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Advanced microelectromechanical systems-based nanomechanical testing: Beyond stress and strain measurements

Published online by Cambridge University Press:  11 June 2019

Sanjit Bhowmick
Affiliation:
Bruker Nano Inc., USA; sanjit.bhowmick@gmail.com
Horacio Espinosa
Affiliation:
McCormick School of Engineering and Applied Sciences, Northwestern University, USA; espinosa@northwestern.edu
Katherine Jungjohann
Affiliation:
Center for Integrated Nanotechnologies, USA; kljungj@sandia.gov
Thomas Pardoen
Affiliation:
Institute of Mechanics, Materials and Civil Engineering, Universite Catholique de Louvain, Belgium; thomas.pardoen@uclouvain.be
Olivier Pierron
Affiliation:
Woodruff School of Mechanical Engineering, Georgia Institute of Technology, USA; olivier.pierron@me.gatech.edu
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Abstract

The field of in situ nanomechanics is greatly benefiting from microelectromechanical systems (MEMS) technology and integrated microscale testing machines that can measure a wide range of mechanical properties at nanometer scales, while characterizing the damage or microstructure evolution in electron microscopes. This article focuses on the latest advances in MEMS-based nanomechanical testing techniques that go beyond stress and strain measurements under typical monotonic loadings. Specifically, recent advances in MEMS testing machines now enable probing key mechanical properties of nanomaterials related to fracture, fatigue, and wear. Tensile properties can be measured without instabilities or at high strain rates, and signature parameters such as activation volume can be obtained. Opportunities for environmental in situ nanomechanics enabled by MEMS technology are also discussed.

Type
Advances in In situ Nanomechanical Testing
Copyright
Copyright © Materials Research Society 2019 

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