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Low Temperature Soldering Surface-Mount Electronic Components with Hydrogen Assisted Copper Electroplating

Published online by Cambridge University Press:  02 January 2018

Sabrina M. Rosa-Ortiz ,
Kishore Kumar Kadari  and
Arash Takshi
Sabrina M. Rosa-Ortiz
Affiliation:
Department of Electrical Engineering, University of South Florida, Tampa, FL33620, U.S.A.
Kishore Kumar Kadari
Affiliation:
Department of Electrical Engineering, University of South Florida, Tampa, FL33620, U.S.A.
Arash Takshi*
Affiliation:
Department of Electrical Engineering, University of South Florida, Tampa, FL33620, U.S.A.
*
*(Email: atakshi@usf.edu)
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Abstract

Copper growth for the development of electroplating technique as a low-temperature soldering procedure represents a useful method for the formation of metal deposits, allowing modification of the thickness and morphology of the soldering joints. The approach is particularly useful for soldering electronic components to a plastic 3D printed substrate. To accelerate the soldering process hydrogen assisted electroplating (HAE) method was employed at room temperature. The experiments were designed by making a small electrochemical cell around the gap on a printed circuit board (PCB) or a 3D printed conductive track. During the experiment, water electrolysis was observed, which released hydrogen bubbles. The hydrogen bubbles caused the structure of the electroplated layer to be more porous, but with a similar conductivity as solid copper and a remarkable mechanical strength suitable for use as interconnects on an electronic circuit. Our electrochemical data and video recorded images show a fast and reliable copper electrodeposition in less than 1 minute. The morphology of copper deposits on a 3D printed structure was studied with the scanning electron microscopy (SEM). A reliable soldering process was demonstrated for a surface mount light emitting diode (LED) on a PCB. Further experiments are required to optimize the soldering process for faster and more reliable electroplating, particularly for 3D printed substrates.

Keywords

electrodepositionscanning electron microscopy (SEM)devices
Type
Articles
Information
MRS Advances , Volume 3 , Issue 18: Processing and Manufacturing , 2018 , pp. 963 - 968
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Copyright
Copyright © Materials Research Society 2017 

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References

REFERENCES

Ainsworth, J., Disher, D., and Morreal, D. (2015).Google Scholar
Rojas-Nastrucci, E.A., Snider, A.D., and Weller, T.M.. IEEE Transactions on Microwave Theory and Techniques, 64(11): p. 3460–3468. (2016).CrossRefGoogle Scholar
Ready, S., Endicott, F., Whiting, G.L., Ng, T.N., Chow, E.M. and Lu, J.P.. NIP & Digital Fabrication Conference. (2013)Google Scholar
Lee, H.H., Chou, K.S. and Huang, K.C.. Nanotechnology, 16(10), p.2436–2441. (2005).Google Scholar
Leigh, S.J., Bradley, R.J., Pursell, C.P., Billson, D.R. and Hutchins, D.A.. J. Plos One, 7(11). (2012)Google Scholar
Nikolic, N.D., Pavlovic, Lj. J., Pavlovic, M.G., and Popov, K. I.. Electrochimica Acta vol. 52 (2007), p. 8096–8104Google Scholar
Miura, S. and Honma, H.. Surface & Coating Technology, vol. 169-170, p. 91–95. (2013)Google Scholar
Bard, A.J., and Faulkner, L.R.: ‘Electrochemical Methods Fundamentals and Applications’. (John Wiley Publishers, New York, 2001)Google Scholar
Kumar, T.N., Kulkarni, M., Ravuri, M., Elangovan, K. and Kannan, S.. J. Future Engineering and Technology, 10, (3), p. 29. (2015)Google Scholar