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Synthesis and Thermal Analysis of Vertically Aligned CNTs Grown on Copper Substrates

Published online by Cambridge University Press:  29 August 2017

Qiuhong Zhang  and
Levi Elston
Qiuhong Zhang*
Affiliation:
University of Dayton Research Institute (UDRI), Dayton, OH 45469, USA
Levi Elston
Affiliation:
Air Force Research Laboratory (AFRL), WPAFB, OH 45433, USA
*
*(Email: qiuhong.zhang.3.ctr@us.af.mil)
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Abstract

Due to the low degree of contact area and weak interfacial adhesion between CNTs and the growth substrate (Cu), large thermal contact resistance is the largest challenge preventing the use of vertically aligned CNTs (VACNTs) as a thermal interface material (TIM). Although significant research has been done regarding the growth of CNTs on reactive substrates by using an appropriate buffer layer in this group’s previous work, there are many unanswered questions associated with using VACNTs as a thermal interface material beyond synthesis. This effort extends prior work on carbon nanotube growth, by concentrating on ways to evaluate/measure CNT-based nanocomposite thermal resistance. In this study, with the use of a laser flash measurement system, the influence of CNT array properties (layer height and density) on the thermal diffusivity and thermal resistance of the CNT composite were investigated. Test results identify a correlation between the CNT array density/thickness and its thermal resistance.

Keywords

Cuchemical vapor deposition (CVD) (deposition)thermal conductivity
Type
Articles
Information
MRS Advances , Volume 2 , Issue 58-59: Nanomaterials , 2017 , pp. 3657 - 3662
Copyright
Copyright © Materials Research Society 2017 

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