthier, C., and Houdy, P., “Effects of residual stress on the mechanical and structural properties of TiC thin films grown by RF sputtering,” Surf. Coatings Technol., 2005.CrossRefGoogle Scholar
Presser, V. and Nickel, K. G., “Critical Reviews in Solid State and Materials Sciences Silica on Silicon Carbide,” no. January 2014, pp. 37–41, 2008.Google Scholar
Thornton, J. A. and Hoffman, D. W., “Internal stresses in titanium, nickel, molybdenum, and tantalum films deposited by cylindrical magnetron sputtering,” J. Vac. Sci. Technol., vol. 14, no. 1, pp. 164–168, 1977.CrossRefGoogle Scholar